公开(公告)号：US20040241904A1

公开(公告)日：2004-12-02

申请号：US10855557

申请日：2004-05-28

Applicant: LG Electronics Inc.

Inventor： Kwang-Tae Lee ,  Sung-Gue Lee ,  Sang-Hyuck Nam ,  Sung-Ho Youn ,  Young-Kyu Lee

IPC: H01L021/44 ,  H05K003/02 ,  G03C001/725

CPC classification number: H05K3/28 ,  H05K3/243 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/025 ,  H05K2203/0577 ,  Y10T29/49155

Abstract: A method for manufacturing a printed circuit board includes: forming inner circuit patterns in an insulating material in multi-layers, forming a plurality of through holes at certain portions of the insulating material, and forming an outer circuit pattern which is electrically connected to the inner circuit pattern, at an inner circumferential surface of the through hole and the surface of the insulating material, and a terminal portion; forming a first photo solder resist layer at an entire surface of the insulating material and an entire surface of the outer circuit pattern, and exposing the terminal portion by removing a specific portion of the first photo solder resist layer; abrading the surface of the first photo solder resist layer; printing a second photo solder resist layer at the surface of the first photo solder resist layer, and exposing the terminal portion to the outside by removing a specific portion of the second photo solder resist layer; and forming a pad portion by plating the surface of the exposed terminal portion with gold, and electrically connecting the pad portion and the terminal portion.

Abstract translation: 印刷电路板的制造方法包括：在多层绝缘材料中形成内部电路图案，在绝缘材料的某些部分形成多个通孔，并形成外部电路图形，该外部电路图形与内部 在通孔的内周面和绝缘材料的表面上形成电路图形，以及端子部分; 在所述绝缘材料的整个表面和所述外部电路图案的整个表面上形成第一光阻焊层，并且通过去除所述第一光阻焊层的特定部分来暴露所述端子部分; 研磨第一光阻焊层的表面; 在第一光阻焊层的表面上印刷第二光阻焊层，并通过去除第二光阻焊层的特定部分将端子部分暴露于外部; 以及通过用暴露的端子部分的表面镀金形成焊盘部分，并且电连接焊盘部分和端子部分。

公开(公告)号：US20040213912A1

公开(公告)日：2004-10-28

申请号：US10709138

申请日：2004-04-15

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kei MURAYAMA

IPC: B05D001/36

CPC classification number: H05K3/244 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1635 ,  C23C18/1651 ,  C23C18/1889 ,  C23C18/208 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  H05K2201/0761 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/0796

Abstract: An electroless plating method of the present invention includes the steps of preparing a substrate having an insulating body and a conductive pattern formed thereon, adhering a catalytic metal serving as a catalyst of an electroless plating onto the insulating body and the conductive pattern, forming selectively a protection film or an oxidizing agent used to oxidize the catalytic metal on the catalytic metal in a space portion between the conductive pattern, and forming selectively a metal layer on the conductive pattern by the electroless plating.

Abstract translation: 本发明的无电镀方法包括以下步骤：制备具有绝缘体和形成在其上的导电图案的基板，将用作化学镀的催化剂的催化金属粘附到绝缘体和导电图案上，选择性地形成 保护膜或氧化剂，用于氧化催化金属上的导电图案之间的空间部分中的催化金属，并通过无电镀选择性地形成导电图案上的金属层。

公开(公告)号：US20040145858A1

公开(公告)日：2004-07-29

申请号：US10713572

申请日：2003-11-12

Inventor： Kazuaki Sakurada

IPC: B05D005/12 ,  H02B001/00

CPC classification number: H05K3/4664 ,  H01L2224/11 ,  H01L2924/12044 ,  H05K1/0269 ,  H05K3/0005 ,  H05K3/125 ,  H05K3/4647 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A multilayer circuit board and a manufacturing method for producing the board via simple manufacturing processes employing a droplet jetting method, where the inter-layer insulating film can be easily made flat. The multilayer circuit board includes at least two wiring layers, an inter-layer insulating film provided between every adjacent two of the wiring layers, and conductive posts for providing electrical conductivity between the wiring layers. The manufacturing method includes the step of forming the inter-layer insulating film by changing the film thickness of the inter-layer insulating film according to a concavo-convex shape of an area where the inter-layer insulating film is formed, so as to level an upper surface of the inter-layer insulating film. The concavo-convex shape may be computed based on design data of a circuit pattern for forming the wiring layers and the conductive posts, or may be measured before the inter-layer insulating film is formed.

Abstract translation: 一种多层电路板和通过使用液滴喷射方法的简单制造工艺制造该板的制造方法，其中层间绝缘膜可以容易地变平坦。 多层电路板包括至少两个布线层，设置在每个相邻的两个布线层之间的层间绝缘膜，以及用于在布线层之间提供导电性的导电柱。 制造方法包括通过根据形成层间绝缘膜的区域的凹凸形状改变层间绝缘膜的膜厚而形成层间绝缘膜的步骤， 层间绝缘膜的上表面。 可以基于用于形成布线层和导电柱的电路图案的设计数据来计算凹凸形状，或者可以在形成层间绝缘膜之前测量凹凸形状。

公开(公告)号：US20040134875A1

公开(公告)日：2004-07-15

申请号：US10719897

申请日：2003-11-21

Applicant: KYOCERA CORPORATION

Inventor： Norimitsu Fukami ,  Shuichi Tateno ,  Seiichiro Hirahara ,  Akira Imoto

IPC: H01B013/00

CPC classification number: H05K1/162 ,  H01L21/4857 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K3/0023 ,  H05K3/20 ,  H05K3/207 ,  H05K3/4614 ,  H05K3/4629 ,  H05K3/4697 ,  H05K2201/0108 ,  H05K2201/0187 ,  H05K2201/09881 ,  H05K2203/0156 ,  H05K2203/0551 ,  H01L2924/00014

Abstract: A method of producing a circuit-parts sheet having a structure in which a light-nontransmitting circuit-forming pattern is secured in a photo-cured ceramic sheet and is exposed on both surfaces of said photo-cured ceramic sheet, comprising the steps of: (a) forming the light-nontransmitting conductor pattern on the surface of a light-transmitting film; (b) forming a photo-curable ceramic coating layer by applying a photo-curable slurry onto the surface of the film on which said conductor pattern is formed; (c) forming a photo-cured ceramic sheet by photo-curing said photo-curable ceramic coating layer by the irradiation with light from the back surface of said film; (d) removing uncured portions of said photo-curable ceramic coating layer by using a developing solution; and (e) peeling off said carrier film. Use of this circuit-parts sheet makes it possible to produce a multi-layer circuit board simultaneously satisfying both the requirement for decreasing the thickness of the insulating layers and the requirement of increasing the thickness of the wiring conductor layers.

Abstract translation: 一种制造电路部件片的方法，其具有在光固化陶瓷片中固定光不发光电路形成图案并露出在所述光固化陶瓷片的两个表面上的结构，包括以下步骤： （a）在透光膜的表面上形成光不发光导体图案; （b）通过在其上形成有所述导体图案的膜的表面上施加光固化浆料形成光固化陶瓷涂层; （c）通过用所述膜的背面的光照射光固化所述光固化陶瓷涂层来形成光固化陶瓷片; （d）使用显影液除去所述可光固化陶瓷涂层的未固化部分; 和（e）剥离所述载体膜。 通过使用该电路部件片，能够同时满足减小绝缘层的厚度的要求和增加布线导体层的厚度的要求而制造多层电路板。

公开(公告)号：US06740352B2

公开(公告)日：2004-05-25

申请号：US10291606

申请日：2002-11-12

Applicant: Sung-Gue Lee ,  Yong-Il Kim

Inventor： Sung-Gue Lee ,  Yong-Il Kim

IPC: B05D512

CPC classification number: H05K3/243 ,  H05K3/28 ,  H05K2201/09881 ,  H05K2203/0597 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: Bonding pad(s) formed on a printed circuit board with circuit patterns. The bonding pad(s) include a plurality of copper patterns formed on the PCB and electrically connected to the circuit patterns, a filler filled between the copper patterns such that an upper surface of the copper pattern is exposed, and a plating layer applied at an upper surface of the copper patterns. An interval between wire bonding pad(s) is reduced by preventing a nickel plating layer and a gold plating layer from protruding at a lower portion of a copper pattern when they are formed on the copper patterns.

Abstract translation: 在印刷电路板上形成的具有电路图案的接合焊盘。 焊盘包括形成在PCB上并电连接到电路图案的多个铜图案，填充在铜图案之间的填充物，使得铜图案的上表面被暴露，并且镀覆层 铜图案的上表面。 通过防止镀镍层和镀金层在铜图案上形成时在铜图案的下部突出，从而降低引线接合焊盘之间的间隔。

公开(公告)号：US06713683B2

公开(公告)日：2004-03-30

申请号：US10270180

申请日：2002-10-15

Applicant: Masatoshi Takenaka ,  Shinji Okuma

Inventor： Masatoshi Takenaka ,  Shinji Okuma

IPC: H05K706

CPC classification number: H05K3/323 ,  H01R4/04 ,  H01R43/205 ,  H05K3/281 ,  H05K3/325 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2201/1034 ,  H05K2201/10977 ,  H05K2203/1311 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: In a wiring board having a terminal for connection of circuits in a variety of electronic devices, a joining section of the terminal is placed on a connecting section of a wiring pattern on the top surface of a lower substrate, two layers of adhesives having different softening temperatures are formed between the lower substrate and an upper substrate, and the lower substrate and the upper substrate are cemented sandwiching the joining section. With this structure, a stable holding force can be secured over a wide temperature range.

Abstract translation: 在具有用于在各种电子装置中连接电路的端子的布线板中，端子的接合部分放置在下基板的顶表面上的布线图案的连接部分上，具有不同软化的两层粘合剂 在下基板和上基板之间形成温度，并且将下基板和上基板接合夹着接合部。 利用这种结构，可以在宽的温度范围内确保稳定的保持力。

公开(公告)号：US20030159851A1

公开(公告)日：2003-08-28

申请号：US10400457

申请日：2003-03-28

Inventor： Yi-Jing Leu ,  Chih-Ching Chen ,  Ming-Chung Peng

IPC: H05K001/11

CPC classification number: B41J2/14 ,  B41J2/16 ,  B41J2/1623 ,  B41J2/1631 ,  B41J2/164 ,  B41J2002/14491 ,  H05K1/0393 ,  H05K3/0023 ,  H05K3/28 ,  H05K3/386 ,  H05K2201/09881 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49222 ,  Y10T29/49401

Abstract: A process of forming a flexible circuit board for ink jetting is provided. The process includes the steps of: providing an insulation tape; forming conductive traces on the insulation tape; and forming a photo-polymer layer filling between the conductive traces, wherein parts of the conductive traces are exposed to form a plurality of contacts. The material of the insulation tape can be polyimide, Teflon, polyamide, polymethylmethacrylate, polycarbonate, polyester, polyamide polyethylene-terephthalate copolymer, or any combination of the above materials. The material of the photo-polymer layer can be solder mask or polyimide.

Abstract translation: 提供了形成用于喷墨的柔性电路板的工艺。 该方法包括以下步骤：提供绝缘带; 在绝缘胶带上形成导电迹线; 以及形成填充在导电迹线之间的光聚合物层，其中部分导电迹线暴露以形成多个触点。 绝缘胶带的材料可以是聚酰亚胺，聚四氟乙烯，聚酰胺，聚甲基丙烯酸甲酯，聚碳酸酯，聚酯，聚酰胺聚对苯二甲酸乙二醇酯共聚物，或上述材料的任何组合。 光聚合物层的材料可以是焊接掩模或聚酰亚胺。

公开(公告)号：US20030148739A1

公开(公告)日：2003-08-07

申请号：US10332015

申请日：2003-01-03

Inventor： Takahiko Kosemura ,  Akihiko Okubora ,  Takayuki Hirabayashi ,  Tatsuya Ogino ,  Kuniyuki Hayashi

IPC: H04B001/38

CPC classification number: H01L23/66 ,  H01F17/0006 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01087 ,  H05K1/165 ,  H05K3/4602 ,  H05K3/4664 ,  H05K3/467 ,  H05K2201/0195 ,  H05K2201/09881

Abstract: The present invention provides a high-frequency module configuring a micro communication functional module, which includes a base substrate (2) which has multiple pattern wiring layers (6a) (6b) (9a) (9b) and dielectric insulating layers (5) (8) (11) formed therein, and has a buildup surface for smoothing the upper layer thereof, and a high-frequency element layer (4) formed on the buildup surface, which has an inductor (20) formed therein via an insulating layer (19) formed on the buildup surface. The base substrate (2) is provided with a region (30) where the pattern wiring layers (6a) (6b) (9a) (9b) are not formed from the upper layer to at least the mid portion thereof along the thickness direction, and the inductor (20) of the high-frequency element layer (4) is formed directly above the region (30).

Abstract translation: 本发明提供构成微通信功能模块的高频模块，其包括具有多个图案布线层（6a）（6b）（9a）（9b）和介电绝缘层（5）的基底（2） 8）（11），并且具有用于使其上层平坦化的积层表面和形成在积累表面上的高频元件层（4），该高频元件层（4）具有经由绝缘层形成在其中的电感器（20） 19）形成在积聚表面上。 基底基板（2）具有区域（30），其中图形布线层（6a）（6b）（9a）（9b））不沿着厚度方向至少至少其中间部分形成， 并且高频元件层（4）的电感器（20）直接形成在区域（30）的正上方。

公开(公告)号：US20030111158A1

公开(公告)日：2003-06-19

申请号：US10318264

申请日：2002-12-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo Okuyama ,  Hiroyoshi Takashima ,  Akira Hashimoto ,  Shinichi Kokawa

IPC: C03B029/00

CPC classification number: B32B18/00 ,  B32B38/145 ,  C04B35/468 ,  C04B2237/346 ,  C04B2237/50 ,  C04B2237/68 ,  C04B2237/704 ,  H01G4/12 ,  H01G4/30 ,  H01G4/308 ,  H01G4/33 ,  H05K1/0306 ,  H05K3/12 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09881 ,  H05K2203/0113 ,  Y10T29/435

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

公开(公告)号：US06557250B2

公开(公告)日：2003-05-06

申请号：US10003296

申请日：2001-12-06

Applicant: Rudi W Opitz ,  Walter P Stuckmann

Inventor： Rudi W Opitz ,  Walter P Stuckmann

IPC: H05K336

CPC classification number: H01F17/0013 ,  H01F27/2804 ,  H01F41/041 ,  H05K1/165 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2203/0759 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A multilayer printed board compound comprises at least two planely superposed printed boards, each of which having an electrically insulating mother board, electrically conductive circuit paths, which are provided on at least one side of the mother board, and recesses, which are defined laterally by the circuit paths and towards the mother board by the mother board; and at least one preimpregnated board, which is disposed between the printed boards for joining the printed boards; wherein the recesses, which are disposed between the mother boards of the respective printed boards, are filled substantially entirely with a synthetic resin paste; and wherein the at least two printed boards and the at least one preimpregnated board are joined by pressing.

Abstract translation: 多层印刷板化合物包括至少两个平面重叠的印刷电路板，每个印刷电路板具有电绝缘母板，设置在母板的至少一侧上的导电电路路径，以及凹槽，其横向由 电路通路和母板朝母板; 以及至少一个预浸渍板，其设置在用于接合印刷板的印刷板之间; 其中设置在各个印刷电路板的母板之间的凹部基本上用合成树脂浆料填充; 并且其中所述至少两个印刷板和所述至少一个预浸渍板通过压制而接合。