公开(公告)号：US11726274B1

公开(公告)日：2023-08-15

申请号：US17516583

申请日：2021-11-01

Applicant: Wavefront Research, Inc.

Inventor： Randall C. Veitch ,  Thomas W. Stone

IPC: G02B6/42 ,  H05K1/18 ,  H05K1/02 ,  H05K3/28 ,  H01L31/0232

CPC classification number: G02B6/4212 ,  G02B6/4204 ,  G02B6/4239 ,  G02B6/4244 ,  H05K1/0274 ,  H05K1/181 ,  H01L31/02327 ,  H05K3/284 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10143 ,  Y02P70/50 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49144

Abstract: Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

公开(公告)号：US11716814B2

公开(公告)日：2023-08-01

申请号：US17853854

申请日：2022-06-29

Applicant: Synaptics Incorporated

Inventor： Toshifumi Ogata ,  Atsushi Maruyama ,  Goro Sakamaki

IPC: H05K1/18 ,  G06F1/18 ,  H05K3/30

CPC classification number: H05K1/181 ,  G06F1/183 ,  H05K3/303 ,  H05K2201/10128 ,  H05K2201/10212 ,  H05K2203/166

Abstract: A display panel includes a plastic substrate and a first inner lead bonding (ILB) electrode on the plastic substrate. The first ILB electrode includes a first bonding segment, a second bonding segment, and a first connection segment. The first bonding segment is extended in a first direction oblique to a vertical direction of the display panel. The first connection segment is configured to provide an electrical connection between the first bonding segment and the second bonding segment. The first ILB electrode is configured to be bonded to an integrated circuit chip using one of the first bonding segment or the second bonding segment.

公开(公告)号：US11700694B2

公开(公告)日：2023-07-11

申请号：US17383785

申请日：2021-07-23

Applicant: InnoLux Corporation

Inventor： Chun-Lung Tseng ,  Hsin-Hung Chen

IPC: H05K1/14 ,  H05K1/18 ,  H05K5/00 ,  F21V8/00

CPC classification number: H05K1/189 ,  G02B6/0081 ,  H05K5/0017 ,  H05K2201/056 ,  H05K2201/10128

Abstract: An electronic device is disclosed, which includes: a support unit; a display panel disposed on the support unit; a first circuit board, wherein the support unit is disposed between the display panel and the first circuit board; an electronic component disposed on the first circuit board; and a second circuit board electrically connected to the display panel, wherein the second circuit board includes a first portion and a second portion, and the support unit is disposed between the first portion and a second portion, wherein the first circuit board is electrically connected to the display panel through the second circuit board.

公开(公告)号：US11698546B2

公开(公告)日：2023-07-11

申请号：US17811195

申请日：2022-07-07

Applicant: The Swatch Group Research and Development Ltd

Inventor： Axel Schindler ,  Alain Hamm

IPC: G02F1/1333 ,  G02F1/133 ,  G02F1/1343 ,  G02F1/1345 ,  G04B19/04 ,  G04B19/06 ,  G04G9/00 ,  G04G17/04 ,  H05K1/14 ,  H05K1/18 ,  H10K50/805

CPC classification number: G02F1/133331 ,  G02F1/13306 ,  G02F1/13439 ,  G02F1/13452 ,  G02F1/13332 ,  G02F1/133308 ,  G02F1/133317 ,  G02F1/133334 ,  G04B19/04 ,  G04B19/06 ,  G04G9/007 ,  G04G17/045 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10128 ,  H05K2201/10136 ,  H10K50/805

Abstract: An object includes an electro-optic display device provided with an optically active element, the optical properties thereof can be modified by applying an electric voltage or current between at least one electrode and one corresponding auxiliary electrode, between which the optically active element is disposed. The object further includes a middle part which delimits an opening closed by a crystal including a bottom surface beneath which the electro-optic display device is arranged. The crystal is provided with an opaque frame which is made remotely from the edges of the opening and which covers the contour of the electro-optic display device so as to conceal electrical connection elements. The electro-optic display device defines an active display area which is confined by the opaque frame, such that, when the electro-optic display device is activated and displaying information, a transparent area remains between the opaque frame and the edges of the opening.

公开(公告)号：US20230209724A1

公开(公告)日：2023-06-29

申请号：US17924949

申请日：2020-06-05

Applicant: Seong Ryong AN

Inventor： Seong Ryong AN

IPC: H05K3/32 ,  H05K3/10

CPC classification number: H05K3/323 ,  H05K3/103 ,  H05K2201/0338 ,  H05K2201/10128 ,  H05K2203/166

Abstract: Provided is a conductor bonding method capable of simply and easily performing a conductor bonding operation by placing conductive particle patterns and a conductive particle fixing material directly on lead terminals of an electronic device, the conductor bonding method includes 1) placing a first conductive particle fixing material 110 on lead terminals 2 of a display panel 1 (S100), 2) forming conductive particle patterns by placing conductive particles 120 in a dense state only on regions, in an upper surface of the first conductive particle fixing material 110, corresponding to the regions where the lead terminals 2 are formed in the display panel 1 (S200), 3) aligning a conductor 3 on the lead terminals 2 of the display panel 1, on which the first conductive particle fixing material and the conductive particle patterns are formed in step 1) and step 2) (S100-S200) (S300), and 4) bonding the aligned conductor 3 to the lead terminals 2 by applying heat or pressure (S400).

公开(公告)号：US11690174B2

公开(公告)日：2023-06-27

申请号：US17273593

申请日：2020-06-05

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ren Xiong ,  Fan Li ,  Qiang Tang ,  Fei Shang ,  Haijun Qiu ,  Yuanyuan Chai ,  Huiqiang Song

IPC: H05K1/11 ,  G06F3/044 ,  G06F3/041 ,  H01R12/61 ,  H05K3/36 ,  H05K1/18 ,  H10K59/131 ,  H10K59/179

CPC classification number: H05K1/118 ,  G06F3/0412 ,  G06F3/0443 ,  G06F3/0446 ,  H01R12/61 ,  H05K3/363 ,  G06F3/04164 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/0939 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09381 ,  H05K2201/09481 ,  H05K2201/10128 ,  H10K59/131 ,  H10K59/179

Abstract: A display device and a manufacturing method thereof are provided. The display device includes a display panel and a flexible circuit board electrically connected with the display panel. The flexible circuit board includes a first circuit board, a second circuit board and a conductive portion; the first circuit board includes a first substrate, and a main contact pad, a first wire and a second wire provided on the first substrate; the second circuit board includes a second substrate, a relay contact pad and a third wire provided on the second substrate; and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.

公开(公告)号：US11690167B2

公开(公告)日：2023-06-27

申请号：US16880703

申请日：2020-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunseok Hong ,  Gyounghwan Park ,  Cheolyoon Chung

IPC: H05K1/02 ,  H05K1/18 ,  H04N25/70

CPC classification number: H05K1/0245 ,  H04N25/70 ,  H05K1/028 ,  H05K1/0218 ,  H05K1/181 ,  H05K2201/093 ,  H05K2201/09227 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: According to various embodiments, a printed circuit board may include: a first wiring layer including at least one first signal line and at least one first dummy line; and a second wiring layer arranged on the first wiring layer and including at least one second signal line and at least one second dummy line, wherein when the printed circuit board is viewed from above, the at least one first signal line may be arranged to overlap, at least in part, the at least one second dummy line, and the at least one second signal line may be arranged to overlap, at least in part, the at least one first dummy line.

公开(公告)号：US20230200114A1

公开(公告)日：2023-06-22

申请号：US17887684

申请日：2022-08-15

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ju-Young Park ,  Ju Yeop Seong

IPC: H01L51/52 ,  H05K1/18

CPC classification number: H01L51/5253 ,  H05K1/189 ,  H05K2201/10128 ,  H01L2251/5338

Abstract: A display device having a display panel including first to third regions. The second region and the third region are respectively connected to opposite sides of the first region. The third region is bendable. A flexible circuit board is connected to an end of the third region. A first protection layer overlaps the first region to third regions. A second protection layer overlaps at least a portion of the third region. A support member overlaps the first protection layer. The support member includes a plurality of openings. The first protection layer includes a first groove overlapping at least a portion of the second region and a second groove overlapping at least a portion of the third region. Each of the first groove and the second groove overlaps the support member.

公开(公告)号：US20230189441A1

公开(公告)日：2023-06-15

申请号：US17970302

申请日：2022-10-20

Applicant: LG Display Co., Ltd.

Inventor： Sehwan Park

IPC: H05K1/14 ,  H05K5/03

CPC classification number: H05K1/147 ,  H05K5/03 ,  H05K2201/10128

Abstract: A display apparatus includes a display panel for reproducing an image or a video, a metal plate disposed in the rear of the display panel, a printed circuit board disposed in the rear of the metal plate and electrically connected to the display panel, and a chip-on-film having one end electrically connected to the display panel and the other end electrically connected to the printed circuit board, wherein a portion of the chip-on-film is bendable, and the metal plate includes a bending guide formed at a position corresponding to the bendable portion of the chip-on-film and guiding a bent shape of the chip-on-film. In the display apparatus according to the present disclosure, the bending guide disposed in a portion where the chip-on-film is bent may prevent a curvature of the chip-on-film from deviating from a designed range of the curvature, thereby suppressing excessive bending of the chip-on-film. For this reason, the chip-on-film may be effectively suppressed from being excessively bent and damaged.

公开(公告)号：US11676953B2

公开(公告)日：2023-06-13

申请号：US17663777

申请日：2022-05-17

Applicant: Apple Inc.

Inventor： Andreas Bibi ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: G06F3/042 ,  G06F3/041 ,  H01L25/16 ,  G06F1/16 ,  G09G3/32 ,  H01L25/075 ,  G04G9/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/538 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  H05K1/11 ,  H05K1/18 ,  H05K1/14 ,  G06F3/14

CPC classification number: H01L25/167 ,  G04G9/10 ,  G06F1/163 ,  G06F1/1652 ,  G06F3/042 ,  G06F3/0412 ,  G09G3/32 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/0753 ,  H01L31/0216 ,  H01L31/16 ,  H01L33/44 ,  H01L33/62 ,  G06F3/14 ,  G09G2380/02 ,  H01L2924/0002 ,  H05K1/115 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10128 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.