公开(公告)号：US20150144388A1

公开(公告)日：2015-05-28

申请号：US14551007

申请日：2014-11-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： AKIO FURUSAWA ,  KIYOHIRO HINE ,  MASATO MORI ,  TAICHI NAKAMURA

IPC: H05K1/09 ,  B23K35/26 ,  H05K3/34 ,  H05K1/11 ,  H05K1/18

CPC classification number: B23K35/262 ,  B23K35/0222 ,  B23K35/26 ,  B23K35/40 ,  C22C13/00 ,  H05K1/11 ,  H05K1/111 ,  H05K1/18 ,  H05K3/244 ,  H05K3/3463 ,  H05K2201/0338 ,  H05K2201/10909

Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0≦[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0

Abstract translation: 用于包含含有含有Ni的Au电极的Au电极的焊接中使用的焊料包括满足0.3＆nlE的Ag; [Ag]＆nlE; 4.0，满足0＆nlE的Bi; [Bi]＆nlE; 1.0，满足0＆nlE的Cu; [Cu] 其中焊料中Ag，Bi，Cu和In的含量（质量％）分别由[Ag]，[Bi]，[Cu]和[In]表示。 当[Cu]在0 <[Cu] <0.5的范围内时，焊料材料包括In的范围为6.0＆nlE; [In]＆nlE; 6.8; In为5.2+（6-（1.55×[Cu 当Cu [Cu]在[Cu]的范围内时，[Cu]和nlE; 1.0，In的范围为5.2＆nlE; [In]＆nlE; 6.8当[Cu] 落在1.0 <[Cu]和nlE的范围内。 余量仅包括不少于87质量％的Sn。

公开(公告)号：US20130286621A1

公开(公告)日：2013-10-31

申请号：US13924210

申请日：2013-06-21

Applicant: Renesas Electronics Corporation

Inventor： Hanae SHIMOKAWA ,  Tasao SOGA ,  Hiroaki OKUDAIRA ,  Toshiharu ISHIDA ,  Tetsuya NAKATSUKA ,  Yoshiharu INABA ,  Asao NISHIMURA

IPC: H05K1/18

CPC classification number: H05K1/181 ,  B23K1/0016 ,  B23K35/004 ,  B23K35/007 ,  B23K35/262 ,  B23K2101/40 ,  H01L23/488 ,  H01L23/49811 ,  H01L23/532 ,  H01L24/29 ,  H01L2224/83101 ,  H01L2924/01322 ,  H01L2924/15747 ,  H05K3/3426 ,  H05K3/3463 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T428/12708 ,  Y10T428/12715 ,  H01L2924/00

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract translation: 提供通过无铅焊料的接合结构和包含接合结构的电子制品。 粘合结构相对于时间的变化具有稳定的结合界面，足够的强度和耐发生晶须同时保持焊料的良好润湿性。 在接合结构中，通过Sn-Bi合金层将无铅Sn-Ag-Bi合金焊料施加到电极。 Sn-Bi合金优选含有1〜20重量％的Bi，以获得良好的焊料润湿性。 为了获得本发明中具有较高可靠性的理想的接合特性，在Sn-Bi合金层下方设置有铜层，从而获得足够的接合强度。

公开(公告)号：US08338927B2

公开(公告)日：2012-12-25

申请号：US13225788

申请日：2011-09-06

Applicant: Hiroyuki Nakamura ,  Atsushi Nishikizawa ,  Nobuya Koike

Inventor： Hiroyuki Nakamura ,  Atsushi Nishikizawa ,  Nobuya Koike

IPC: H01L21/44

CPC classification number: H01L21/4835 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3426 ,  H05K2201/10795 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The semiconductor device includes a semiconductor chip, a chip mounting portion, a suspension lead, and a plurality of leads. Each of the plurality of leads has a first part and a second part, and the suspension lead has a first part and a second part. The first part of each of the plurality of leads and the suspension lead project from the plurality of side surfaces of the sealing body, respectively. Parts of the side surfaces of the plurality of leads and the suspension lead are exposed from the plurality of side surfaces of the sealing body, respectively. An area of the obverse surface of the first part of the suspension lead is larger than an area of the obverse surface of the first part of each of the plurality of leads in a plan view.

Abstract translation: 半导体器件包括半导体芯片，芯片安装部分，悬挂引线和多个引线。 多个引线中的每一个具有第一部分和第二部分，并且悬架引线具有第一部分和第二部分。 多个引线中的每一个的第一部分和悬挂引线分别从密封体的多个侧表面伸出。 多个引线的侧面部分和悬挂引线分别从密封体的多个侧面露出。 在俯视图中，悬架引线的第一部分的正面的面积大于多根引线中的每一个的第一部分的正面的面积。

公开(公告)号：US20120118608A1

公开(公告)日：2012-05-17

申请号：US13321303

申请日：2010-05-17

Applicant: Seon Tae Kim ,  Hyung Chun Lee ,  Sang Won Lee

Inventor： Seon Tae Kim ,  Hyung Chun Lee ,  Sang Won Lee

IPC: H01B5/16

CPC classification number: H05K3/3421 ,  H01R13/03 ,  H01R13/2414 ,  H05K2201/10909 ,  Y02P70/613

Abstract: The present invention provides a conductive contact terminal for surface mounting on a substrate. In the conductive contact terminal, an elastic core imparts elasticity to the contact terminal. A metal layer covers the outer portion of the elastic core. A conductive adhesive layer is interposed between the elastic core and the metal layer to bond the elastic core and the metal layer to each other. The conductive contact terminal has a low electrical resistance, does not exhibit a deformation in the material even in a high-temperature reflow soldering process, and does not lose conductivity even though a metal layer, which imparts electrical conductivity to the conductive contact terminal, is broken.

Abstract translation: 本发明提供一种用于表面安装在基板上的导电接触端子。 在导电接触端子中，弹性芯向接触端子施加弹性。 金属层覆盖弹性芯的外部。 在弹性芯和金属层之间插入导电粘合剂层，以将弹性芯和金属层彼此粘合。 导电接触端子具有低电阻，即使在高温回流焊接工艺中也不会在材料中发生变形，并且即使向导电接触端子赋予导电性的金属层为 破碎。

公开(公告)号：US08021965B1

公开(公告)日：2011-09-20

申请号：US11599374

申请日：2006-11-15

Applicant: Gary H. Bernstein ,  Patrick Fay ,  Wolfgang Porod ,  Qing Liu

Inventor： Gary H. Bernstein ,  Patrick Fay ,  Wolfgang Porod ,  Qing Liu

IPC: H01L21/78 ,  H01L21/46 ,  H01L21/301

CPC classification number: H01L24/67 ,  H01L23/60 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/66 ,  H01L24/72 ,  H01L24/73 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/167 ,  H01L25/18 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/81141 ,  H01L2224/81224 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/181 ,  H05K1/182 ,  H05K3/326 ,  H05K3/328 ,  H05K2201/0314 ,  H05K2201/10454 ,  H05K2201/10909 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

Abstract translation: 本发明提供了一种用于微芯片的被套包装系统，这种被套包装系统的制造方法，可用于这种被套包装系统的微芯片，以及制造这种微芯片的方法。

公开(公告)号：US07667975B2

公开(公告)日：2010-02-23

申请号：US10580071

申请日：2004-12-15

Applicant: Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

Inventor： Yasushi Kambara ,  Akira Motoyama ,  Masayuki Nakajima

IPC: H05K7/00

CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/18 ,  H05B41/2827 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/062 ,  H05K2201/10909 ,  H05K2203/304

Abstract: A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6− (mm) or less, a cross-sectional area is 35 mm2 or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.

Abstract translation: 提供了一种用于灯装置的照明装置。 照明装置包括通过使用无铅流动焊料封装在电路板上的电路板和薄膜电容器。 每个薄膜电容器包括聚丙烯薄膜和导线，并且导线的材料的导热率低于铜的热导率，薄膜电容器的端子和内部材料是无引线的。 引线的直径为0.6-（mm）以下，截面积为35mm 2以下，焊接工序中的薄膜电容器的引线的末端的温度为130℃。 或更少。

公开(公告)号：US07608919B1

公开(公告)日：2009-10-27

申请号：US11599257

申请日：2006-11-15

Applicant: Gary H. Bernstein ,  Patrick Fay ,  Wolfgang Porod ,  Qing Liu

Inventor： Gary H. Bernstein ,  Patrick Fay ,  Wolfgang Porod ,  Qing Liu

IPC: H01L23/02 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/67 ,  H01L23/60 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/66 ,  H01L24/72 ,  H01L24/73 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/167 ,  H01L25/18 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/81141 ,  H01L2224/81224 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/181 ,  H05K1/182 ,  H05K3/326 ,  H05K3/328 ,  H05K2201/0314 ,  H05K2201/10454 ,  H05K2201/10909 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

Abstract translation: 本发明提供了一种用于微芯片的被套包装系统，这种被套包装系统的制造方法，可用于这种被套包装系统的微芯片，以及制造这种微芯片的方法。

公开(公告)号：US07497702B2

公开(公告)日：2009-03-03

申请号：US11935784

申请日：2007-11-06

Applicant: Hidehisa Yamagami

Inventor： Hidehisa Yamagami

IPC: H01R12/00

CPC classification number: H01R4/024 ,  H01R12/716 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10909

Abstract: A circuit board mounted connector is equipped with an insulative housing, which holds a plurality of rows of contacts and is mounted on a circuit board. Each contact has a contact portion, for contacting another connector; and a leg portion, which is connected to the circuit board. Each leg portion has an extending portion that extends from a rear wall of the insulative housing; a flexible portion, which is formed continuously with the extending portions; and a linear portion that extends in a direction substantially perpendicular to the circuit board from the flexible portion and is connected to an aperture of the circuit board. Of the plurality of rows of contacts, at least the row closest to the circuit board has extending portions that extend away from the circuit board, up to the flexible portions. The linear portions of each of the leg portions are partially tin plated.

Abstract translation: 电路板安装的连接器配备有绝缘壳体，其保持多排触点并安装在电路板上。 每个触点具有接触部分，用于接触另一连接器; 以及连接到电路板的腿部。 每个腿部具有从绝缘壳体的后壁延伸的延伸部分; 柔性部分，其与所述延伸部分连续形成; 以及从柔性部分沿基本上垂直于电路板的方向延伸并且连接到电路板的孔的直线部分。 在多排触点中，至少最靠近电路板的行具有远离电路板延伸的延伸部分，直到柔性部分。 每个腿部的直线部分是部分镀锡的。

公开(公告)号：US20080231305A1

公开(公告)日：2008-09-25

申请号：US12054289

申请日：2008-03-24

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier ,  William D. Smith

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US07358652B2

公开(公告)日：2008-04-15

申请号：US11326142

申请日：2006-01-05

Applicant: Kiyoshi Aratake ,  Keiji Sato

Inventor： Kiyoshi Aratake ,  Keiji Sato

IPC: H01L41/053 ,  H01L41/047

CPC classification number: H03H9/0542 ,  H03H3/02 ,  H03H9/0595 ,  H03H9/1035 ,  H03H9/215 ,  H05K3/3442 ,  H05K2201/10083 ,  H05K2201/10909 ,  Y02P70/613

Abstract: A surface mount type piezoelectric vibrator comprises a piezoelectric vibrator piece having an electrode, an airtight container made of glass or a ceramic material for encapsulating the piezoelectric vibrator piece, and an external terminal formed on an exterior surface of the airtight container and connected to the electrode of the piezoelectric vibrator piece. The external terminal comprises a metal alloy of Ni and Cr. A film of Au is formed on a surface of the metal alloy of Ni and Cr.

Abstract translation: 表面贴装型压电振动器包括具有电极的压电振动器片，由玻璃制成的密封容器或用于封装压电振动片的陶瓷材料，以及形成在密封容器的外表面上并与电极连接的外部端子 的压电振动片。 外部端子包括Ni和Cr的金属合金。 在Ni和Cr的金属合金的表面上形成Au膜。