Adhesive formulations
    62.
    发明授权
    Adhesive formulations 有权
    粘合剂配方

    公开(公告)号:US08349987B2

    公开(公告)日:2013-01-08

    申请号:US12698216

    申请日:2010-02-02

    Abstract: The disclosure relates to biocompatible components useful for forming compositions for use as medical/surgical synthetic adhesives and sealants. Biocompatible components of the present disclosure may include a polymeric polyol core, which may be treated with a nitroaryl compound to form a nitro ester. The resulting nitro ester groups may be reduced to form amino groups which, in turn, may be treated to form isocyanate groups. The resulting isocyanate may then be reacted with a second component to form adhesive and/or sealant compositions.

    Abstract translation: 本公开涉及可用于形成用作医疗/外科合成粘合剂和密封剂的组合物的生物相容性组分。 本公开的生物相容性组分可以包括聚合多元醇核心,其可以用硝基芳基化合物处理以形成硝基酯。 所得到的硝基酯基团可以还原形成氨基,其又可以被处理以形成异氰酸酯基团。 然后可将得到的异氰酸酯与第二组分反应形成粘合剂和/或密封剂组合物。

    Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend
    67.
    发明申请
    Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend 审中-公开
    热剥离性粘合片和回收被粘物的方法

    公开(公告)号:US20100028588A1

    公开(公告)日:2010-02-04

    申请号:US12311974

    申请日:2007-10-18

    Inventor: Kazuyuki Kiuchi

    Abstract: To provide a heat-peelable pressure-sensitive adhesive sheet which, even when applied to a flexible adherend or extremely small adherend, enables the adherend to be efficiently peeled and recovered therefrom without breakage.The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and arranged on one side thereof in the following order, an intermediate layer having a thickness “A”, and a heat-peelable pressure-sensitive adhesive layer having a thickness “B” and containing heat-expandable microspheres with a largest particle diameter “C”. The parameters A, B, and C satisfy the following conditions: C≦(A+B)≦60 (μm) and 0.25C≦B≦0.8C, and the heat-peelable pressure-sensitive-adhesive layer, when subjected to a heating treatment, shows an adhesive strength of less than 0.1 N/20 mm after the heating treatment. The heat-peelable pressure-sensitive adhesive layer after the heating treatment preferably has an arithmetic mean surface roughness Ra of 5 μm or smaller and a maximum height of the profile Rmax of 25 μm or smaller. The substrate preferably has a glass transition temperature (Tg) of 60° C. or higher and a thickness of 50 μm or smaller.

    Abstract translation: 为了提供一种即使应用于柔性被粘物或非常小的被粘物也能够有效地剥离被剥离并且不被破坏的被剥离体的热剥离性粘合片。 可热剥离性粘合片包括基板,按照以下顺序设置有厚度“A”的中间层和厚度“B”的热剥离性粘合剂层, 并含有最大粒径“C”的热膨胀性微球。 参数A,B和C满足以下条件:C <=(A + B)<= 60(母)和0.25℃<= B <= 0.8℃,并且可热剥离的压敏粘合剂层, 当进行加热处理时,在加热处理后显示小于0.1N / 20mm的粘合强度。 加热处理后的热剥离性粘合剂层的算术平均表面粗糙度Ra优选为5μm以下,轮廓Rmax的最大高度为25μm以下。 基板的玻璃化转变温度(Tg)优选为60℃以上,厚度为50μm以下。

    Aqueous paint composition and uses thereof
    68.
    发明授权
    Aqueous paint composition and uses thereof 失效
    水性涂​​料组合物及其用途

    公开(公告)号:US07163981B2

    公开(公告)日:2007-01-16

    申请号:US10911271

    申请日:2004-08-04

    Abstract: An object of the present invention is to easily provide an aqueous paint composition which is excellent in the low-temperature curability and can give a coated film that, while retaining a suitable texturability, further combines the water resistance, the marring resistance and the beef tallow staining resistance with good balance. In addition, another object of the present invention is to provide a coated article which is coated with this aqueous paint composition. As a means of achieving these objects, the aqueous paint composition according to the present invention is an aqueous paint composition comprising a water-soluble pure acrylic resin (A) as a binder resin and a polycarbodiimide compound (D) as a crosslinking agent; with the aqueous paint composition being characterized by further comprising acrylic resin beads (E) and urethane resin beads (F), wherein: in terms of solid component, the ratio of the water-soluble pure acrylic resin (A) relative to the binder resin, the ratios of the acrylic resin beads (E) and of the urethane resin beads (F) relative to the total of the binder resin and the crosslinking agent, and the equivalent ratio of the carbodiimide groups of the polycarbodiimide compound (D) relative to the carboxyl groups of the water-soluble pure acrylic resin (A) satisfy their respective specific ranges.

    Abstract translation: 本发明的目的在于提供一种低温固化性优异的水性涂料组合物,能够赋予涂膜,同时保持合适的结构性,进一步将耐水性,抗结块性和牛油结合 耐污染性良好。 此外,本发明的另一个目的是提供涂覆有这种水性涂料组合物的涂布制品。 作为实现这些目的的手段,本发明的水性涂料组合物是包含作为粘合剂树脂的水溶性纯丙烯酸树脂(A)和作为交联剂的聚碳二亚胺化合物(D)的水性涂料组合物, 该水性涂料组合物的特征在于还包含丙烯酸树脂珠(E)和聚氨酯树脂珠(F),其中:就固体组分而言,水溶性纯丙烯酸树脂(A)相对于粘合剂树脂 丙烯酸树脂珠粒(E)和聚氨酯树脂珠粒(F)的比例相对于粘合剂树脂和交联剂的总量的比例,以及聚碳化二亚胺化合物(D)的碳二亚胺基团相对于 水溶性纯丙烯酸树脂(A)的羧基满足各自的特定范围。

    Filled LAB pattern-coated films
    69.
    发明申请
    Filled LAB pattern-coated films 审中-公开
    填充LAB图案涂层膜

    公开(公告)号:US20050271850A1

    公开(公告)日:2005-12-08

    申请号:US11205257

    申请日:2005-08-16

    Abstract: A coated film is provided having a textured film with a top surface and a bottom surface, wherein at least one LAB coated area and at least one uncoated area are on the top surface of a textured film, and the appearance of the coated and uncoated areas on a textured film is visibly uniform and generally provides a coated film that has a surface that has visually indiscernible areas, even when at least one portion of the films is coated with particulate filled LAB, and the remainder of the film is uncoated.

    Abstract translation: 提供了具有带有顶表面和底表面的纹理膜的涂膜,其中至少一个LAB涂覆区域和至少一个未涂覆区域位于纹理膜的顶表面上,并且涂覆和未涂覆区域的外观 在有纹理的膜上是明显均匀的,并且通常提供具有视觉上不可区域的表面的涂膜,即使当至少一部分膜被颗粒填充的LAB涂覆时,该膜的其余部分是未涂覆的。

    Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip
    70.
    发明申请
    Pressure sensitive adhesive sheet for use in semiconductor working and method for producing semiconductor chip 有权
    用于半导体工作的压敏粘合片和用于制造半导体芯片的方法

    公开(公告)号:US20050269717A1

    公开(公告)日:2005-12-08

    申请号:US11140763

    申请日:2005-05-31

    Abstract: A pressure sensitive adhesive sheet to be used in producing an extremely thin semiconductor chip which is free of breakage and discoloration by a predicing process and a method of use thereof are provided. The pressure sensitive adhesive sheet is used in a method for producing a semiconductor chip, in which the method involves the steps of: forming a groove having depth smaller than thickness of a wafer on a surface of the wafer on which a semiconductor circuit is formed; reducing the thickness of the wafer and finally dividing the wafer into individual chips by grinding a back face of the wafer. The pressure sensitive adhesive sheet contains a rigid substrate, a vibration relaxation layer provided on one face of the rigid substrate and a pressure sensitive adhesive layer provided on the other face of the rigid substrate, in which thickness of the rigid substrate is 10 to 150 μm and Young's modulus thereof is 1000 to 30000 MPa, and thickness of the vibration relaxation layer is 5 to 80 μm and a maximum value of tan δ of dynamic viscoelasticity thereof at −5° C. to 120° C. is 0.5 or more.

    Abstract translation: 本发明提供一种压敏粘合片,其用于生产通过预处理方法没有破损和变色的极薄的半导体芯片及其使用方法。 压敏粘合片用于制造半导体芯片的方法中,其中所述方法包括以下步骤:在其上形成有半导体电路的晶片的表面上形成深度小于晶片厚度的凹槽; 减小晶片的厚度,最后通过研磨晶片的背面将晶片分成单独的芯片。 压敏粘合片包含刚性基材,设置在刚性基材的一个面上的振动缓冲层和设置在刚性基材的另一面上的压敏粘合剂层,其中刚性基材的厚度为10至150μm 杨氏模量为1000〜30000MPa,振动缓和层的厚度为5〜80μm,在-5℃〜120℃下的动态粘弹性的tanδ的最大值为0.5以上。

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