公开(公告)号：US11387211B2

公开(公告)日：2022-07-12

申请号：US16624303

申请日：2018-05-18

Applicant: SHINKAWA LTD.

Inventor： Tetsuya Otani ,  Osamu Watanabe ,  Tomonori Nakamura

IPC: H01L23/00 ,  B23K20/02 ,  B23K101/40

Abstract: A bonding apparatus bonds a semiconductor die, which has a first mam surface provided with a bump electrode, to a substrate by means of thermo-compression, with a thermo-compression film being interposed therebetween. The bonding apparatus includes: an intermediate stage that has a die placing surface on which the semiconductor die is placed such that the die placing surface faces the first main surface; and a bonding tool which detachably holds a second main surface of the semiconductor die that is placed on the intermediate stage, the second main surface being on the reverse side of the first main surface. The intermediate stage has a push-up mechanism which applies, to the first main surface of the semiconductor die, a force for separating the semiconductor die therefrom in the normal direction of the die placing surface (in a Z-axis direction).

公开(公告)号：US20220208721A1

公开(公告)日：2022-06-30

申请号：US17610445

申请日：2019-05-27

Applicant: SHINKAWA LTD.

Inventor： Hiroaki YOSHINO ,  Shinsuke TEI

IPC: H01L23/00

Abstract: This wire bonding apparatus has a capillary, a movement mechanism moving the capillary, and a control unit controlling driving of the movement mechanism. The control unit at least causes execution of: a first process (trajectory a) of lowering the capillary, after a FAB is formed, to pressure bonding height at a first bonding point to form a pressure bonded ball and a column part at the first bonding point; a second process (trajectory b) of moving the capillary horizontally at the pressure bonding height after execution of the first process to scarp off the column part by the capillary; and a third process (trajectory c-k) of repeating a pressing operation at least once after execution of the second process, the pressing operation involving moving the capillary forward and lowering the capillary temporarily during movement so that the capillary presses down on a wire portion positioned over the pressure bonded ball.

公开(公告)号：US20220165591A1

公开(公告)日：2022-05-26

申请号：US17602279

申请日：2020-04-07

Applicant: SHINKAWA LTD.

Inventor： Shigeyuki SEKIGUCHI ,  Yuji EGUCHI ,  Kohei SEYAMA

IPC: H01L21/67 ,  H05K13/04 ,  H01L23/00

Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

公开(公告)号：US11257781B2

公开(公告)日：2022-02-22

申请号：US16320466

申请日：2017-06-13

Applicant: SHINKAWA LTD.

Inventor： Noboru Fujino ,  Hisashi Ueda

IPC: H01L23/00 ,  B06B1/06 ,  B23K20/10

Abstract: A method for calibrating a wire clamp device includes: preparing a wire clamp device provided with a pair of arm parts having tips for clamping a wire, the arms extending from the tips toward base ends, and a drive part provided with a piezoelectric element for drive, connected to the base ends of the pair of arm parts and opening/closing the tips of the pair of arm parts; a step of detecting, by electrical continuity between the tips, a timing at which the pair of arm parts enters a closed state when the piezoelectric element for drive is driven, and acquiring a reference voltage; and a step of calibrating, on the basis of the reference voltage, an application voltage to be applied to the piezoelectric element for drive. Thus, it is possible to perform accurate and stable wire bonding.

公开(公告)号：US11189594B2

公开(公告)日：2021-11-30

申请号：US16499869

申请日：2018-03-22

Applicant: SHINKAWA LTD.

Inventor： Osamu Watanabe ,  Yoshihito Hagiwara ,  Tomonori Nakamura

IPC: H01L21/00 ,  H01L23/00

Abstract: A bonding apparatus and a bonding method are provided. The bonding apparatus bonds a semiconductor die to a substrate by thermocompression through an adhesive material. This bonding apparatus is provided with: a bonding tool which has a bonding surface that holds the semiconductor die through a first portion of a tape, and a pair of first tape constraining surfaces that are arranged so as to sandwich the bonding surface and constrain a second portion of the tape: tape constraining mechanisms which have a second tape constraining surface that presses the tape against the first tape constraining surfaces; and a control part which controls the movements of the bonding tool and the tape constraining mechanisms.

公开(公告)号：US11182921B2

公开(公告)日：2021-11-23

申请号：US16955785

申请日：2018-12-20

Applicant: SHINKAWA LTD.

Inventor： Shigeru Amemiya

IPC: G06T7/00 ,  G06T7/62 ,  G06T7/571

Abstract: This wire shape inspecting apparatus comprises a camera which captures an image of a wire from above, a light which illuminates the wire from above, and a control unit, wherein the control unit performs: an inspection image acquiring process of acquiring a plurality of inspection images by causing the camera to capture images of the wire a plurality of times while changing a focal distance; and a first shape detecting process of identifying, in each inspection image, a light emitting portion, which is an image part including reflected light comprising light from the light that has been reflected by the wire, and identifying an actual light emitting portion position, which is the actual position of the light emitting portion, on the basis of the position of the light emitting portion in the inspection image and the focal distance when the inspection image was acquired.

公开(公告)号：US20210272927A1

公开(公告)日：2021-09-02

申请号：US17259192

申请日：2019-07-11

Applicant: SHINKAWA LTD.

Inventor： Nobuyuki AOYAGI ,  Shigeru AMEMIYA

IPC: H01L23/00 ,  B06B1/02 ,  B06B1/06 ,  B23K20/10 ,  B23K20/00

Abstract: The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (ΔY/ΔX) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.

公开(公告)号：US20210251112A1

公开(公告)日：2021-08-12

申请号：US16651339

申请日：2018-09-19

Applicant: SHINKAWA LTD.

Inventor： Tomonori NAKAMURA ,  Toru MAEDA

IPC: H05K13/04

Abstract: A semiconductor mounting device for mounting chip components on a substrate, wherein the device is reduced in size. A semiconductor mounting device 10 comprises: a temporary placement stage 12 on which are loaded a plurality of chip components 30a, 30b, 30c; a conveyance head 14 that conveys the chip components 30a, 30b, 30c to the temporary placement stage 12, and also loads each of the chip components 30a, 30b, 30c on the temporary placement stage 12 so that the relative positions of the plurality of chip components 30a, 30b, 30c reach predetermined positions; a mounting stage 16 that secures a substrate 36 by suction; and a mounting head 18 that suctions the plurality of chip components 30a, 30b, 30c loaded on the temporary placement stage 12, and pressurizes while keeping the relative positions at prescribed positions on the substrate 36 that is secured by suction to the mounting stage 16.

公开(公告)号：US11004822B2

公开(公告)日：2021-05-11

申请号：US16327340

申请日：2017-08-23

Applicant: SHINKAWA LTD.

Inventor： Yohei Uchida ,  Naoya Taira

IPC: B23K20/00 ,  H01L23/00 ,  H01R4/28 ,  H01L41/09 ,  H01L41/083

Abstract: This wire clamp apparatus calibration method comprises: a step for driving a driving piezoelectric element by applying a predetermined frequency that causes a pair of arm portions to vibrate in an opening/closing direction; a step for detecting whether or not end portions of the pair of arm portions collide with each other on the basis of an output current outputted from the driving piezoelectric element when the pair of arm portions are vibrating in the opening/closing direction; a step for calculating, on the basis of the detection result, reference voltages in a state where the pair of arm portions are closed; and a step for performing calibration of a drive voltage to be applied to the driving piezoelectric element on the basis of the reference voltages. Accordingly, accuracy improvement and stabilization in an opening/closing operation of the wire clamp apparatus can be achieved.

公开(公告)号：US20200339375A1

公开(公告)日：2020-10-29

申请号：US16622292

申请日：2018-02-01

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA ,  Tetsuya UTANO

IPC: B65H51/20 ,  B65H57/14 ,  B65H59/36

Abstract: A wiring structure (10) includes: a fixed member (14); a movable member (12) which moves rectilinearly with respect to the fixed member (14); a wire material (16) which connects the movable member (12) and the fixed member (14); a movable guide (18) over which the wire material (16) is stretched and which can move rectilinearly with respect to the fixed member (14); and a movement mechanism (20) which causes the movable guide (18) to move, in conjunction with the rectilinear movement of the movable member (12), rectilinearly in a direction in which the loosening or tightening of the wire material (16) caused by the rectilinear movement of the movable member (12) is offset.