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71.发明申请公开(公告)号：US20190085131A1
公开(公告)日：2019-03-21
申请号：US15797114
申请日：2017-10-30
Applicant: Zhen Ding Technology Co., Ltd.
Inventor： NAN-KUN HUANG , SHOU-JUI HSIANG , YU-WEN KAO , SZU-HSIANG SU
Abstract: A low dielectric polyimide composition comprises an aliphatic anhydride, a long chain diamine, and an ester diamine. A polyimide made of such low dielectric polyimide composition has low polarizability group, thus the dielectric constant of the polyimide is lower. A polyimide made of the low dielectric polyimide composition, a polyimide film using the polyimide, and a copper clad laminate using the polyimide film are also provided.
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公开(公告)号：US20170325356A1
公开(公告)日：2017-11-09
申请号：US15191550
申请日：2016-06-24
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： NING HOU , CONG LEI , BIAO LI , MING-JAAN HO
IPC: H05K7/20
CPC classification number: H01L23/3735 , H01L21/4882 , H01L23/3736 , H01L23/3737 , H01L23/4275
Abstract: An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.
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公开(公告)号：US09706640B2
公开(公告)日：2017-07-11
申请号：US14928166
申请日：2015-10-30
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： Ming-Jaan Ho , Xian-Qin Hu , Yi-Qiang Zhuang , Fu-Wei Zhong
CPC classification number: H05K1/024 , H05K1/0221 , H05K3/4623 , H05K3/4697 , H05K2203/061
Abstract: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space. The signal wire is surrounded by air in the space. A method for manufacturing the printed circuit board is also provided.
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公开(公告)号：US09622340B2
公开(公告)日：2017-04-11
申请号：US14858953
申请日：2015-09-18
Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： Xian-Qin Hu , Yan-Lu Li , Wen-Hsin Yu , Ming-Jaan Ho
CPC classification number: H05K1/0228 , H05K1/0221 , H05K1/0237 , H05K1/0242 , H05K1/028 , H05K1/0393 , H05K3/10 , H05K3/243 , H05K3/28 , H05K3/281 , H05K2201/0355 , H05K2201/0715
Abstract: A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided.
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公开(公告)号：US09548427B2
公开(公告)日：2017-01-17
申请号：US14864585
申请日：2015-09-24
Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： Yu-Cheng Huang
CPC classification number: H01L33/486 , H01L33/60 , H01L33/644 , H01L2224/16225 , H01L2924/181 , H01L2933/0033 , H01L2924/00012
Abstract: The present disclosure relates to a method for manufacturing a LED package structure. First, a support plate including a top surface is provided. An annular groove is defined on the top surface and a protruding portion on the support plate is surrounded by the annular groove. Second, a reflecting layer is formed on surfaces and periphery portions of the annular groove. Then, a wiring pattern is formed on the top surface corresponding to the protruding portion. An insulting layer is formed in spaces of the wiring pattern and the annular groove. The support plate is removed and a receiving groove is formed by the insulting layer and the corresponding protruding portion. Finally, a LED chip is received in the receiving groove and bonded on the wiring pattern to obtain a LED package structure. A LED package structure made by the above method is also provided.
Abstract translation: 本发明涉及一种制造LED封装结构的方法。 首先，提供包括顶面的支撑板。 环形槽限定在顶表面上，支撑板上的突出部分被环形槽包围。 第二，在环形槽的表面和周边部分上形成反射层。 然后，在对应于突出部分的顶表面上形成布线图案。 在布线图案和环形槽的空间中形成绝缘层。 移除支撑板，并且通过绝缘层和相应的突出部分形成接收槽。 最后，将LED芯片接收在接收槽中并且接合在布线图案上以获得LED封装结构。 还提供了通过上述方法制造的LED封装结构。
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Patent Agency Ranking
公开(公告)号：US20160381786A1
公开(公告)日：2016-12-29
申请号：US14858652
申请日：2015-09-18
Applicant: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , ZHEN DING TECHNOLOGY CO., LTD.
Inventor： XIAN-QIN HU , FU-YUN SHEN , MING-JAAN HO , YI-QIANG ZHUANG
CPC classification number: H05K1/0216 , H05K1/0219 , H05K1/0237 , H05K1/024 , H05K1/09 , H05K3/06 , H05K3/4697 , H05K2201/0154 , H05K2201/0394 , H05K2201/09618 , H05K2203/063
Abstract: A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.
Abstract translation: 柔性电路板包括两个覆铜层压板，电路图案和两个接合层。 每个覆铜层压板包括绝缘基底和外部电路层。 电路图案位于两个覆铜层压板之间。 电路图案包括线性信号线，位于线性信号线的两个相对侧的两个接地线以及位于线性信号线和接地线之间的两个中空区域。 每个结合层位于电路图案和相应的覆铜层压板之间。 每个编码层限定了一个没有粘合剂的槽。 接合层通过槽与线性信号线隔开。 狭槽和中空区域协同地限定了包围线性信号线的空气介质层。 还提供了一种用于制造柔性电路板的方法。
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公开(公告)号：US09439281B2
公开(公告)日：2016-09-06
申请号：US13947114
申请日：2013-07-22
Applicant: Zhen Ding Technology Co., LTd.
Inventor： Wen-Hung Hu
CPC classification number: H05K1/0296 , H05K3/007 , H05K3/185 , H05K3/422 , H05K3/4661 , H05K2203/107
Abstract: A printed circuit board includes a base, a number of conductive pads, a dielectric layer, an activated metal layer, a first metal seed layer, a second metal seed layer, and a plurality of metal bumps. The conductive pads are formed on the base. The dielectric layer is formed on a surface of the conductive pads and portions of the base are exposed from the conductive pads. The dielectric layer includes blind vias corresponding to the conductive pads, and a laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the dielectric layer. The second metal seed layer is formed on the activated metal layer and the conductive pads. Each metal bump is formed on the second metal seed layer, and each metal bump protrudes from the dielectric layer.
Abstract translation: 印刷电路板包括基底，多个导电垫，电介质层，活化金属层，第一金属种子层，第二金属籽晶层和多个金属凸块。 导电垫形成在基座上。 电介质层形成在导电焊盘的表面上，并且基底的部分从导电焊盘露出。 电介质层包括对应于导电焊盘的盲孔和激光活化催化剂。 激活的金属层通过激光照射在盲孔的壁处获得。 活化金属层与电介质层接触。 第二金属种子层形成在活化的金属层和导电垫上。 每个金属凸块形成在第二金属种子层上，并且每个金属凸块从电介质层突出。
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公开(公告)号：US20160150635A1
公开(公告)日：2016-05-26
申请号：US14927888
申请日：2015-10-30
Applicant: HongQiSheng Precision Electronics (QinHuanDao) Co., Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： XIAN-QIN HU , YAN-LU LI , LI-BO ZHANG
CPC classification number: H05K1/0251 , H05K1/115 , H05K3/4015 , H05K3/4623 , H05K3/4688 , H05K2201/09063 , H05K2201/09472 , H05K2201/09845 , H05K2201/10303 , H05K2203/061
Abstract: The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.
Abstract translation: 柔性印刷电路板包括基层，第一电路层和第二电路层，第一电路和第二电路层形成在基层的两侧; 导电孔延伸穿过基层和第一铜层，导电孔包括嵌入第一电路层的环形铜环。 环形铜环的表面与第一电路层的表面之间的高度差在0至3微米的范围内。 还提供了一种用于制造柔性印刷电路板的方法。
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公开(公告)号：US09332656B2
公开(公告)日：2016-05-03
申请号：US14150723
申请日：2014-01-08
Applicant: Zhen Ding Technology Co., Ltd.
Inventor： Taekoo Lee
CPC classification number: H05K3/423 , H05K1/0306 , H05K3/007 , H05K3/421 , H05K3/427 , Y10T29/49165
Abstract: An interposer includes an insulating substrate, a photosensitive dielectric film, a conductive layer, and a conductive via. The insulating substrate includes a bottom surface and a top surface, and defines a receiving through hole extending through the bottom surface and the top surface. The photosensitive dielectric film is mounted on the bottom surface. The photosensitive dielectric film defines a through hole spatially corresponding to and communicating with the receiving through hole. The conductive layer is mounted on an end of the photosensitive dielectric film away from the insulating substrate. The conductive layer covers an end of the through hole. The conductive via is received in the receiving through hole and the through hole. The conductive via contacts and electrically connects to the conductive layer.
Abstract translation: 插入器包括绝缘基板，光敏介电膜，导电层和导电孔。 绝缘基板包括底表面和顶表面，并且限定了延伸穿过底表面和顶表面的接收通孔。 感光电介质膜安装在底面上。 感光电介质膜在空间上限定了与接收通孔对应并与其连通的通孔。 导电层安装在远离绝缘基片的光敏电介质膜的一端上。 导电层覆盖通孔的一端。 导电通孔被容纳在接收通孔和通孔中。 导电通孔接触并电连接到导电层。
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公开(公告)号：US09295150B2
公开(公告)日：2016-03-22
申请号：US14035957
申请日：2013-09-25
Applicant: Zhen Ding Technology Co., Ltd.
Inventor： Wen-Hung Hu
CPC classification number: H05K1/0298 , H05K1/115 , H05K3/421 , H05K3/4602 , H05K2201/09509 , H05K2201/09563 , H05K2201/096 , Y10T29/49165
Abstract: A printed circuit board includes a first, second, and third dielectric layers, and a first, second, and third trace layers. The first trace layer and the second trace layer are formed on opposite surfaces of the first dielectric layer. The second dielectric layer is formed on the second trace layer, a first blind hole is defined in the first surface and terminated at a position in the first dielectric layer, a first conductive via is formed in the first blind hole. A second blind hole is formed in the second dielectric layer and the first dielectric layer. A second conductive via is formed in the second blind hole. The third trace layer is electrically connected with the second conductive via. The first trace layer is electrically connected with the second trace layer through the first conductive via and the second conductive via.
Abstract translation: 印刷电路板包括第一，第二和第三电介质层，以及第一，第二和第三迹线层。 第一迹线层和第二迹线层形成在第一介电层的相对表面上。 第二电介质层形成在第二迹线层上，第一盲孔被限定在第一表面中并且终止于第一电介质层中的位置，第一导电通孔形成在第一盲孔中。 在第二电介质层和第一电介质层中形成第二盲孔。 第二导电通孔形成在第二盲孔中。 第三迹线层与第二导电通孔电连接。 第一迹线层通过第一导电通孔和第二导电通孔与第二迹线层电连接。
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