公开(公告)号：US09551083B2

公开(公告)日：2017-01-24

申请号：US14482981

申请日：2014-09-10

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh

IPC: C25D17/00 ,  C25D21/10 ,  C25D7/12 ,  C25D5/08

CPC classification number: C25D21/10 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001

Abstract: A paddle for a plating system has a housing with a back portion, a front portion, a first side portion, a second side portion, a first end portion, and a second end portion. A first fin is disposed laterally along a first external surface of the first side portion and offset and coupled to the first external surface to define a first passageway between the first external surface of the first side portion and a first internal surface of the first fin for flow of the electrolyte through the first passageway. A second fin is disposed laterally along a second external surface of the second side portion and offset and coupled to the second external surface to define a second passageway between the second external surface of the second side portion and a second internal surface of the second fin for flow of the electrolyte through the second passageway.

Abstract translation: 用于电镀系统的桨具有具有后部，前部，第一侧部，第二侧部，第一端部和第二端部的壳体。 第一翅片沿着第一侧部分的第一外表面横向布置，并且偏移并联接到第一外表面，以在第一侧部分的第一外表面和第一翅片的第一内表面之间限定第一通道，用于 电解液通过第一通道流动。 第二翅片沿着第二侧部分的第二外表面横向布置，并且偏移并联接到第二外表面，以在第二侧部分的第二外表面和第二翅片的第二内表面之间限定第二通道，用于 电解液通过第二通道流动。

公开(公告)号：US09502390B2

公开(公告)日：2016-11-22

申请号：US13795756

申请日：2013-03-12

Applicant: Invensas Corporation

Inventor： Terrence Caskey ,  Ilyas Mohammed ,  Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Michael Newman ,  Pezhman Monadgemi ,  Reynaldo Co ,  Ellis Chau ,  Belgacem Haba

IPC: H05K1/02 ,  H01L25/10 ,  H05K3/46 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/105 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/02379 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/381 ,  H05K1/0298 ,  H05K3/46 ,  Y10T29/49126 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Abstract translation: 制造插入件的方法包括形成结合到第一元件的一个或多个第一表面的多个引线键合。 形成电介质封装，其接触将引线接合部彼此分隔开的引线接合的边缘表面。 进一步的处理包括去除第一元件的至少一部分，其中插入件具有通过至少封装相互隔开的第一和第二相对侧，并且插入件分别在第一和第二相对侧具有第一接触和第二接触， 分别与第一和第二部件电连接，第一触点通过引线键与第二触点电连接。

公开(公告)号：US20160329301A1

公开(公告)日：2016-11-10

申请号：US15164179

申请日：2016-05-25

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Arkalgud R. Sitaram

IPC: H01L25/065 ,  H01L23/498 ,  C25F3/14 ,  H01L21/48 ,  H01L23/00 ,  C25F3/12 ,  H01L23/367 ,  H01L23/373

CPC classification number: H01L25/0655 ,  C25F3/12 ,  C25F3/14 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/367 ,  H01L23/3733 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/17 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15701 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H05K1/0212 ,  H05K1/115 ,  H05K3/07 ,  H05K2201/10378

Abstract: A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned with the mask relative to an electric field applied by the electrolytic process. The second region separates the first region of the second conductive portion from the first conductive portion. The electrolytic process is concentrated relative to the second region such that removal occurs at a relatively higher rate in the second region than in the first region.

公开(公告)号：US20160284672A1

公开(公告)日：2016-09-29

申请号：US15174338

申请日：2016-06-06

Applicant: Invensas Corporation

Inventor： Rajesh Katkar ,  Arkalgud R. Sitaram ,  Cyprian Emeka Uzoh

IPC: H01L25/065 ,  H01L23/367

CPC classification number: H01L25/0657 ,  H01L21/30604 ,  H01L21/308 ,  H01L21/31105 ,  H01L21/76897 ,  H01L21/76898 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/481 ,  H01L23/5386 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

Abstract: An apparatus relates generally to a three-dimensional stacked integrated circuit. In such an apparatus, the three-dimensional stacked integrated circuit has at least a first die and a second die interconnected to one another using die-to-die interconnects. A substrate of the first die has at least one thermal via structure extending from a lower surface of the substrate toward a well of the substrate without extending to the well and without extending through the substrate. A first end of the at least one thermal via structure is at least sufficiently proximate to the well of the substrate for conduction of heat away therefrom. The substrate has at least one through substrate via structure extending from the lower surface of the substrate to an upper surface of the substrate. A second end of the at least one thermal via structure is coupled to at least one through die via structure of the second die for thermal conductivity.

Abstract translation: 装置一般涉及三维堆叠集成电路。 在这种装置中，三维堆叠集成电路具有至少第一管芯和第二管芯，使用管芯到管芯互连彼此互连。 第一管芯的衬底具有至少一个热通孔结构，其从衬底的下表面朝向衬底的阱延伸，而不延伸到阱并且不延伸通过衬底。 所述至少一个热通孔结构的第一端至少足够靠近所述衬底的阱，用于将热量传导出来。 衬底具有从衬底的下表面延伸到衬底的上表面的至少一个穿过衬底通孔结构。 所述至少一个热通孔结构的第二端与所述第二管芯的至少一个通孔通孔结构耦合以进行导热。

公开(公告)号：US20160260687A1

公开(公告)日：2016-09-08

申请号：US14639942

申请日：2015-03-05

Applicant: Invensas Corporation

Inventor： Guilian Gao ,  Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Liang Wang

IPC: H01L25/065 ,  H01L23/373 ,  H01L23/00 ,  H01L25/00 ,  H01L23/367

CPC classification number: H01L25/0657 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/373 ,  H01L24/00 ,  H01L24/11 ,  H01L24/17 ,  H01L24/27 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/11334 ,  H01L2224/16057 ,  H01L2224/16145 ,  H01L2224/2761 ,  H01L2224/32245 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/01006 ,  H01L2924/10253

Abstract: A device with thermal control is presented. In some embodiments, the device includes a plurality of die positioned in a stack, each die including a chip, interconnects through a thickness of the chip, metal features of electrically conductive composition connected to the interconnects on a bottom side of the chip, and adhesive or underfill layer on the bottom side of the chip. At least one thermally conducting layer, which can be a pyrolytic graphite layer, a layer formed of carbon nanotubes, or a graphene layer, is coupled between a top side of one of the plurality of die and a bottom side of an adjoining die in the stack. A heat sink can be coupled to the thermally conducting layer.

Abstract translation: 介绍了一种具有热控制功能的设备。 在一些实施例中，该装置包括位于堆叠中的多个管芯，每个管芯包括芯片，通过芯片的厚度相互连接，导电组合物的金属特征连接到芯片的底侧上的互连件和粘合剂 或底部填充层。 至少一个热传导层，其可以是热解石墨层，由碳纳米管形成的层或石墨烯层，被耦合在多个管芯中的一个的顶侧和邻接的管芯的底侧之间 堆栈 散热器可以耦合到导热层。

公开(公告)号：US09433093B2

公开(公告)日：2016-08-30

申请号：US14337196

申请日：2014-07-21

Applicant: INVENSAS CORPORATION

Inventor： Cyprian Emeka Uzoh

IPC: H05K1/11 ,  H05K3/42 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H01L23/14

CPC classification number: H05K1/115 ,  H01L23/14 ,  H01L23/49827 ,  H01L23/49866 ,  H01L2924/0002 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42 ,  H05K2201/0141 ,  H05K2201/0175 ,  H05K2201/09509 ,  H05K2201/10378 ,  H05K2203/025 ,  H05K2203/1105 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A component includes a support structure having first and second spaced-apart and parallel surfaces and a plurality of conductive elements extending in a direction between the first and second surfaces. Each conductive element contains an alloy of a wiring metal selected from the group consisting of copper, aluminum, nickel and chromium, and an additive selected from the group consisting of Gallium, Germanium, Indium, Selenium, Tin, Sulfur, Silver, Phosphorus, and Bismuth. The alloy has a composition that varies with distance in at least one direction across the conductive element. A concentration of the additive is less than or equal to 5% of the total atomic mass of the conductive element, and a resistivity of the conductive element is between 2.5 and 30 micro-ohm-centimeter.

Abstract translation: 组件包括具有第一和第二间隔开并平行表面的支撑结构以及沿第一和第二表面之间的方向延伸的多个导电元件。 每个导电元件包含选自铜，铝，镍和铬的布线金属的合金和选自由镓，锗，铟，硒，锡，硫，银，磷和 铋。 该合金具有随导电元件的至少一个方向上的距离而变化的组成。 添加剂的浓度小于或等于导电元件的总原子质量的5％，并且导电元件的电阻率在2.5至30微欧姆厘米之间。

公开(公告)号：US09418924B2

公开(公告)日：2016-08-16

申请号：US14220912

申请日：2014-03-20

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Cyprian Emeka Uzoh ,  Ron Zhang ,  Daniel Buckminster ,  Guilian Gao

IPC: H01L21/30 ,  H01L23/498 ,  H01L21/52 ,  H01L21/78 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L21/768 ,  H01L21/304 ,  H01L23/13

CPC classification number: H01L25/0657 ,  H01L21/304 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/52 ,  H01L21/565 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: An apparatus relates generally to an integrated circuit package. In such an apparatus, a package substrate has a first plurality of via structures extending from a lower surface of the package substrate to an upper surface of the package substrate. An die has a second plurality of via structures extending to a lower surface of the die. The lower surface of the die faces the upper surface of the package substrate in the integrated circuit package. The package substrate does not include a redistribution layer. The die and the package substrate are coupled to one another.

Abstract translation: 装置一般涉及集成电路封装。 在这种装置中，封装衬底具有从封装衬底的下表面延伸到封装衬底的上表面的第一多个通孔结构。 模具具有延伸到模具的下表面的第二多个通孔结构。 模具的下表面在集成电路封装中面向封装衬底的上表面。 封装基板不包括再分布层。 管芯和封装衬底彼此耦合。

公开(公告)号：US09349669B2

公开(公告)日：2016-05-24

申请号：US14643264

申请日：2015-03-10

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh ,  Charles G. Woychik ,  Terrence Caskey ,  Kishor V. Desai ,  Huailiang Wei ,  Craig Mitchell ,  Belgacem Haba

IPC: H01L21/44 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/34 ,  H01L21/768 ,  H01L23/00 ,  H01L23/14 ,  H01L23/498

CPC classification number: H01L23/34 ,  H01L21/76841 ,  H01L21/76883 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/32105 ,  H01L2924/00011 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/81805

Abstract: A microelectronic component with circuitry includes a substrate (possibly semiconductor) having an opening in a top surface. The circuitry includes a conductive via (possibly metal) in the opening. The opening has a first sidewall of a first material, and the conductive via has a second sidewall of a second material (possibly metal). At least at one side of the opening, the first and second sidewalls are spaced from each other at the top surface of the substrate but the first and second sidewalls meet below the top surface of the substrate at a meeting location. Between the meeting location and the top surface of the substrate, the first and second sidewalls are separated by a third material (possibly foam) which is a dielectric different from the first material. The third material lowers thermal stress in case of thermal expansion compared to a structure in which the third material were replaced with the second material.

Abstract translation: 具有电路的微电子部件包括在顶表面具有开口的衬底（可能的半导体）。 电路包括开口中的导电通孔（可能是金属）。 开口具有第一材料的第一侧壁，并且导电通孔具有第二材料（可能是金属）的第二侧壁。 至少在开口的一侧，第一和第二侧壁在基板的顶表面处彼此间隔开，但是第一和第二侧壁在会议位置处在基板的顶表面下面相交。 在会议位置和基板的顶表面之间，第一和第二侧壁由不同于第一材料的电介质的第三材料（可能是泡沫）隔开。 第三种材料与第三种材料被第二种材料替换的结构相比，在热膨胀的情况下降低了热应力。

公开(公告)号：US20160068988A1

公开(公告)日：2016-03-10

申请号：US14482981

申请日：2014-09-10

Applicant: Invensas Corporation

Inventor： Cyprian Emeka Uzoh

IPC: C25D21/10 ,  C25D17/10

CPC classification number: C25D21/10 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001

Abstract: A paddle for a plating system has a housing with a back portion, a front portion, a first side portion, a second side portion, a first end portion, and a second end portion. A first fin is disposed laterally along a first external surface of the first side portion and offset and coupled to the first external surface to define a first passageway between the first external surface of the first side portion and a first internal surface of the first fin for flow of the electrolyte through the first passageway. A second fin is disposed laterally along a second external surface of the second side portion and offset and coupled to the second external surface to define a second passageway between the second external surface of the second side portion and a second internal surface of the second fin for flow of the electrolyte through the second passageway.

Abstract translation: 用于电镀系统的桨具有具有后部，前部，第一侧部，第二侧部，第一端部和第二端部的壳体。 第一翅片沿着第一侧部分的第一外表面横向布置，并且偏移并联接到第一外表面，以在第一侧部分的第一外表面和第一翅片的第一内表面之间限定第一通道，用于 电解液通过第一通道流动。 第二翅片沿着第二侧部分的第二外表面横向布置，并且偏移并联接到第二外表面，以在第二侧部分的第二外表面和第二翅片的第二内表面之间限定第二通道，用于 电解液通过第二通道流动。

公开(公告)号：US20150348873A1

公开(公告)日：2015-12-03

申请号：US14289860

申请日：2014-05-29

Applicant: INVENSAS CORPORATION

Inventor： Rajesh Katkar ,  Cyprian Emeka Uzoh

IPC: H01L23/48 ,  H01L23/00 ,  H01L21/768

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/43 ,  H01L24/46 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/023 ,  H01L2224/4502 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A component such as an interposer or microelectronic element can be fabricated with a set of vertically extending interconnects of wire bond structure. Such method may include forming a structure having wire bonds extending in an axial direction within one of more openings in an element and each wire bond spaced at least partially apart from a wall of the opening within which it extends, the element consisting essentially of a material having a coefficient of thermal expansion (“CTE”) of less than 10 parts per million per degree Celsius (“ppm/° C.”). First contacts can then be provided at a first surface of the component and second contacts provided at a second surface of the component facing in a direction opposite from the first surface, the first contacts electrically coupled with the second contacts through the wire bonds.

Abstract translation: 诸如插入件或微电子元件的部件可以用一组垂直延伸的引线接合结构的互连件制造。 这种方法可以包括形成具有线性结合的结构，所述线接合在元件中的多个开口之一内沿轴向延伸，并且每个引线键至少部分地与其延伸的开口的壁间隔开，所述元件基本上由材料 具有小于10摄氏度（“ppm /℃”）的百万分之几的热膨胀系数（“CTE”）。 然后可以在部件的第一表面处提供第一触点，并且提供在部件的第二表面处的面向第一表面的方向的第二触点，第一触头通过引线接合与第二触点电耦合。