ELECTRONIC DEVICE
    71.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20190258355A1

    公开(公告)日:2019-08-22

    申请号:US16398920

    申请日:2019-04-30

    Abstract: In one embodiment, an electronic device includes first and second substrates, an insulating layer, and a connecting material. The first substrate includes a first conductive layer. The second substrate includes a basement having first and second surfaces, a second conductive layer on the second surface, and a first hole penetrating through the basement. The insulating layer is arranged between the first conductive layer and the basement, and has a second hole. The connecting material connects conductive layers via holes. The first hole has a first opening on a first surface side. The second hole has a third opening on a first conductive layer side which is larger than the first opening.

    ELECTRONIC DEVICE
    80.
    发明申请
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20180032175A1

    公开(公告)日:2018-02-01

    申请号:US15658801

    申请日:2017-07-25

    Abstract: According to one embodiment, an electronic device including a first substrate which includes a first basement, a first conductive layer, and a second conductive layer in contact with the first conductive layer, a second substrate which includes a second basement opposed to the first conductive layer and separated from the first conductive layer, a third conductive layer, and a first hole penetrating the second substrate, and a connecting material which electrically connects the second conductive layer and the third conductive layer via the first hole and directly contacts the second conductive layer.

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