MEMS microphone package
    79.
    发明授权

    公开(公告)号:US09807516B2

    公开(公告)日:2017-10-31

    申请号:US14832913

    申请日:2015-08-21

    Applicant: Chao Wang Bin Xu

    Inventor: Chao Wang Bin Xu

    Abstract: A micro-electro-mechanical system (MEMS) microphone package is provided in the present disclosure. The MEMS microphone package includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a shielding ring covering a joint between the electromagnetic shielding cover and the circuit board. The shielding ring is configured for preventing electromagnetic waves from entering the accommodating space via the joint between the electromagnetic shielding cover and the circuit board.

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