公开(公告)号：US20140251537A1

公开(公告)日：2014-09-11

申请号：US14278810

申请日：2014-05-15

Applicant: Dexerials Corporation

Inventor： Daisuke SATO ,  Junichi NISHIMURA ,  Ryosuke ODAKA

IPC: H05K3/30

CPC classification number: H05K3/30 ,  C08K3/01 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/134 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29366 ,  H01L2224/29386 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K3/305 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.

Abstract translation: 提供绝缘树脂膜，其包含：第一粘合剂层; 和第二粘合剂层，其中所述绝缘树脂膜被构造成将基板和电子部件结合在一起，并且所述第一粘合层设置在所述基板的一侧，并且所述第二粘合层设置在所述电子部件的一侧 其中，所述第一粘合剂层和所述第二粘合剂层各自含有无机填料，其中所述第二粘合剂层具有比所述第一粘合剂层的DSC放热峰值温度高的DSC放热峰值温度，并且其中所述第一粘合剂的厚度 层是绝缘树脂膜的总厚度的50％至90％。

公开(公告)号：US20140193598A1

公开(公告)日：2014-07-10

申请号：US14237113

申请日：2012-08-08

Applicant: Steffen Traser ,  Jan D. Forster ,  Bernd Kuehneweg ,  Tobias Pick

Inventor： Steffen Traser ,  Jan D. Forster ,  Bernd Kuehneweg ,  Tobias Pick

IPC: C09J7/02

CPC classification number: B32B17/064 ,  C08L2312/00 ,  C09J7/10 ,  C09J133/02 ,  C09J133/06 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/622 ,  C09J2433/00 ,  Y10T428/1452 ,  Y10T428/24942 ,  Y10T428/24959

Abstract: A multilayer pressure sensitive adhesive (PSA) film having a first acrylic pressure sensitive adhesive layer and an opposing second acrylic pressure sensitive adhesive layer, wherein the first pressure sensitive adhesive layer has a glass transition temperature Tg≧0° C. and a content of a strongly polar acrylate of 7.5 to 15 wt.-% in its precursor, and the second pressure sensitive adhesive layer has a Tg≦0° C. and contains 0.5 to 12 wt.-% of a strongly polar acrylate in its precursor, wherein the content of the strongly polar acrylate of the precursor of the first pressure sensitive adhesive layer exceeds the content of the strongly polar acrylate of the precursor of the second pressure sensitive adhesive layer by at least 2 wt.-% and wherein the Tg of the first pressure sensitive adhesive layer exceeds the Tg of the second pressure sensitive adhesive layer by at least 5° C.

Abstract translation: 一种具有第一丙烯酸压敏粘合剂层和相对的第二丙烯酸压敏粘合剂层的多层压敏粘合剂（PSA）膜，其中第一压敏粘合剂层的玻璃化转变温度Tg≥0℃， 其极性丙烯酸酯在其前体中为7.5至15重量％，第二压敏粘合剂层的Tg和nlE为0℃，并且在其前体中含有0.5-12重量％的极性极强的丙烯酸酯，其中 第一压敏粘合剂层的前体的强极性丙烯酸酯的含量超过第二压敏粘合剂层的前体的强极性丙烯酸酯的含量至少2重量％，并且其中第一压力的Tg 粘合剂层超过第二压敏粘合剂层的Tg至少5℃。

公开(公告)号：US20140083608A1

公开(公告)日：2014-03-27

申请号：US14114964

申请日：2012-05-04

Applicant: tesa SE

Inventor： Thomas Schubert ,  Arne Koops ,  Sarah Reich

IPC: C09J7/02

CPC classification number: C09J7/00 ,  B29B7/485 ,  B29B7/82 ,  B29B7/86 ,  B32B27/08 ,  B32B27/16 ,  B32B27/308 ,  B32B27/32 ,  B32B27/40 ,  B32B2405/00 ,  C08G18/12 ,  C08G18/227 ,  C08G18/3206 ,  C08G18/4812 ,  C08G18/4825 ,  C08G18/4829 ,  C08G18/6674 ,  C08G18/755 ,  C08G2170/40 ,  C08J5/128 ,  C08J2323/16 ,  C09J5/02 ,  C09J7/10 ,  C09J123/16 ,  C09J175/08 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2423/00 ,  C09J2423/10 ,  C09J2433/00 ,  C09J2475/00 ,  Y10T428/2826 ,  C08G18/758

Abstract: A process increases adhesion between a layer of pressure-sensitive adhesive and a substrate, wherein the layer of pressure-sensitive adhesive has a first surface facing away from the substrate and a second surface facing toward the substrate and a third surface of the substrate. The process treats (i) the second surface of the layer of pressure-sensitive adhesive that faces toward the substrate and (ii) the third surface of the substrate with atmospheric-pressure plasma, and adhesive bonds the layer of pressure-sensitive adhesive to the third surface of the substrate.

Abstract translation: 一种方法增加了一层压敏粘合剂和基材之间的粘合性，其中压敏粘合剂层具有背离基材的第一表面和面向基材的第二表面和基材的第三表面。 该方法处理（i）面向基板的压敏粘合剂层的第二表面和（ii）具有大气压等离子体的基板的第三表面，并且粘合剂将压敏粘合剂层粘合到 基板的第三表面。

公开(公告)号：US20140023861A1

公开(公告)日：2014-01-23

申请号：US13945030

申请日：2013-07-18

Applicant: NITTO DENKO CORPORATION

Inventor： Masaaki SATOU ,  Yoshikazu SOEDA ,  Hiroshi WADA

IPC: C09J7/02

CPC classification number: C09J7/22 ,  C09J2201/134 ,  C09J2203/326 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2453/00 ,  Y10T428/266

Abstract: A pressure-sensitive adhesive sheet including a plastic substrate having a thickness of more than 0 μm and less than 2.0 μm and a pressure-sensitive adhesive layer on at least one side of the plastic substrate. The pressure-sensitive adhesive layer contains an acrylic polymer or a rubber-based polymer in an amount of 50 wt % or more relative to a total amount of the pressure-sensitive adhesive layer. The acrylic polymer is formed of a monomer mixture containing the specific alkyl (meth)acrylate monomer in an amount of 50.0 to 99.8 wt % relative to a total amount of monomer components and a polar group-containing monomer in an amount of 0.01 to 20 wt % relative to the total amount of monomer components.

Abstract translation: 一种压敏粘合片，其包括厚度大于0μm且小于2.0μm的塑料基材和在所述塑料基材的至少一侧上的压敏粘合剂层。 压敏粘合剂层含有相对于压敏粘合剂层的总量为50重量％以上的丙烯酸系聚合物或橡胶系聚合物。 丙烯酸类聚合物由单体混合物形成，该单体混合物相对于单体组分和极性基团单体的总量为50重量％至99.8重量％，含量为0.01-20重量％的（甲基）丙烯酸烷基酯单体 ％相对于单体组分的总量。

公开(公告)号：US20130335879A1

公开(公告)日：2013-12-19

申请号：US13980629

申请日：2012-01-17

Applicant: Yukio Arimitsu

Inventor： Yukio Arimitsu

IPC: C09J7/02 ,  H01G4/30 ,  B32B7/06

CPC classification number: H01G4/30 ,  B32B7/06 ,  C08K5/0025 ,  C08K9/10 ,  C09J7/38 ,  C09J2201/134 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/11 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T156/10 ,  Y10T428/2848

Abstract: The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet, containing a heat-releasable pressure-sensitive adhesive layer containing a heat-expandable microsphere on one side of a substrate and a pressure-sensitive adhesive layer for temporary fixing on another side of the substrate, in which the pressure-sensitive adhesive layer for temporary fixing has a shear pressure-sensitive adhesive strength of 2.0 N/200 mm2 or more and a tensile pressure-sensitive adhesive strength of 0.01 to 2.0 N/20 mm in width, and the pressure-sensitive adhesive layer for temporary fixing is crosslinked with an isocyanate or epoxy crosslinking agent.

Abstract translation: 本发明涉及一种双面压敏粘合带或片材，其包含在基材的一面上含有热膨胀性微球的热释放性粘合剂层和用于临时固定的压敏粘合剂层 基材的另一侧，其中临时固定用粘合剂层的剪切压敏粘合强度为2.0N / 200mm 2以上，拉伸压敏粘合强度为0.01〜2.0N / 20mm 宽度，用于临时固定的粘合剂层与异氰酸酯或环氧交联剂交联。

公开(公告)号：US20130240862A1

公开(公告)日：2013-09-19

申请号：US13886098

申请日：2013-05-02

Applicant: LG CHEM, LTD.

Inventor： Hyun Jee Yoo ,  Yoon Gyung Cho ,  Jung Sup Shim ,  Suk Chin Lee ,  Kwang Jin Jeong ,  Suk Ky Chang

IPC: H01L51/52 ,  H01L51/56

CPC classification number: H01L51/0094 ,  C08K3/16 ,  C08K3/22 ,  C08K3/346 ,  C08K3/36 ,  C08K2003/162 ,  C08K2003/166 ,  C08K2003/2206 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L21/56 ,  H01L23/28 ,  H01L23/295 ,  H01L23/564 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/5246 ,  H01L51/5253 ,  H01L51/5256 ,  H01L51/5259 ,  H01L51/56 ,  H01L2251/301 ,  H01L2251/303 ,  H01L2924/0002 ,  H05B33/04 ,  H01L2924/00

Abstract: An adhesive film, and a product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable hot-melt adhesive layer including a curable resin and a moisture absorbent, and the curable hot-melt adhesive layer includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer.

Abstract translation: 提供了一种粘合膜，以及使用其的封装有机电子器件（OED）的产品和方法。 粘合膜用于包封OED并且包括可固化的热熔粘合剂层，其包括可固化树脂和吸湿剂，并且可固化热熔粘合剂层包括在封装OED时与OED接触的第一区域，以及 第二个区域不与OED接触。 此外，基于粘合剂层中的吸湿剂的总重量，吸湿剂在第一和第二区域中的含量分别为0至20％和80至100％。

公开(公告)号：US08524032B2

公开(公告)日：2013-09-03

申请号：US13613560

申请日：2012-09-13

Applicant: Yasushi Akutsu ,  Tomoyuki Ishimatsu ,  Koichi Miyauchi

Inventor： Yasushi Akutsu ,  Tomoyuki Ishimatsu ,  Koichi Miyauchi

IPC: H05K3/36 ,  H05K3/02 ,  H05K3/10 ,  B21F15/02 ,  H01R3/00 ,  H01R4/00 ,  H01R43/00 ,  H02G1/14 ,  B32B7/12

CPC classification number: C09J7/00 ,  C08K3/017 ,  C08K3/08 ,  C08K9/02 ,  C09J7/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/29082 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H05K1/0346 ,  H05K3/323 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/25 ,  Y10T428/31511 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

Abstract: A method for producing a joined structure involving pressure-bonding a first circuit member and a second circuit member together via a connecting film while the circuit members are being heated, to thereby join the circuit members with each other, wherein the connecting film is defined and includes first and second layers wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than the minimum melt viscosity of the insulating organic resin layer.

Abstract translation: 一种接合结构体的制造方法，其特征在于，在将所述电路部件加热的同时，经由连接膜将第一电路部件和第二电路部件压接在一起，从而将所述电路部件彼此接合， 包括第一层和第二层，其中第一层和第二层之一是含导电颗粒的有机树脂层，另一层是不含导电颗粒的绝缘有机树脂层，并且其中导电颗粒的最小熔体粘度 的绝缘性有机树脂层的绝缘性有机树脂层的最低熔融粘度的10倍以上。

公开(公告)号：US20130164478A1

公开(公告)日：2013-06-27

申请号：US13813925

申请日：2011-08-03

Applicant: Masayuki Yamamoto ,  Yohei Nakamura ,  Kuniaki Muto ,  Yasufumi Sumitomo

Inventor： Masayuki Yamamoto ,  Yohei Nakamura ,  Kuniaki Muto ,  Yasufumi Sumitomo

IPC: C09J7/00 ,  B32B27/00 ,  B32B7/12

CPC classification number: C09J7/00 ,  B32B7/12 ,  B32B23/20 ,  B32B27/00 ,  B32B27/08 ,  B32B27/308 ,  B32B27/325 ,  B32B27/365 ,  B32B2307/412 ,  B32B2457/208 ,  B32B2551/00 ,  C09J7/10 ,  C09J133/08 ,  C09J133/10 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2433/00 ,  Y10T428/1476 ,  Y10T428/24612 ,  Y10T428/24959 ,  Y10T428/264 ,  Y10T428/2891

Abstract: A double-faced pressure-sensitive adhesive sheet, including a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer provided on one side of the aforementioned first pressure-sensitive adhesive layer, wherein a primary component of the first pressure-sensitive adhesive layer is a two-part acrylic pressure-sensitive adhesive (I), and a weight average molecular weight of the pertinent two-part acrylic pressure-sensitive adhesive (I) is 150,000-800,000, and wherein a primary component of the second pressure-sensitive adhesive layer is a two-part acrylic pressure-sensitive adhesive (II), and a weight average molecular weight of the pertinent two-part acrylic pressure-sensitive adhesive (II) is 900,000-2,000,000.

Abstract translation: 一种双面粘合片，包括第一粘合剂层和设置在上述第一粘合剂层一侧的第二压敏粘合剂层，其中，第一压敏粘合剂层的主要组分， 粘合剂层是双组分丙烯酸类压敏粘合剂（I），相关的两部分丙烯酸类压敏粘合剂（I）的重均分子量为150,000-800,000，其中第二 压敏粘合剂层是两部分丙烯酸类压敏粘合剂（II），相关的两部分丙烯酸类压敏粘合剂（II）的重均分子量为90万〜200万。

公开(公告)号：US20130051888A1

公开(公告)日：2013-02-28

申请号：US13595471

申请日：2012-08-27

Applicant: Takahiro NORIMATSU

Inventor： Takahiro NORIMATSU

IPC: B41J33/10 ,  B32B27/08 ,  B32B37/10 ,  C09J7/02

CPC classification number: B32B37/0007 ,  B32B7/06 ,  B32B7/12 ,  B32B27/36 ,  B32B37/12 ,  B32B37/1284 ,  B32B37/144 ,  B32B37/203 ,  B32B37/26 ,  B32B2037/268 ,  B32B2250/04 ,  B32B2255/10 ,  B32B2309/10 ,  B32B2309/16 ,  B32B2367/00 ,  B32B2405/00 ,  C09J7/22 ,  C09J7/30 ,  C09J2201/134 ,  C09J2433/00 ,  C09J2467/006 ,  Y10T156/10 ,  Y10T428/1452

Abstract: A double-sided adhesive tape rolled on a cylindrical roll core includes a polyethylene terephthalate film having a first surface and a second surface opposite to the first surface, a first adhesive layer applied on the first surface of the polyethylene terephthalate film, a release sheet laminated on the first surface of the polyethylene terephthalate film through the first adhesive layer, the release sheet being laminated so as to turn exterior to the polyethylene terephthalate film, and a second adhesive layer applied on the second surface of the polyethylene terephthalate film. In the double-sided adhesive tape, 100 N/m or larger of tensile force is applied to the polyethylene terephthalate film when the release sheet is laminated onto the first adhesive layer applied on the first surface of the polyethylene terephthalate film.

Abstract translation: 在圆筒状卷芯上卷绕的双面胶带包括具有第一表面和与第一表面相对的第二表面的聚对苯二甲酸乙二醇酯膜，涂覆在聚对苯二甲酸乙二醇酯膜的第一表面上的第一粘合剂层，层压的剥离片 在聚对苯二甲酸乙二醇酯膜的第一表面上，通过第一粘合剂层，将剥离片层压，从而在聚对苯二甲酸乙二醇酯膜外侧进行层压，将第二粘合剂层涂布在聚对苯二甲酸乙二醇酯膜的第二面上。 在双面胶带中，当将剥离片层压到涂覆在聚对苯二甲酸乙二醇酯膜的第一表面上的第一粘合剂层上时，对聚对苯二甲酸乙二醇酯膜施加100N / m以上的张力。

公开(公告)号：US08302366B2

公开(公告)日：2012-11-06

申请号：US12719799

申请日：2010-03-08

Applicant: Steven L. Taylor ,  Norman C. Tracy ,  Charles R. Cornman ,  John W. McMullen ,  Thomas R. Peck, Jr.

Inventor： Steven L. Taylor ,  Norman C. Tracy ,  Charles R. Cornman ,  John W. McMullen ,  Thomas R. Peck, Jr.

IPC: E04B1/00 ,  E04C1/00

CPC classification number: E04F13/0887 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/134 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/40 ,  E04F15/02155 ,  E04F15/02188 ,  E04F15/187

Abstract: The installation system and method for installing an architectural covering material to a substrate surface utilizes an adhesive mat having layers of adhesive and release layers arranged to allow the covering material to be initially positioned, and later repositioned to be permanently set. The adhesive mat includes a planar carrier member, one or more adhesive layers on at least one planar side of the planar carrier member, and at least one release layer of material removably covering the one or more adhesive layers. In one form, the adhesive mat includes a carrier sheet, first and second adhesive layers on opposing planar sides of the carrier sheet, and first and second release layers of material removably covering the two adhesive layers.

Abstract translation: 用于将建筑覆盖材料安装到基底表面的安装系统和方法利用具有布置成允许覆盖材料被初始定位并且随后重新定位以永久设置的粘合剂层和释放层的粘合剂垫。 粘合垫包括平面载体构件，在平面载体构件的至少一个平面侧上的一个或多个粘合剂层和至少一个可移除地覆盖一个或多个粘合剂层的材料释放层。 在一种形式中，粘合剂垫包括载体片，载体片的相对平面侧上的第一和第二粘合剂层，以及可移除地覆盖两个粘合剂层的材料的第一和第二释放层。