公开(公告)号：US4923718A

公开(公告)日：1990-05-08

申请号：US172723

申请日：1988-02-10

Applicant: Kosuke Iida ,  Hiroshi Yamato ,  Yoji Kadono

Inventor： Kosuke Iida ,  Hiroshi Yamato ,  Yoji Kadono

IPC: B32B27/00 ,  B32B27/30 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  C08J7/04 ,  H05K1/00 ,  H05K1/03

CPC classification number: H05K1/036 ,  C08J7/047 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2203/0759 ,  Y10T428/24967 ,  Y10T428/269 ,  Y10T428/31507 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31667 ,  Y10T428/31721 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/31935 ,  Y10T428/31942

Abstract: Functional films comprising a thermoplastic resin having formed thereon a coating layer and a process for their production are disclosed. The films have improved properties including improved heat resistance, are inexpensive, and are for general-purpose. They are produced by baking a thin film of a phenol resin, an epoxy resin, a silicone resin, etc., onto a thermoplastic resin substrate and can be utilized for flexible printed circuit base, insulating tapes, etc.

公开(公告)号：US4639285A

公开(公告)日：1987-01-27

申请号：US826004

申请日：1986-02-04

Applicant: Niichiro Suzuki ,  Yoshimi Ogushi ,  Kiyoshi Imai ,  Nobuhiro Ohta ,  Susumu Ueno

Inventor： Niichiro Suzuki ,  Yoshimi Ogushi ,  Kiyoshi Imai ,  Nobuhiro Ohta ,  Susumu Ueno

IPC: H05K1/03 ,  B29C65/48 ,  B32B7/02 ,  B32B7/12 ,  B32B15/08 ,  H05K1/00 ,  H05K3/38 ,  B32B31/00 ,  B29C17/08

CPC classification number: H05K3/386 ,  H05K3/381 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2203/095 ,  H05K3/389

Abstract: The invention provides a flexible metal-foiled laminate of an insulating base film of a synthetic resin, e.g. polyimide, and a metal, e.g. copper, foil adhesively bonded together and suitable for use as a base plate for printed circuit boards by virtue of the high heat resistance and greatly increased adhesive bonding strength between the base film and the metal foil. The laminate is prepared by use of a silicone-based adhesive and the surface of the base film is, prior to adhesive bonding, subjected to a treatment of exposure to an atmosphere of low temperature plasma generated in a gaseous organosilicon compound such as trimethyl ethoxy silane, optionally, diluted with an inorganic gas such as oxygen.

Abstract translation: 本发明提供了一种合成树脂绝缘基膜的柔性金属箔层合物， 聚酰亚胺和金属，例如， 铜，箔粘合在一起，适合用作印刷电路板的基板，由于高耐热性和大大增加了基膜和金属箔之间的粘合强度。 通过使用硅氧烷基粘合剂制备层压体，并且在粘合粘合之前，基膜的表面经受暴露于气态有机硅化合物如三甲基乙氧基硅烷中产生的低温等离子体气氛的处理 任选地用无机气体如氧气稀释。

公开(公告)号：US3157534A

公开(公告)日：1964-11-17

申请号：US417260

申请日：1960-01-25

Applicant: CORNING GLASS WORKS

Inventor： DOMICONE JOSEPH J ,  NORDBERG MARTIN E

IPC: C03C15/00 ,  C03C17/00 ,  C03C17/30 ,  C03C17/32 ,  H01B3/46 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38

CPC classification number: C03C15/00 ,  C03C17/00 ,  C03C17/30 ,  C03C17/32 ,  H01B3/46 ,  H05K1/0306 ,  H05K3/28 ,  H05K3/381 ,  H05K2201/0162 ,  Y10S428/901 ,  Y10T428/31612

公开(公告)号：US3023139A

公开(公告)日：1962-02-27

申请号：US72060458

申请日：1958-03-11

Applicant: FLORIS VAN TETTERODE AND JAN D

Inventor： TETTERODE FLORIS VAN

IPC: C03C15/00 ,  C03C17/00 ,  C03C17/30 ,  C03C17/32 ,  H01B3/46 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38

CPC classification number: C03C15/00 ,  C03C17/00 ,  C03C17/30 ,  C03C17/32 ,  H01B3/46 ,  H05K1/0306 ,  H05K3/28 ,  H05K3/381 ,  H05K2201/0162 ,  Y10T428/315

公开(公告)号：US11930593B2

公开(公告)日：2024-03-12

申请号：US17516926

申请日：2021-11-02

Applicant: LG DISPLAY CO., LTD.

Inventor： Hohyun Keum ,  Mingyu Kang

IPC: H05K1/02 ,  H01L27/15 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H10K59/131 ,  H10K77/10 ,  H01L27/12 ,  H10K102/00

CPC classification number: H05K1/0283 ,  H01L27/156 ,  H05K1/0313 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/189 ,  H10K59/131 ,  H10K77/111 ,  H01L27/1218 ,  H01L27/124 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/10128 ,  H10K2102/311

Abstract: A stretchable display device comprises a display panel that includes a stretchable substrate where a plurality of emission elements is disposed, wherein the stretchable substrate is stretchable in at least one of a first direction and a second direction perpendicular to the first direction; a printed circuit film that includes a first driving circuit chip generating a drive control signal to be applied to the display panel and a second driving circuit chip receiving image data from outside and transferring the image data to the first driving circuit chip, wherein the printed circuit film is stretchable in at least one of the first direction and the second direction with respect to a stretch direction of the display panel.

公开(公告)号：US11889615B2

公开(公告)日：2024-01-30

申请号：US17075350

申请日：2020-10-20

Applicant: Graphcore Limited

Inventor： Stephen Felix

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0231 ,  H05K1/0215 ,  H05K1/032 ,  H05K1/184 ,  H05K3/0058 ,  H05K2201/0162

Abstract: There is provided a computer structure comprising a first silicon substrate and a second silicon substrate. Computer circuitry configured to perform computing operations is formed in the first silicon substrate, which has a self-supporting depth and an inner facing surface. A plurality of distributed capacitance units are formed in the second silicon substrate, which has an inner facing surface located in overlap with the inner facing surface of the first substrate and is connected to the first substrate via a set of connectors arranged extending depthwise of the structure between the inner facing surfaces. The inner facing surfaces have matching planar surface dimensions. The second substrate has an outer facing surface on which are arranged a plurality of connector terminals for connecting the computer structure to a supply voltage. The second substrate has a smaller depth than the first substrate.

公开(公告)号：US20230309243A1

公开(公告)日：2023-09-28

申请号：US18187689

申请日：2023-03-22

Applicant: Lite-On Technology Corporation

Inventor： Jen-Chieh Huang

IPC: H05K3/34 ,  H05K3/10

CPC classification number: H05K3/3485 ,  H05K3/103 ,  H05K2203/1173 ,  H05K2201/0162 ,  H05K2201/015

Abstract: The disclosure provides a conductive slurry, which includes a conductive paste comprising polar materials and a hydrophobic agent mixed with the conductive paste. The hydrophobic agent includes solvent and hydrophobic particles. The solvent of the hydrophobic agent includes a non-polar material.

公开(公告)号：US20230193045A1

公开(公告)日：2023-06-22

申请号：US18167235

申请日：2023-02-10

Applicant: actnano, Inc.

Inventor： Syed Taymur AHMAD ,  Justin KLEINGARTNER ,  Sruti BALASUBRAMANIAN

IPC: C09D5/00 ,  C09D7/20 ,  C09D1/00 ,  H05K3/28 ,  C09D183/04 ,  C08K3/04 ,  C08G77/00 ,  C08K3/22 ,  C08K3/36 ,  H01B3/46 ,  C08L83/04 ,  C09D7/00 ,  C08L27/12 ,  C08L23/00

CPC classification number: C09D5/00 ,  C09D7/20 ,  C09D1/00 ,  H05K3/28 ,  C09D183/04 ,  C08K3/04 ,  C08G77/80 ,  C08K3/22 ,  C08K3/36 ,  H01B3/46 ,  C08L83/04 ,  C09D7/00 ,  C08L27/12 ,  C08L23/00 ,  H05K3/282 ,  H05K2201/0162 ,  H05K2201/0212 ,  H05K2201/0209 ,  H05K2203/0759

Abstract: A composition for forming a protective coating on an electronic device that is in the form of a non-Newtonian fluid that exhibits both viscous and elastic properties, and that forms at least one coating that is hydrophobic, oleophobic, or oleophilic is disclosed. The viscous and elastic properties associated with the non-Newtonian fluid allows the composition to redistribute after being applied as a coating an electronic device. Methods for protecting an electronic device from liquid contaminants by applying the disclosed composition and electronic devices comprising the composition are also disclosed. An electronic device, such as a printed circuit board, having a film made of the composition is also disclosed.

公开(公告)号：US20190200447A1

公开(公告)日：2019-06-27

申请号：US16227723

申请日：2018-12-20

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： MUNSIK CHOI ,  Kl-SOO NAM ,  HANYUL YU

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K1/14 ,  G02F1/1335 ,  G02F1/1368 ,  G02F1/1345 ,  G02F1/1333

CPC classification number: H05K1/028 ,  G02F1/133308 ,  G02F1/133514 ,  G02F1/13452 ,  G02F1/1368 ,  G02F2001/133331 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/144 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/041 ,  H05K2201/056 ,  H05K2201/10136

Abstract: A printed circuit board includes: a first flexible base member; a first metal line disposed on the first flexible base member; a first plating line disposed on the first metal line and including a first connecting portion, a first interconnection portion extending from the first connecting portion, and a first bending portion extending from the first interconnection portion; a first protective layer covering the first interconnection portion and exposing the first connecting portion and the first bending portion; a connection part disposed on the first bending portion and connected to the first bending portion; a second protective layer extending from a side surface of the connection part; a second plating line disposed on the second protective layer; a second metal line disposed on the second plating line; and a second flexible base member disposed on the second metal line.

公开(公告)号：US20180188290A1

公开(公告)日：2018-07-05

申请号：US15741213

申请日：2016-07-04

Applicant: OKINS ELECTRONICS CO.,LTD

Inventor： Sung Gye PARK ,  Jin Kook JUN

IPC: G01R3/00 ,  G01R1/04 ,  G01R31/28 ,  H05K3/10 ,  H05K3/28 ,  H05K1/11 ,  H05K1/02 ,  H05K3/40

CPC classification number: G01R3/00 ,  G01R1/0433 ,  G01R31/2863 ,  G01R31/2896 ,  H05K1/0268 ,  H05K1/028 ,  H05K1/111 ,  H05K3/103 ,  H05K3/28 ,  H05K3/285 ,  H05K3/3484 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2201/10757 ,  H05K2201/10795 ,  H05K2201/10856 ,  H05K2203/041 ,  H05K2203/1327 ,  H05K2203/166

Abstract: A method of manufacturing a test socket includes preparing a printed circuit board (PCB) on which a bonding pad is disposed, bonding a conductive wire on the bonding pad, mounting, on an upper surface of the PCB, a space through which the bonding pad is exposed, mounting, on an upper surface of the space, a base through which the bonding pad is exposed, mounting, on an upper surface of the base, a jig which covers the bonding pad, and injecting a liquid silicone rubber into a jig assembly by using the jig assembly as a mold, the jig assembly including the PCB, the space, the base, and the jig.