公开(公告)号：US4601934A

公开(公告)日：1986-07-22

申请号：US634975

申请日：1984-07-27

Applicant: James A. Beverly

Inventor： James A. Beverly

IPC: B23K35/22 ,  H05K3/00 ,  H05K3/34 ,  B32B7/06 ,  B32B7/12

CPC classification number: B23K35/224 ,  H05K3/0076 ,  H05K2201/0166 ,  H05K2203/0191 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K3/3452 ,  Y10T428/1476 ,  Y10T428/26 ,  Y10T428/2809 ,  Y10T428/283 ,  Y10T428/31913 ,  Y10T428/31928

Abstract: A masking for use in connection with the manufacture of circuit board comprising a polyvinyl alcohol film, which is uniformly annealed to be free of stress and strains and which is water-soluble at a temperature of 120.degree. F. A water-soluble adhesive, having a stiffness of between about medium soft and about medium, is placed on the film, and the masking material has a moisture level of below about 2% by weight.

Abstract translation: 用于制造包括聚乙烯醇膜的电路板的掩模，该聚乙烯醇膜被均匀地退火以便没有应力和应变，并且在120°F的温度下是水溶性的。水溶性粘合剂具有 介于约中等软介质和约介质之间的刚度被放置在膜上，并且掩蔽材料具有低于约2重量％的水分含量。

公开(公告)号：US4586976A

公开(公告)日：1986-05-06

申请号：US419278

申请日：1982-09-17

Applicant: Satoshi Takano ,  Tadashi Azumakawa

Inventor： Satoshi Takano ,  Tadashi Azumakawa

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  B44C1/16 ,  B32B9/04 ,  B32B31/00 ,  H01R43/00

CPC classification number: H05K3/0076 ,  H05K3/205 ,  H05K1/0393 ,  H05K2201/0133 ,  H05K2201/0166 ,  H05K2203/0152 ,  H05K2203/0726 ,  H05K3/386 ,  Y10T156/1089 ,  Y10T29/49117 ,  Y10T428/31663

Abstract: A process for producing a printed-wiring board is disclosed. The process involves providing a metal carried support surface and forming a resist pattern on the metal surface comprised of a silicone rubber material. The support surface where there is not resist is metal plated to provide metal plated surface portions which are contact bonded to a insulating base material by interposing an adhesive between the insulating base material and the metal surface portions or contact bonded to an uncured base material having an adhesive force. The contact bonding is carried out in order to transfer the metal surface portions onto the base material thus forming the conductor pattern on the base material and producing the printing-wiring board. The process eliminates the loss of expensive copper foil and provides a method by which the base material can be securely bonded to the metal portions forming the printed-wiring board.

Abstract translation: 公开了印刷电路板的制造方法。 该方法包括提供金属承载的支撑表面，并在由硅橡胶材料构成的金属表面上形成抗蚀剂图案。 没有抗蚀剂的支撑表面被金属电镀以提供金属电镀表面部分，其通过在绝缘基材和金属表面部分之间插入粘合剂而接触粘合到绝缘基材上，或者接触粘合到具有 粘合力 进行接触接合以将金属表面部分转印到基材上，从而在基材上形成导体图案并制造印刷线路板。 该方法消除了昂贵的铜箔的损失，并且提供了一种基体材料可牢固地结合到形成印刷电路板的金属部分的方法。

公开(公告)号：US4557796A

公开(公告)日：1985-12-10

申请号：US636660

申请日：1984-08-01

Applicant: Frank Druschke ,  Georg Kraus ,  Ulrich Kuenzel ,  Wolf D. Ruh ,  Rolf Schaefer

Inventor： Frank Druschke ,  Georg Kraus ,  Ulrich Kuenzel ,  Wolf D. Ruh ,  Rolf Schaefer

IPC: C23F4/00 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/3213 ,  H05K3/08 ,  C23F1/02 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC classification number: H05K3/08 ,  C23F4/00 ,  H01L21/32136 ,  H05K2201/0166 ,  H05K2203/095

Abstract: According to this method, copper is dry etched in a glow discharge containing compounds with at least one methyl or methylene group, particularly at temperatures close to room temperature.The method is applied in particular for making conductors on or in module substrates or circuit cards, solder spots, and the wiring of magnetic thin films.

Abstract translation: 根据该方法，铜在具有至少一个甲基或亚甲基的化合物的辉光放电中被干蚀刻，特别是在接近室温的温度下。 该方法特别用于在导体上或在模块衬底或电路卡中形成导体，焊点和磁性薄膜的布线。

公开(公告)号：US4220810A

公开(公告)日：1980-09-02

申请号：US967499

申请日：1978-12-07

Applicant: Minoru Arai ,  Akio Baba

Inventor： Minoru Arai ,  Akio Baba

IPC: H05K1/11 ,  H05K3/00 ,  H05K3/12 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K3/3452 ,  H05K3/0079 ,  H05K1/116 ,  H05K2201/0166 ,  H05K2201/09045 ,  H05K3/1216 ,  H05K3/3447

Abstract: A new and unique printed wiring board completely free from trouble of solder bridging that often takes place with the conventional printed wiring board. The printed wiring board of the present invention is provided with a raised portion of solder resist ink in the form of a ridge around the periphery of the land to be printed or at an area between adjacent lands to be soldered, the said raised portion being an extension of a solder resist thin layer coated on the insulator base board exclusive the said land.

Abstract translation: 一种新颖独特的印刷电路板，完全没有常规印刷电路板发生焊接桥接的麻烦。 本发明的印刷电路板具有围绕待印刷的焊盘周边的脊的形式的焊锡形式的凸起部分，或者待焊接的相邻焊盘之间的区域，所述凸起部分是 扩展涂覆在绝缘体基板上的阻焊薄层，独占所述焊盘。

公开(公告)号：US3838984A

公开(公告)日：1974-10-01

申请号：US35122473

申请日：1973-04-16

Applicant: SPERRY RAND CORP

Inventor： CRANE J ,  LAWSON J ,  PETSCHAUER R

IPC: H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/36 ,  H05K3/42

CPC classification number: H05K1/113 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/16237 ,  H01L2224/24226 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/363 ,  H05K3/423 ,  H05K2201/0166 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/10674 ,  Y10S428/929 ,  Y10T428/12188 ,  Y10T428/12347 ,  Y10T428/12361 ,  Y10T428/12396 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/1275 ,  Y10T428/12882 ,  H01L2924/00

Abstract: A printed circuit lead frame that functions as a carrier of an integrated circuit (IC) uncased chip for initial handling and testing and later as a means for bonding the chip''s contacts to printed circuitry on a supporting substrate is disclosed. The lead frame includes a flexible insulating sheet member having a plurality of inner via holes arranged in a pattern to match that of the terminal contacts on the associated chip and a plurality of outer via holes arranged in a pattern to match that of the terminal pads on the supporting substrate member. Gold bumps in each of the inner and outer via holes extend beyond the bottom surface of the sheet member to make a conductively bonded contact with the associated terminal contacts on the associated chip and the associated terminal pads on the supporting substrate member while printed circuit leads affixed to the top surface of the sheet member conductively intercouple associated pairs of inner and outer gold bumps to complete the electrical coupling of the associated chip to the supporting substrate member.

Abstract translation: 公开了用作初始处理和测试的集成电路（IC）未占用芯片的载体的印刷电路引线框，并且稍后将其作为用于将芯片的触点接合到支撑基板上的印刷电路的装置。 引线框架包括柔性绝缘片构件，其具有以与图案中的端子触点相匹配的图案布置的多个内通孔，并且以与图案中的端子焊盘相匹配的多个外通孔 支撑基板部件。 内部和外部通孔中的每一个中的金凸起延伸超过片状构件的底表面，以使与印刷电路引线固定的相关联的芯片上的相关联的端子触点和支撑衬底构件上的相关联的端子焊盘导电地接合 到片状构件的顶表面导电地相互连接相关联的内和外金凸块对，以完成相关芯片与支撑衬底构件的电耦合。

公开(公告)号：US3554877A

公开(公告)日：1971-01-12

申请号：US3554877D

申请日：1968-02-07

Applicant: US ARMY

Inventor： GEISLER ROBERT R

IPC: H05K3/00 ,  H05K3/38 ,  H05K3/42 ,  H05K3/46 ,  B32B31/14 ,  C23B5/48

CPC classification number: H05K3/429 ,  H05K3/002 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4652 ,  H05K2201/0166 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2203/1184

Abstract: THE INVENTION HEREIN IS CONCERNED WITH A METHOD OF MAKING DOUBLE-SIDED OR MULTILAYER PRINTED CIRCUIT BOARDS WITH HOLE-FREE TERMINAL LEADS ON ONE SURFCE OF THE BOARD FOR ATTACHMENT OF WIRE LEADS WHILE PROVIDING ELECTRICAL INTERCONNECTION BETWEEN CONDUCTIVE LAYERS.

公开(公告)号：US2861029A

公开(公告)日：1958-11-18

申请号：US55312855

申请日：1955-12-14

Applicant: WESTERN ELECTRIC CO

Inventor： BAIN JR LEWIS A ,  GESHNER ROBERT A

IPC: H05K1/11 ,  H05K3/06 ,  H05K3/24

CPC classification number: H05K3/244 ,  H05K1/117 ,  H05K3/061 ,  H05K3/243 ,  H05K2201/0166 ,  H05K2203/0522 ,  H05K2203/0723 ,  H05K2203/1355

公开(公告)号：US20180270953A1

公开(公告)日：2018-09-20

申请号：US15464123

申请日：2017-03-20

Applicant: Intel Corporation

Inventor： Frank Truong ,  Dilan Seneviratne

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/06 ,  H05K3/46

CPC classification number: H05K3/06 ,  H05K1/09 ,  H05K1/111 ,  H05K1/116 ,  H05K3/061 ,  H05K3/068 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/032

Abstract: Embodiments herein relate to creating a high-aspect ratio opening in a package. Embodiments may include applying a first laminate layer on a side of a substrate, applying a seed layer to at least part of the laminate layer, building up one or more copper pads on the seed layer, etching the seed layer to expose a portion of the first laminate layer, applying a second laminate layer to fill in around the sides of one or more copper pads, and removing part of the buildup copper pads. Other embodiments may be described and/or claimed.

公开(公告)号：US20160342085A1

公开(公告)日：2016-11-24

申请号：US14651193

申请日：2014-12-10

Applicant: GOO CHEMICAL CO., LTD.

Inventor： Yoshio Sakai ,  Nobuhito Hamada ,  Michiya Higuchi ,  Tokuzan Miyake

IPC: G03F7/038 ,  H05K3/28 ,  H05K1/02

CPC classification number: G03F7/031 ,  G03F7/0042 ,  G03F7/0043 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0385 ,  G03F7/0388 ,  G03F7/20 ,  G03F7/2006 ,  G03F7/26 ,  G03F7/322 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/287 ,  H05K3/3452 ,  H05K2201/0166 ,  H05K2201/068

Abstract: A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first α-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25° C., and a second α-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25° C.

Abstract translation: 液体阻焊剂组合物含有含羧基的树脂，含有选自光聚合性单体和光聚合性预聚物，光聚合引发剂和二氧化钛中的至少一种化合物的光聚合性化合物。 光聚合引发剂含有双酰基氧化膦类光聚合引发剂，25℃下为液体的第一α-羟烷基苯酮系光聚合引发剂和25℃固体的第二α-羟烷基苯酮系光聚合引发剂 C。

公开(公告)号：US09310680B2

公开(公告)日：2016-04-12

申请号：US14127078

申请日：2012-06-15

Applicant: Nobuhito Ito ,  Masao Arima

Inventor： Nobuhito Ito ,  Masao Arima

IPC: B32B27/38 ,  B32B27/42 ,  C08L61/14 ,  C08L63/10 ,  H05K1/09 ,  G03F7/038 ,  H05K3/28 ,  C08F287/00

CPC classification number: G03F7/0384 ,  B32B27/38 ,  B32B27/42 ,  C08F287/00 ,  C08L61/14 ,  C08L63/10 ,  G03F7/038 ,  G03F7/0388 ,  H05K3/287 ,  H05K2201/0166

Abstract: Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.

Abstract translation: 本发明提供一种可显影的光固化/热固性树脂组合物，其作为半导体封装的阻焊剂是重要的，具有优异的耐热冲击性和优异的耐PCT耐性，耐HAST电阻和无电镀金电镀的固化涂膜可以是 形成。 碱显影性光固化/热固性树脂组合物的特征在于包含（A）含羧基的感光性树脂，（B）光聚合引发剂，（C）嵌段共聚物和（D）热固性组分。