公开(公告)号：US20100116536A1

公开(公告)日：2010-05-13

申请号：US12379056

申请日：2009-02-11

Applicant: Myung Sam Kang

Inventor： Myung Sam Kang

IPC: H05K1/11 ,  B32B38/10 ,  B32B38/00

CPC classification number: H05K1/111 ,  H01L2924/0002 ,  H05K3/205 ,  H05K3/28 ,  H05K3/3473 ,  H05K2201/0376 ,  H05K2201/09472 ,  H05K2201/09736 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

Abstract: Disclosed is a printed circuit board having a buried solder bump, in which a circuit pattern and a solder bump formed on the circuit pattern are buried in an insulating layer, thus improving the degree of matching between the solder bump and the circuit pattern and obviating a need for an additional coining process of the solder bump. A manufacturing method thereof is also provided.

Abstract translation: 公开了一种具有掩埋焊料凸块的印刷电路板，其中形成在电路图案上的电路图案和焊料凸块被掩埋在绝缘层中，从而提高了焊料凸块与电路图案之间的匹配程度，并且消除了 需要额外的冲压焊过程。 还提供了其制造方法。

公开(公告)号：US20100044082A1

公开(公告)日：2010-02-25

申请号：US12260306

申请日：2008-10-29

Applicant: Chun-Chien Chen ,  Tsung-Yuan Chen ,  Cheng-Po Yu

Inventor： Chun-Chien Chen ,  Tsung-Yuan Chen ,  Cheng-Po Yu

IPC: H05K1/00

CPC classification number: H05K1/028 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/107 ,  H05K2201/0376 ,  H05K2203/302

Abstract: A wiring board including two wiring layers and a flexible core layer is provided. The flexible core layer is disposed between the wiring layers, and the flexible core layer is an insulator. A flexure of the wiring board is between 0 degree and 170 degrees.

Abstract translation: 提供了包括两个布线层和柔性芯层的布线板。 柔性芯层设置在布线层之间，柔性芯层是绝缘体。 接线板的挠曲度在0度到170度之间。

公开(公告)号：US20100018762A1

公开(公告)日：2010-01-28

申请号：US12502268

申请日：2009-07-14

Applicant: Hideaki YOSHIMURA ,  Norikazu OZAKI ,  Kenji IIDA ,  Tomoyuki ABE

Inventor： Hideaki YOSHIMURA ,  Norikazu OZAKI ,  Kenji IIDA ,  Tomoyuki ABE

IPC: H05K1/11 ,  H05K3/36 ,  B23P23/00

CPC classification number: H05K1/036 ,  H05K1/0366 ,  H05K3/06 ,  H05K3/107 ,  H05K3/108 ,  H05K3/421 ,  H05K3/426 ,  H05K3/4644 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/51

Abstract: A printed circuit board includes a first insulation layer that is formed of a resin material into which fiber cloth is embedded. A second insulation layer is formed of a resin material, and is stacked on a front surface of the first insulation layer on which a heating process has been performed. A conductive land is formed on a front surface of the second insulation layer. A via is provided in a through hole penetrating through the first insulation layer and the second insulation layer. The through hole is filled with a conductive material, and the via is connected to the conductive land.

Abstract translation: 印刷电路板包括由嵌入有纤维布的树脂材料形成的第一绝缘层。 第二绝缘层由树脂材料形成，并且堆叠在已经进行了加热处理的第一绝缘层的前表面上。 导电焊盘形成在第二绝缘层的前表面上。 通孔设置在穿过第一绝缘层和第二绝缘层的通孔中。 通孔填充有导电材料，并且通孔连接到导电焊盘。

公开(公告)号：US07585419B2

公开(公告)日：2009-09-08

申请号：US11154695

申请日：2005-06-17

Applicant: Joseph Cheng

Inventor： Joseph Cheng

IPC: H01B13/00 ,  B44C1/22

CPC classification number: H05K1/114 ,  H01L21/4846 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/49 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/181 ,  H05K1/113 ,  H05K3/20 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/0959 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A substrate structure and the fabrication method thereof are provided herein. The present invention utilizes a laminate as the support of the package process and then removes the laminate after the following package steps so as to obtain a quite smooth surface for using in the internal-plane structure of the circuit board and a stacking structure that can be applied to many different types of the chip package structures.

Abstract translation: 本文提供了一种衬底结构及其制造方法。 本发明采用叠层作为包装工艺的支撑体，然后在以下包装步骤之后移除层压板，以获得在电路板的内部平面结构中使用的非常光滑的表面和可以 适用于许多不同类型的芯片封装结构。

公开(公告)号：US20090205852A1

公开(公告)日：2009-08-20

申请号：US12193460

申请日：2008-08-18

Applicant: Chun-Chien Chen ,  Tsung-Yuan Chen

Inventor： Chun-Chien Chen ,  Tsung-Yuan Chen

IPC: H05K1/00 ,  H05K3/02

CPC classification number: H05K3/44 ,  H05K3/20 ,  H05K3/423 ,  H05K3/427 ,  H05K3/428 ,  H05K3/445 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2203/0369 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24917

Abstract: A manufacturing method of a circuit board is provided. A metal core is provided. A conductive layer is formed on each of some carriers. The carriers and dielectric layers are laminated at both sides of the metal core to form a stacked structure. Each of the dielectric layers is located between the corresponding carrier and the metal core, and a portion of the conductive layer is embedded in the corresponding dielectric layer. Then, the carriers are removed. A blind via and/or a through via are/is formed in the stacked structure to connect the corresponding conductive layer and the metal core and/or connect the conductive layers at both sides of the metal core, wherein the through via penetrates the metal core. The conductive layer on a surface of the dielectric layer is removed.

Abstract translation: 提供电路板的制造方法。 提供金属芯。 在一些载体的每一个上形成导电层。 载体和电介质层被层叠在金属芯的两侧以形成堆叠结构。 每个电介质层位于相应的载体和金属芯之间，并且导电层的一部分嵌入相应的介电层中。 然后，移除载体。 在堆叠结构中形成盲通孔和/或通孔，以将相应的导电层和金属芯连接和/或连接金属芯两侧的导电层，其中通孔穿过金属芯 。 去除介电层表面上的导电层。

公开(公告)号：US07531754B2

公开(公告)日：2009-05-12

申请号：US11712943

申请日：2007-03-02

Applicant: Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

Inventor： Yoshihisa Yamashita ,  Hiroki Yabe ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Satoru Tomekawa ,  Toshio Fujii ,  Seiji Karashima

IPC: H05K1/00

CPC classification number: H05K3/4084 ,  G03G15/225 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0393 ,  H05K3/102 ,  H05K3/1266 ,  H05K3/20 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0376 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0517 ,  H05K2203/1189 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A flexible substrate comprises a film, a first insulating resin layer on a front face of the film, a second insulating resin layer on a rear face of the film, a front-sided wiring pattern embedded in the first insulating resin layer, and a rear-sided wiring pattern embedded in the second insulating resin layer. A surface of the front-sided wiring pattern is flush with a surface of the first insulating resin layer, and a surface of the rear-sided wiring pattern is flush with a surface of the second insulating resin layer. A part of at least one of the front-sided wiring pattern and the rear-sided wiring pattern is dented toward a part of the other of the at least one of the front-sided wiring pattern and the rear-sided wiring pattern such that a portion of the front-sided wiring pattern and a portion of the rear-sided wiring pattern are jointed to each other to form a junction.

Abstract translation: 柔性基板包括膜，膜的正面上的第一绝缘树脂层，膜背面的第二绝缘树脂层，嵌入第一绝缘树脂层中的前侧布线图案，以及后部 嵌入在第二绝缘树脂层中的布线图案。 前侧布线图案的表面与第一绝缘树脂层的表面齐平，并且背面布线图案的表面与第二绝缘树脂层的表面齐平。 前侧布线图案和背面布线图案中的至少一个的一部分朝向前侧布线图案和背面布线图案中的至少一个中的另一个的一部分凹陷，使得 前侧布线图案的一部分和背面布线图案的一部分彼此接合以形成结。

公开(公告)号：US20090106977A1

公开(公告)日：2009-04-30

申请号：US12149836

申请日：2008-05-08

Applicant: Jin-Cheol Kim ,  Jun-Rok Oh

Inventor： Jin-Cheol Kim ,  Jun-Rok Oh

IPC: H05K3/40

CPC classification number: H05K3/107 ,  H05K3/06 ,  H05K3/4069 ,  H05K2201/0129 ,  H05K2201/0376 ,  H05K2203/0278 ,  H05K2203/1105 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A manufacturing method of a printed circuit board is disclosed. The method may include: forming a circuit pattern on a surface of an insulation layer, made primarily from a thermoplastic resin, such that the circuit pattern protrudes from the surface of the insulation layer, and burying the circuit pattern in the insulation layer by pressing the circuit pattern.

Abstract translation: 公开了一种印刷电路板的制造方法。 该方法可以包括：在主要由热塑性树脂制成的绝缘层的表面上形成电路图案，使得电路图案从绝缘层的表面突出，并且通过按压绝缘层将电路图案掩埋在绝缘层中 电路图案。

公开(公告)号：US20090008143A1

公开(公告)日：2009-01-08

申请号：US12155838

申请日：2008-06-10

Applicant: Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

Inventor： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Byung-Youl Min ,  Myung-Sam Kang

IPC: H01K3/22 ,  H01R12/04

CPC classification number: H05K3/107 ,  H05K3/205 ,  H05K3/465 ,  H05K3/4658 ,  H05K2201/0191 ,  H05K2201/0376 ,  Y10T29/49158

Abstract: A board having buried patterns is disclosed. The board may include an insulation panel, a first pattern buried in one side of the insulation panel, a second pattern buried in the other side of the insulation panel with a predetermined insulating thickness between the first pattern and the second pattern, and a via which electrically connects the first pattern and the second pattern. The board having buried patterns according to certain embodiments of the invention can have greater rigidity compared to a board having exposed patterns, for the same insulating thickness. Also, a carrier-insulation set having a particular amount of thickness can be utilized to satisfy the thickness requirement in employing an existing roller apparatus intended for thicker boards.

Abstract translation: 公开了具有掩埋图案的板。 板可以包括绝缘板，埋在绝缘板的一侧中的第一图案，在第一图案和第二图案之间以预定的绝缘厚度掩埋在绝缘板的另一侧中的第二图案，以及通孔， 电连接第一图案和第二图案。 对于相同的绝缘厚度，具有根据本发明的某些实施例的埋设图案的板可以具有比具有暴露图案的板更大的刚性。 此外，可以利用具有特定厚度的载体绝缘组件来满足使用用于较厚板的现有辊装置的厚度要求。

公开(公告)号：US20080314865A1

公开(公告)日：2008-12-25

申请号：US11924408

申请日：2007-10-25

Applicant: Jerry Ok ,  Robert J. Greenberg

Inventor： Jerry Ok ,  Robert J. Greenberg

IPC: C03B29/00 ,  H01B13/00

CPC classification number: H05K3/4061 ,  B32B37/14 ,  C04B35/10 ,  C04B37/00 ,  C04B2237/064 ,  H05K1/0306 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/12 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4629 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10T156/10

Abstract: A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.

Abstract translation: 一种制造密封电馈通的方法。 该方法包括提供具有上表面和下表面的陶瓷片，在从所述上表面延伸到所述下表面的所述陶瓷片中形成至少一个通孔，将导电厚膜糊剂插入所述通孔中，将陶瓷片层压 在上陶瓷片和下陶瓷片之间通过孔填充糊状物以形成层压陶瓷基板，将层叠的陶瓷基板烧制至烧结层叠陶瓷基板的温度，并使填充有通孔的浆料形成金属化通孔， 层叠陶瓷基板，以形成围绕所述金属化通孔的气密密封，以及从烧结的层叠陶瓷基板上除去上陶瓷片和下陶瓷片材，以露出金属化通孔的上表面和下表面。

公开(公告)号：US20080314502A1

公开(公告)日：2008-12-25

申请号：US11875198

申请日：2007-10-19

Applicant: Jerry Ok ,  Robert J. Greenberg

Inventor： Jerry Ok ,  Robert J. Greenberg

IPC: B29C65/02

CPC classification number: H05K3/4061 ,  B32B37/14 ,  C04B35/10 ,  C04B37/00 ,  C04B2237/064 ,  H05K1/0306 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/12 ,  H05K3/1225 ,  H05K3/1233 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4629 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2203/1147 ,  H05K2203/308 ,  Y10T156/10

Abstract: A method for fabricating the hermetic electrical feedthrough. The method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thickfilm paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via.

Abstract translation: 一种制造密封电馈通的方法。 该方法包括提供具有上表面和下表面的陶瓷片，在从所述上表面延伸到所述下表面的所述陶瓷片中形成至少一个通孔，将导电厚膜糊剂插入所述通孔中，将陶瓷片层压 在上陶瓷片和下陶瓷片之间通过孔填充糊状物以形成层压陶瓷基板，将层叠的陶瓷基板烧制至烧结层叠陶瓷基板的温度，并使填充有通孔的浆料形成金属化通孔， 层叠陶瓷基板，以形成围绕所述金属化通孔的气密密封，以及从烧结的层叠陶瓷基板上除去上陶瓷片和下陶瓷片材，以露出金属化通孔的上表面和下表面。