Abstract:
A strap band including a flexible wire bus having electrodes and wires coupled with the electrodes is described. The wire bus may be include in a strap band formed by molding an inner strap, mounting the wire bus in the inner strap, and injection molding an outer strap over the inner strap and wire bus to form a strap band. The electrodes may be positioned on the inner strap to accommodate a target range of a body portion the strap band may be worn on. A material of the strap band and a material the wire bus may be selected to allow a low coefficient of friction between the wire bus and strap band so that loads applied to the strap band may not be coupled with the wire bus or cause damage to wires due to pull and/or torsional load forces applied to the strap band.
Abstract:
A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.
Abstract:
A mother panel including second sealing members which are disposed at an outer side of each of first sealing members which surround display devices between a first mother substrate and a second mother substrate and have a plurality of unit patterns whose width in a second direction which is perpendicular to a first direction which is a direction away from each of the first sealing members decreases along the first direction.
Abstract:
A capacitor element includes a plurality of flexible base material layers that are stacked upon each other, and conductor patterns that are provided on the flexible base material layers and that define a capacitor. The capacitor element also includes a flexible portion, and a rigid portion having a larger number of stacked flexible base material layers than the flexible portion. Conductor pattern pairs that define the capacitor are provided in both the flexible portion and the rigid portion. The conductor pattern pair that is provided in the rigid portion is connected in series with the conductor pattern pair that is provided in the flexible portion. The conductor pattern pair that is provided in the rigid portion has a larger number of tiers than the conductor pattern pair that is provided in the flexible portion.
Abstract:
An apparatus includes a first electronic device mounted on a first substrate and a second electronic device mounted on a second substrate. In some embodiments, the second substrate is configured to be removably connected to the first electronic device. The second electronic device is mountable on either planar surface of the second substrate.
Abstract:
A 3D stacked package structure includes a first unit, a molding unit, a conductive unit and a second unit. The first unit includes a first substrate and at least one first electronic component, and the first substrate has at least one runner and at least one first conductive pad. The molding unit includes a top portion, a frame, and at least one connection connected between the top portion and the frame. The conductive unit includes at least one conductor passing through the frame and electrically connected to the first conductive pad. Therefore, the first unit can be stacked on the second unit through the frame of the molding unit, and the first unit can be electrically connected to the second unit through the conductor of the conductive unit.
Abstract:
An electronic controller for electric power steering includes a first board, a second board, an insert molded component, a heat sink, and a protective cover. First surface-mounted components are mounted on the first board. Second surface-mounted components having a higher tolerant current capacity than that of the first surface-mounted components are mounted on the second board. The insert molded component includes connectors mounted at a first end portion of the second board and mounted at a second end portion located vertically to the first end portion. The heat sink externally radiates heat transferred from the second surface-mounted component to the second board. The protective cover is fixed to the heat sink to cover the first board and the second board on which the insert molded component is mounted.
Abstract:
An in-vehicle multimedia device includes: an antenna module which has an antenna body arranged on the outer side surface of the roof of a vehicle, a first circuit substrate coupled to the antenna body, a connector part provided with through-holes therein formed to project downward from the lower surface of the antenna body, and first connection pins accommodated in the respective through-holes of the connector part and electrically connected with the first circuit substrate, a tuner part module which has a tuner part body arranged on the inner side surface of the roof of the vehicle, a second circuit substrate coupled to the tuner part body, and second connection pins provided in a coupling groove such that the connector part is inserted and coupled; and a coupling member that couples the antenna module and the tuner part module to each other.
Abstract:
A sleeve for simple assembly of in-vivo devices, such as endoscopy capsules, is provided. The sleeve comprises grippers and leaf springs at either end to hold the rigid portions of a rigid-flex PCB (printed circuit board) in a folded configuration before the PCB is inserted into an in-vivo device's housing. A method of assembly of the rigid-flex PCB into the sleeve is provided.
Abstract:
A control system may include a plurality of terminal boards. Each of the plurality of terminal boards may at least include a power pin. The definition of the power pin on at least one of the plurality of terminal boards may be different from the definition of the power pin on another one of the plurality of terminal boards. Thus, if the at least one of the plurality of terminal boards is connected to a wrong input/output module, the input/output module will not get a process power supplied via the power pin on the terminal board. Therefore, a wrong input/output signal will not be transferred, and the input/output module will not be damaged even if a higher process voltage is provided by a wrong terminal board.