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公开(公告)号:US09955570B2
公开(公告)日:2018-04-24
申请号:US14975581
申请日:2015-12-18
Applicant: Apple Inc.
Inventor: Matthew W. Blum , Christine A. Laliberte , Corey N. Axelowitz , James Y. Yap
CPC classification number: H05K1/028 , H05K1/0216 , H05K1/0218 , H05K1/118 , H05K1/14 , H05K1/147 , H05K1/181 , H05K1/189 , H05K5/0247 , H05K2201/05 , H05K2201/056 , H05K2201/0715
Abstract: The subject matter of this disclosure relates to a flexible circuit for carrying a signal between electrical components that includes boosting circuitry for mitigating the effects of signal degradation. More particularly the flexible circuit can carry a signal between a main logic board and an input/output board supporting input/output ports of a portable electronic device. The flexible circuit can be configured with bends in order to meet packaging constraints such as avoiding contact with components obstructing a direct path between connectors of the electrical components. Additional bends can also be included in the flexible that facilitate the assembly of the portable electronic device.
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公开(公告)号:US20180088716A1
公开(公告)日:2018-03-29
申请号:US15710342
申请日:2017-09-20
Applicant: Samsung Display Co., Ltd.
Inventor: Min Soo KIM
CPC classification number: G06F3/0412 , G06F3/044 , G06F3/045 , G06F2203/04103 , G06F2203/04111 , H05K1/0393 , H05K2201/05
Abstract: There are provided a display device and a method of manufacturing the same. The display device includes a display panel and a window disposed on the display panel. The window includes a first sub-window and a second sub-window and a touch sensor disposed between the first sub-window and the second sub-window.
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公开(公告)号:US20180070437A1
公开(公告)日:2018-03-08
申请号:US15716541
申请日:2017-09-27
Applicant: Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
Inventor: MING-JAAN HO , HSIAO-TING HSU
IPC: H05K1/02 , H05K1/09 , C08K3/28 , C09D5/24 , C09D125/18 , H01B1/22 , C08F112/32 , H05K1/11
CPC classification number: H05K1/0219 , C08F12/22 , C08F112/32 , C08K3/28 , C08K2201/001 , C09D5/24 , C09D125/18 , H01B1/22 , H05K1/09 , H05K1/115 , H05K2201/0141 , H05K2201/0215 , H05K2201/0329 , H05K2201/05
Abstract: A circuit board includes a flexible board, a composite film, and a copper layer. The composite film is formed on the flexible board and defines at least one through hole. The composite film includes a base layer having an active surface, and a conductive layer formed by coated a conductive polymer on the active surface. The conductive polymer is made by a mixture comprising liquid crystal monomers, a silver complex, an initiator, and a catalytic agent, and a solvent, the mixture is heated to undergo atom transfer radical polymerization. The copper layer covers the conductive layer and an inner wall of each of the at least one through hole. The copper layer is electrically connected to the flexible substrate by the through hole.
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公开(公告)号:US20180049309A1
公开(公告)日:2018-02-15
申请号:US15793524
申请日:2017-10-25
Applicant: Intel Corporation
Inventor: Adel A. Elsherbini , Aleksandar Aleksov , Shawna Liff
CPC classification number: H05K1/028 , H05K1/0283 , H05K1/0393 , H05K1/115 , H05K1/118 , H05K1/181 , H05K3/22 , H05K3/284 , H05K3/301 , H05K3/4691 , H05K2201/05 , H05K2201/057 , H05K2201/09263 , H05K2201/095 , H05K2203/1316
Abstract: Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.
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公开(公告)号:US09891351B2
公开(公告)日:2018-02-13
申请号:US15032259
申请日:2015-09-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Wusheng Li , Ki Man Kim
CPC classification number: G02B5/021 , B05D1/005 , G02B1/14 , G02B5/003 , G02B5/02 , G02B5/0215 , G02B5/0221 , G02B5/0226 , G02B5/0268 , G03F7/70025 , G06F3/041 , G06F3/0412 , G06F3/0416 , G06F3/044 , G06F2203/04102 , G06F2203/04103 , H05K1/028 , H05K2201/05
Abstract: The present disclosure provides a display substrate. The display substrate includes a substrate having a display area and a border area surrounding the display area; a non-black photo-resist layer formed on the substrate in the border area; and a black photo-resist layer formed on the non-black photo-resist layer. The non-black photo-resist layer interfaces the black photo-resist layer with a diffusion structure.
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公开(公告)号:US09804705B2
公开(公告)日:2017-10-31
申请号:US14435920
申请日:2014-08-29
Inventor: Xiuzhu Tang , Bin Ji
CPC classification number: G06F3/0418 , G06F3/0412 , G06F3/044 , G06F2203/04103 , G06F2203/04107 , H05K1/0219 , H05K1/025 , H05K1/0259 , H05K1/0298 , H05K1/162 , H05K3/4644 , H05K2201/05
Abstract: The present disclosure provides a flexible printed circuit board (FPCB), a method for manufacturing the FPCB, and a capacitive touch display device with the FPCB. The FPCB comprises an FPCB substrate and a common electrode voltage (VCOM) filter circuit arranged on the FPCB substrate. The FPCB further includes one or more filter units. the filter units comprises: a conduction layer, arranged on the FPCB substrate and electrically connected to a VCOM output end of the VCOM filter circuit; an isolation layer, arranged on the conduction layer; and a shielding film, which is grounded, arranged on the isolation layer and arranged parallel with the conduction layer.
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公开(公告)号:US09763326B1
公开(公告)日:2017-09-12
申请号:US14304029
申请日:2014-06-13
Applicant: Flextronics AP, LLC
Inventor: Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.
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公开(公告)号:US20170254680A1
公开(公告)日:2017-09-07
申请号:US15155764
申请日:2016-05-16
Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
Inventor: TSUNG-JU WU , JEN-TSORNG CHANG , HSIN-PEI HSIEH , YI-CHENG LIN
CPC classification number: G01D11/30 , G06F3/0414 , H05K1/0393 , H05K1/144 , H05K1/16 , H05K1/181 , H05K3/284 , H05K2201/042 , H05K2201/05 , H05K2201/10151 , H05K2201/10242 , Y02P70/611
Abstract: A high density sensor module includes a first substrate, a plurality of first sensors positioned on the first substrate, a plurality of first conductive rods positioned on the corresponding first sensors, a first package resin member covering the first sensors and one end of each of the first conductive rods, a second substrate positioned on the first package resin member, a plurality of second sensors positioned on the second substrate, and a second package resin member covering the second sensors and another end of each of the first conductive rods. The first conductive rods pass through the first package resin member and the second substrate. The high density sensor module has a two-layer structure to increase the number of the sensors such that the sensing density and resolution of the high-density sensor module are increased.
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公开(公告)号:US09748469B2
公开(公告)日:2017-08-29
申请号:US14979769
申请日:2015-12-28
Applicant: LG DISPLAY CO., LTD.
Inventor: MyungJin Lim , SuSeok Choi , Yong-Su Ham , Taeheon Kim , YongWoo Lee , Seulgi Choi
IPC: H01L41/083 , H05K5/00 , H01L41/04 , H05K1/02 , G06F1/16 , H01L41/193 , G09F9/30 , H01L41/09 , H01L41/277
CPC classification number: H01L41/083 , G06F1/1652 , G06F3/016 , G09F9/301 , H01L41/042 , H01L41/0926 , H01L41/193 , H01L41/277 , H05K1/028 , H05K5/0017 , H05K2201/05
Abstract: Provided is a multilayer actuator and a display device comprising the same with improved driving displacement that includes, for example, a plurality of electroactive layers, wherein the electroactive layers comprise a ferroelectric polymer, and polarization directions of all electroactive layers are substantially the same.
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公开(公告)号:US20170245362A1
公开(公告)日:2017-08-24
申请号:US15436960
申请日:2017-02-20
Applicant: NIPPON MEKTRON, LTD.
Inventor: Masayuki Iwase
CPC classification number: H05K1/0283 , H05K1/0393 , H05K1/095 , H05K3/1216 , H05K3/125 , H05K3/1275 , H05K3/38 , H05K3/4038 , H05K3/4617 , H05K2201/05 , H05K2201/09263 , H05K2201/09854 , H05K2203/0278 , H05K2203/0534 , H05K2203/1126 , H05K2203/30
Abstract: A stretchable circuit board includes plural stretchable bases, and plural stretchable wiring portions, at least one of which is provided on each of main surfaces, facing each other, of the plural stretchable bases, in which the stretchable wiring portions provided on the main surfaces are electrically continuous with each other through a connecting portion.
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