公开(公告)号：US07753744B2

公开(公告)日：2010-07-13

申请号：US12409955

申请日：2009-03-24

Applicant: Victor Zaderej ,  David L. Brunker ,  Philip J. Dambach

Inventor： Victor Zaderej ,  David L. Brunker ,  Philip J. Dambach

IPC: H01R9/24

CPC classification number: H01R43/24 ,  H01P1/04 ,  H01P3/02 ,  H01R12/724 ,  H01R13/405 ,  H01R13/6461 ,  H01R13/6474 ,  H05K1/024 ,  H05K3/107 ,  H05K3/308 ,  H05K3/403 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09645 ,  H05K2201/09981 ,  H05K2201/10893 ,  Y10S439/931 ,  Y10T29/4922 ,  Y10T29/49222

Abstract: A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make at least one change in direction, thereby permitting the use of such connector to interconnect elements lying in two different planes. The transmission lines include slots that extend within the frame and which define opposing, conductive surfaces formed on the dielectric body which are separated by an intervening air gap.

公开(公告)号：US07675401B2

公开(公告)日：2010-03-09

申请号：US11148444

申请日：2005-06-09

Applicant: Ka Wai Eric Cheng ,  Chak Yin Tang

Inventor： Ka Wai Eric Cheng ,  Chak Yin Tang

IPC: H01C1/012

CPC classification number: H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/101 ,  H05K3/4069 ,  H05K2201/0187 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/086 ,  H05K2201/09118 ,  H05K2203/0113 ,  Y10T29/49128 ,  Y10T29/49176

Abstract: A circuit board, for an electronic circuit having a passive circuit component, has a component region, a non-component region, and circuit wiring conductors on its surface. The component region includes a polymer composition comprising a mixture of polymer resin and filler material that, in combination with the circuit wiring conductors, forms the passive circuit component.

Abstract translation: 用于具有无源电路部件的电子电路的电路板在其表面上具有分量区域，非分量区域和电路布线导体。 组分区域包括聚合物组合物，其包含与电路布线导体组合形成无源电路部件的聚合物树脂和填充材料的混合物。

公开(公告)号：US07652895B2

公开(公告)日：2010-01-26

申请号：US10510302

申请日：2003-04-10

Applicant: Fransiscus Gerardus Coenradus Verweg ,  Johannus Wilhelmus Weekamp

Inventor： Fransiscus Gerardus Coenradus Verweg ,  Johannus Wilhelmus Weekamp

IPC: H05K7/00

CPC classification number: B81B7/007 ,  H01L23/10 ,  H01L23/4985 ,  H01L27/14625 ,  H01L2924/0002 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/183 ,  H05K3/06 ,  H05K3/20 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K2203/302 ,  H01L2924/00

Abstract: The invention relates to an electric insulating body (2) provided with a conductor pattern (1) and an electronic device (10) comprising such a body (2) and at least one electronic element (30). According to the invention, the body (2) has first and second faces (2A, 2B) in between of which an angle of less than 180 degrees is defined, wherein the conductor pattern (1) of the body (2) extends over both faces (2A, 2B), which body (2) carries both the conductor pattern (1) and the electronic element (30). The conductor pattern (1) comprises strip-shaped regions (1A) and regions (1B) with a larger width than the strip-shaped regions (1A), which regions (1B) are suitable for electrically contacting the electronic element (30). The electronic element (30) is, for example, a camera. The device (10) with such a camera is particularly suitable for use in a mobile communication apparatus.

Abstract translation: 本发明涉及一种设置有导体图案（1）的电绝缘体（2）和包括这种主体（2）和至少一个电子元件（30）的电子设备（10）。 根据本发明，主体（2）具有其间限定了小于180度的角度的第一和第二面（2A，2B），其中主体（2）的导体图案（1）延伸越过两者 面（2A，2B），该主体（2）承载导体图案（1）和电子元件（30）。 导体图案（1）包括带状区域（1A）和宽度大于带状区域（1A）的区域（1B），该区域（1B）适于电接触电子元件（30）。 电子元件（30）例如是相机。 具有这种相机的装置（10）特别适用于移动通信装置。

公开(公告)号：US20090300910A1

公开(公告)日：2009-12-10

申请号：US11989108

申请日：2006-04-10

Applicant: Markus Pfletschinger ,  Bernd Schwarz ,  Jan Krüger ,  Ingmar Petersen

Inventor： Markus Pfletschinger ,  Bernd Schwarz ,  Jan Krüger ,  Ingmar Petersen

IPC: H05K3/20

CPC classification number: H05K3/207 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/0116 ,  H05K2201/09118 ,  H05K2203/1327 ,  Y10T29/49128

Abstract: The invention relates to a method for applying electrical conductor patterns (1) to a target component (9) of plastic, it being provided according to the invention that a transfer medium on which the conductor patterns (1) are detachably arranged is placed in a mould part (3, 4) and the mould part (3, 4) is filled with a polymer material, the finished target component (9) being removed from the mould part (3, 4) after the filling.

Abstract translation: 本发明涉及一种用于将电导体图案（1）施加到塑料的目标部件（9）的方法，根据本发明，根据本发明提供了一种可拆卸地布置导体图案（1）的转印介质， 模具部件（3,4）和模具部件（3,4）填充有聚合物材料，在填充之后将最终的目标部件（9）从模具部件（3,4）中取出。

公开(公告)号：US20090266596A1

公开(公告)日：2009-10-29

申请号：US12421142

申请日：2009-04-09

Applicant: Jung-Chien Chang

Inventor： Jung-Chien Chang

IPC: H05K1/18 ,  H01L21/329 ,  H05K3/30

CPC classification number: H05K1/16 ,  H01L27/3297 ,  H01L2227/326 ,  H05K3/205 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/1469

Abstract: The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic component to electrically connect the first circuit; forming a blanket dielectric layer enclosing the electronic component; and removing the substrate.

Abstract translation: 本发明公开了一种印刷电路板。 印刷电路板通过提供基板的方法制成; 在衬底上形成第一电路; 在衬底上沉积薄膜; 通过薄膜在基板上构建电子部件，并允许电子部件电连接第一电路; 形成围绕所述电子部件的覆盖介电层; 并去除衬底。

公开(公告)号：US07572402B2

公开(公告)日：2009-08-11

申请号：US11174696

申请日：2005-07-05

Applicant: Steven J. Roskowski ,  Kenneth W. Morgan ,  Gregg W. Petrosky ,  Gregory S. Lewis

Inventor： Steven J. Roskowski ,  Kenneth W. Morgan ,  Gregg W. Petrosky ,  Gregory S. Lewis

IPC: B29C45/14

CPC classification number: H05K3/202 ,  H05K1/0293 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09118 ,  H05K2203/0195 ,  H05K2203/175 ,  Y10T29/49726 ,  Y10T83/04

Abstract: A method is provided for the punching of a bridge break and thereafter sealing the bridge break during the injection molding process of the lead frame. The bridge breaking tool is placed over the bridge that is to be broken. The collar presses down on the circuit and the punch presses down on the bridge with enough force to form the bridge break. Once the bridge break is formed the punch is retracted from the cavity of the template and molten polymer is injected to flow around the ends of the bridge break. The bridge breaking tool's hold down collars and retracted punch form a molding area for molten polymer to flow over the bridge break and the exposed circuit area. The bridge breaking tool is retracted after the bridge break is encased in the cured molten polymer and the cured molten polymer forms a lead frame structure.

Abstract translation: 提供了一种用于冲压桥接断裂的方法，此后在引线框架的注射成型过程中密封桥接断裂。 桥梁破坏工具放置在待破坏的桥梁上。 衣领按下电路，冲头用足够的力压在桥上，形成桥梁断裂。 一旦形成桥断裂，冲模从模板的空腔缩回，并且注入熔融的聚合物以绕桥断端的端部流动。 桥式破碎工具压紧套环和缩回冲头，形成熔融聚合物的模制区域，以流过桥接断裂和暴露的电路区域。 桥断裂工具在桥接断裂被包裹在固化的熔融聚合物中之后缩回，并且固化的熔融聚合物形成引线框架结构。

公开(公告)号：US07562804B2

公开(公告)日：2009-07-21

申请号：US10810040

申请日：2004-03-26

Applicant: Donald A. Ice

Inventor： Donald A. Ice

IPC: B23K31/02

CPC classification number: H05K3/3405 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2201/10924

Abstract: Methods of manufacturing optical transceiver modules using lead frame connectors that connect optical sub-assemblies to printed circuit boards. The lead frame connectors include a conductive lead structure that is encased in an insert injection molded plastic casing. The lead frame connector is aligned with the leads that protrude from the back end of the corresponding optical sub-assembly (OSA). The leads pass through corresponding holes in the lead frame connector and are soldered to the conductors of the lead frame assembly. Once the soldering has been performed, the combined OSA and lead frame connector becomes a surface mount device that can then be mounted to the PCB. Assembling an optical transceiver using the lead frame connectors is generally less expensive and more reliable compared to the use of conventional flexible printed circuit board connectors.

Abstract translation: 使用将光学子组件连接到印刷电路板的引线框架连接器制造光收发器模块的方法。 引线框架连接器包括被封装在插入式注模塑料外壳中的导电引线结构。 引线框架连接器与从相应的光学子组件（OSA）的后端突出的引线对准。 引线穿过引线框架连接器中的相应的孔，并被焊接到引线框架组件的导体。 一旦执行了焊接，组合的OSA和引线框架连接器就成为一个表面贴装器件，然后可以安装到PCB上。 与使用常规柔性印刷电路板连接器相比，组装使用引线框连接器的光收发器通常更便宜并且更可靠。

公开(公告)号：US07560153B2

公开(公告)日：2009-07-14

申请号：US11103833

申请日：2005-04-11

Applicant: Hitoshi Takanashi

Inventor： Hitoshi Takanashi

IPC: B32B1/04 ,  H05K5/06 ,  H01R13/58 ,  H01R13/405

CPC classification number: H01R43/24 ,  B29C45/14065 ,  B29C45/14377 ,  B29C45/14639 ,  B29C45/1671 ,  B29C2045/14131 ,  H05K3/0058 ,  H05K3/202 ,  H05K2201/09118 ,  H05K2203/1327 ,  Y10T428/22 ,  Y10T428/23 ,  Y10T428/24612

Abstract: A casing (10) is formed by insert molding using an inner portion (30) holding busbars (20) as an insert. The inner portion 30 includes an interlocking portion (33) to be hooked in a mold for molding the casing (10), and is so positioned and supported in the mold by the presence of the interlocking portion (33) as to project from the inner wall surface of the mold. The interlocking portion (33) is formed to project toward the inside of the casing (10) from the inner surface of the casing (10). The casing (10) is formed by covering the inner portion (30) excluding the interlocking portion (33) by a resin portion (13).

Abstract translation: 通过使用保持母线（20）作为插入件的内部部分（30）通过插入成型形成壳体（10）。 内部部分30包括钩在联接部分（33）中，用于模制壳体（10）的模具中，并且通过存在互锁部分（33）从内部突出而定位并支撑在模具中 模具的墙面。 互锁部33形成为从壳体10的内表面向壳体10的内侧突出。 壳体（10）通过树脂部（13）覆盖除了互锁部（33）以外的内部（30）而形成。

公开(公告)号：US07556405B2

公开(公告)日：2009-07-07

申请号：US11495043

申请日：2006-07-28

Applicant: Howard A. Kingsford ,  Kristel L. Ferry ,  William P. Clune ,  Mark A. Clarner ,  Bryan H. Blackmon

Inventor： Howard A. Kingsford ,  Kristel L. Ferry ,  William P. Clune ,  Mark A. Clarner ,  Bryan H. Blackmon

IPC: F21V29/00

CPC classification number: H05K3/0014 ,  B29C2043/465 ,  B29L2031/729 ,  F21S4/20 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/183 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/301 ,  H05K3/326 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/066 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2201/2036 ,  H05K2201/209 ,  H05K2203/0108 ,  H05K2203/0113 ,  H05K2203/0143 ,  H05K2203/1189 ,  H05K2203/1545 ,  Y10S362/80

Abstract: A flexible circuit has a roll-molded thermoplastic resin base sheet with an integrally molded mounting structure located to receive a light emitting diode device in an illuminating position. The mounting structure is a pin receptacle constructed to receive a pin of the light emitting diode device. An electrically conductive portion is carried by the resin base and positioned for electric connection to conductors of the device. Another flexible circuit carries discrete integrated circuit chips and a field of fastener elements extending from a surface of a resin strip carrying conductive traces interconnecting the chips.

Abstract translation: 柔性电路具有卷成型热塑性树脂基片，其具有整体模制的安装结构，其被定位成在发光位置接收发光二极管器件。 安装结构是构造成接收发光二极管器件的引脚的引脚插座。 导电部分由树脂基底承载并且定位成与装置的导体电连接。 另一个柔性电路承载分离的集成电路芯片和从承载导电迹线的树脂带的表面延伸的紧固件元件的领域，互连芯片。

公开(公告)号：US07540747B2

公开(公告)日：2009-06-02

申请号：US11381108

申请日：2006-05-01

Applicant: Donald A. Ice ,  Darin J. Douma ,  Phillip Anthony Kiely

Inventor： Donald A. Ice ,  Darin J. Douma ,  Phillip Anthony Kiely

IPC: H01R12/00

CPC classification number: H01R13/6608 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4279 ,  G02B6/428 ,  H01L23/495 ,  H01L2924/0002 ,  H01R12/7082 ,  H01R13/405 ,  H05K1/023 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2203/302 ,  H01L2924/00

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

Abstract translation: 本发明的示例性实施例示出了用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器。 引线框架连接器包括被封装在多个聚合物壳体中的导电引线结构。 聚合物壳体为引线框架中的导体提供电绝缘以及用于成品部件的机械支撑。 一个或多个无源部件可以安装到引线框架连接器的导体，以有助于光学子组件，引线框架连接器和印刷电路板之间的阻抗匹配。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以在光学子组件和印刷电路板之间建立连接。