公开(公告)号：US20040173884A1

公开(公告)日：2004-09-09

申请号：US10744098

申请日：2003-12-24

Inventor： Shuji Kashiwagi ,  Takahiko Nagakubo

IPC: H01L023/495

CPC classification number: H05K1/118 ,  H01L2924/0002 ,  H05K3/0032 ,  H05K3/361 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2203/167 ,  H01L2924/00

Abstract: A novel flexible printed circuit substrate can be processed into a flexible printed circuit board having a high-accuracy connecting part which does not cause a connection failure when it is connected to a connector even if a pitch between two adjacent terminals is further reduced. The flexible printed circuit substrate has dummy patterns which are formed, simultaneously with the terminals, on the sides of the connecting part, in a shape corresponding to the outline of both sides of connecting part which are used for positioning the terminals when the connecting part is attached to the connector. The dummy patterns are used as masks when a base film is subjected to a laser process.

Abstract translation: 一种新颖的柔性印刷电路基板可以加工成具有高精度连接部件的柔性印刷电路板，即使连接到连接器上也不会导致连接故障，即使两个相邻端子之间的间距进一步减小。 柔性印刷电路基板具有与端子同时形成在连接部的侧面上的虚拟图案，其形状与连接部的两侧的轮廓相对应，当连接部为 连接到连接器。 当基膜经受激光处理时，虚设图案用作掩模。

公开(公告)号：US20040014336A1

公开(公告)日：2004-01-22

申请号：US10197378

申请日：2002-07-17

Inventor： Nicholas G.L. Merz

IPC: H01R012/00

CPC classification number: H01R27/00 ,  H01R12/721 ,  H01R13/659 ,  H01R13/6658 ,  H01R27/02 ,  H05K1/117 ,  H05K2201/09145 ,  H05K2201/10325

Abstract: An electronic device having one or more integral connectors is disclosed. The connector includes an electromagnetically-shielded cavity defined by an outer shell integrally formed in the housing and having a cross-sectional profile of a plug to which the connector may mate. The connector also includes a tongue integrally formed in and extending from a component (such as a printed circuit board) of the electronic device and protruding into the cavity. The tongue may have one or more electrical contacts on one or both sides. The connector may also include one or more snap features for retaining a mated plug at a predetermined force. The connectors may conform to one or more connector standards, such as the Universal Serial Bus (USB) standard and/or the IEEE 1394 (FireWirenull) standard. Devices incorporating such integral connectors may be smaller and manufactured less expensively than devices having conventional, non-integral, connectors.

Abstract translation: 公开了一种具有一个或多个整体连接器的电子设备。 该连接器包括由外壳整体形成并具有连接器可配合的插头的横截面轮廓限定的电磁屏蔽空腔。 连接器还包括一体地形成在电子设备的部件（例如印刷电路板）中并从电子设备的部件（例如印刷电路板）延伸并突出到空腔中的舌片。 舌头可以在一侧或两侧具有一个或多个电触点。 连接器还可以包括用于以预定的力保持配合的塞子的一个或多个卡扣特征。 连接器可以符合一个或多个连接器标准，例如通用串行总线（USB）标准和/或IEEE 1394（FireWire）标准）。 结合这种整体连接器的装置可以比具有传统的非整体连接器的装置更小并且制造成本更低。

公开(公告)号：US06670557B2

公开(公告)日：2003-12-30

申请号：US10001668

申请日：2001-10-23

Applicant: Martin Gehrke ,  Torsten Pechstein

Inventor： Martin Gehrke ,  Torsten Pechstein

IPC: H05K116

CPC classification number: G01D3/08 ,  G01D11/245 ,  G01N27/28 ,  H05K1/02 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2201/10151 ,  H05K2203/1173

Abstract: A design for constructing an input circuit to receive and process an electrical signal, such as a voltage signal from a voltage source, where the input circuit has an extremely high resistance of at least 1011 ohms and is located on a printed circuit board. A first area of the printed circuit board carrying components of the input circuit is separated from a second area surrounding or contiguous to it by a channel-shaped recess to preserve the high resistance of the circuit even under operating conditions and at high relative humidity. The circuit is configured in such a way that the channel-shaped recess terminates in the interior of the printed circuit board and is extended in the direction of the thickness of the printed circuit board immediately up to a moisture-impermeable barrier layer which underlies the first area of the printed circuit board. The channel-shaped recess and the first area are filled and surrounded by a cohesive moisture-impermeable material.

Abstract translation: 一种用于构造输入电路以接收和处理诸如来自电压源的电压信号的输入电路的设计，其中输入电路具有至少10 11欧姆的极高电阻并位于印刷电路板上 。 承载输入电路部件的印刷电路板的第一区域与通道形凹槽周围或与其相邻的第二区域分开，即使在操作条件和高相对湿度下也能保持电路的高电阻。 该电路被配置成使得通道形状的凹陷终止于印刷电路板的内部，并且在印刷电路板的厚度方向上立刻延伸到不透水的阻挡层，该阻挡层位于第一 印刷电路板的面积。 通道形凹部和第一区域被凝聚的不透水材料填充并包围。

公开(公告)号：US06469907B1

公开(公告)日：2002-10-22

申请号：US09694540

申请日：2000-10-23

Applicant: Alex Faveluke ,  Walt Noll

Inventor： Alex Faveluke ,  Walt Noll

IPC: H05K702

CPC classification number: H05K5/065 ,  H05K1/144 ,  H05K1/147 ,  H05K3/202 ,  H05K3/361 ,  H05K3/4691 ,  H05K7/1417 ,  H05K7/1432 ,  H05K2201/09145 ,  H05K2201/1084 ,  H05K2201/10924 ,  H05K2203/167

Abstract: Packaging for power circuitry. A circuit board and a power lead frame are packaged together in a module. In addition to providing electrical connections to power circuitry, the lead frame is employed to fix or partially fix the location of the circuit board in the package. For this purpose, one of the power lead frame and the circuit board includes a male portion and the other of the power lead frame and the circuit board includes a complementary female portion for mechanically coupling the circuit board and the lead frame.

Abstract translation: 电源电路封装。 电路板和电源引线框架一起封装在模块中。 除了提供与电源电路的电连接之外，引线框还用于将电路板的位置固定或部分固定在封装中。 为此，电源引线框架和电路板中的一个包括阳部分，并且电源引线框架和电路板中的另一个包括用于机械地耦合电路板和引线框架的互补阴部分。

公开(公告)号：US20020125563A1

公开(公告)日：2002-09-12

申请号：US10027802

申请日：2001-12-20

Inventor： Uwe Scheuermann

IPC: H01L023/053

CPC classification number: H05K1/0256 ,  C04B2237/407 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K2201/09145 ,  H05K2201/09354 ,  H01L2924/00

Abstract: A power semiconductor module achieves high isolation strength from a base through selectively positioning a plurality of metal coatings on first and second surfaces and positioning edges of the plurality to beneficially reduce the field strength tangentially to a selected position, especially in a defined critical region directly adjacent a metal coating edge on a first surface opposite the base. This design results in regions which beneficially allow field lines to extend without functional detriment. The beneficial position selection is is achieved by means of an optimization process in which the tangential components of the field strength beside the first or second metallization edge reach identical values.

公开(公告)号：US20020066953A1

公开(公告)日：2002-06-06

申请号：US09457335

申请日：1999-12-09

Inventor： YUTAKA ISHIWATA ,  KOSOKU NAGATA ,  TOSHIO SHIMIZU ,  HIROYUKI HIRAMOTO ,  YASUHIKO TANIGUCHI ,  KOUJI ARAKI ,  HIROSHI FUKUYOSHI ,  HIROSHI KOMORITA

IPC: H01L021/44 ,  H01L023/495 ,  H01L029/40

CPC classification number: H05K1/0256 ,  H01L23/34 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48137 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0306 ,  H05K2201/09145 ,  Y10S428/901 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49165 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An insulating substrate (1) has insulative ceramic layers (2, 3) laid one upon another, an intermediate layer (4) made of a material that is different from a material of the ceramic layers and arranged between adjacent ones of the ceramic layers to join the adjacent ceramic layers to each other, a first conductive layer (5) joined to the top surface of a top one of the ceramic layers, and a second conductive layer (6) joined to the bottom surface of a bottom one of the ceramic layers. Even if any one of the ceramic layers has strength lower than design strength and causes a breakage due to, for example, thermal stress, the remaining ceramic layers are sound to secure a specified breakdown voltage for the insulating substrate.

Abstract translation: 绝缘基板（1）具有彼此层叠的绝缘陶瓷层（2,3），由与陶瓷层的材料不同并且布置在相邻的陶瓷层之间的材料制成的中间层（4） 将相邻的陶瓷层彼此接合，接合到顶部陶瓷层的顶表面的第一导电层（5）和接合到陶瓷的底部陶瓷层的底表面的第二导电层（6） 层。 即使陶瓷层中的任何一个具有低于设计强度的强度并且由于例如热应力而引起断裂，剩余的陶瓷层声音可以确保绝缘基板的规定的击穿电压。

公开(公告)号：US06396001B1

公开(公告)日：2002-05-28

申请号：US09709490

申请日：2000-11-13

Applicant: Satoshi Nakamura

Inventor： Satoshi Nakamura

IPC: H01R909

CPC classification number: H01R12/57 ,  H05K3/3405 ,  H05K3/3421 ,  H05K2201/09145 ,  H05K2201/1034 ,  H05K2201/10757 ,  Y10T29/49165

Abstract: A printed circuit board includes a rectangular, insulating substrate and a conductive land formed on the substrate. The land is arranged near a selected one of the longitudinal edges of the substrate. An L-shaped terminal is mounted on the substrate, so that its longer horizontal portion overlaps the land, while its shorter bent portion is engaged with a positioning groove formed in the selected longitudinal edge of the substrate. The land is caused to protrude from the overlapping horizontal portion of the terminal toward the opposite longitudinal edge of the substrate.

Abstract translation: 印刷电路板包括矩形绝缘基板和形成在基板上的导电焊盘。 所述焊盘布置在所述衬底的所述纵向边缘中的所选择的一个附近。 L形端子安装在基板上，使得其较长的水平部分与凸台重叠，而其较短的弯曲部分与形成在基板的所选纵向边缘中的定位槽接合。 使该焊盘从端子的重叠的水平部分朝向衬底的相对的纵向边缘突出。

公开(公告)号：US06261703B1

公开(公告)日：2001-07-17

申请号：US09230178

申请日：1999-01-21

Applicant: Kazutaka Sasaki ,  Hirohiko Nakata

Inventor： Kazutaka Sasaki ,  Hirohiko Nakata

IPC: H01L2312

CPC classification number: H05K1/0271 ,  C04B35/111 ,  C04B35/581 ,  C04B35/587 ,  C04B35/62655 ,  C04B37/026 ,  C04B2235/3208 ,  C04B2235/3225 ,  C04B2235/5445 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/708 ,  H01L23/3735 ,  H01L2224/48091 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/09145 ,  H05K2201/098 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/24917 ,  H01L2924/00014

Abstract: A highly reliable copper circuit-joined board that, in mounting a semiconductor element, a lead frame or the like on a ceramic substrate, enables the semiconductor element, the lead frame or the like to be strongly joined to the substrate without breaking or deformation of the substrate found in conventional joining methods, such as brazing and joining using a copper/copper oxide eutectic crystal. Any one of an interposing layer comprising a brazing material layer comprising silver and/or copper as a main component and an active metal or an interposing layer having a two-layer structure comprising a first interposing layer comprising the brazing material layer or a high-melting metallizing layer and a second interposing layer, having a melting point of 1000° C. or below, comprising Ni, Fe, Cu as a main component in that order from the substrate side, is formed on a ceramic substrate, and a conductor layer, comprising copper as a main component, which, in both the lengthwise and widthwise directions, is at least 0.05 mm shorter than the interposing layer, is formed on the interposing layer to prepare a copper circuit-joined board. The copper circuit-joined board may comprise the base board having thereon an outer layer comprising Ni as a main component. A semiconductor element is mounted on the copper circuit-joined board to prepare a semiconductor device.

Abstract translation: 一种高度可靠的铜电路接合板，其在将半导体元件，引线框架等安装在陶瓷基板上时能够使半导体元件，引线框架等牢固地接合到基板而不会发生断裂或变形 在常规接合方法中发现的基板，例如使用铜/铜氧化物共晶晶体的钎焊和接合。 包含以银和/或铜为主要成分的钎焊材料层的中介层和活性金属或具有两层结构的插层，包括含有钎焊材料层或高熔点的第一介入层 在陶瓷基板上形成从基板侧依次包含Ni，Fe，Cu作为主要成分的熔点为1000℃以下的金属化层和第二中介层，导体层， 包括铜作为主要成分，其在长度方向和宽度方向上比中间层短至少0.05mm，形成在插层上以制备铜电路接合板。 铜电路接合板可以包括其上具有包括Ni作为主要成分的外层的基板。 半导体元件安装在铜电路接合板上以制备半导体器件。

公开(公告)号：US6016253A

公开(公告)日：2000-01-18

申请号：US154822

申请日：1998-09-17

Applicant: Georg Seitz ,  Joachim Lach ,  Ernst-Ludwig Klein ,  Roland Wolfschlager ,  Ekkehard Sachs

Inventor： Georg Seitz ,  Joachim Lach ,  Ernst-Ludwig Klein ,  Roland Wolfschlager ,  Ekkehard Sachs

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/20 ,  H05K3/28 ,  H05K3/36 ,  H05K3/40

CPC classification number: H05K1/028 ,  H05K1/118 ,  H05K1/148 ,  H05K2201/0397 ,  H05K2201/09145 ,  H05K2201/09736 ,  H05K3/202 ,  H05K3/281 ,  H05K3/361 ,  H05K3/4084 ,  H05K3/4092 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: According to known methods, several circuit board pieces in a three-dimensional arrangement of an electronic module are connected together electrically by the film connectors and arranged around an operator control or actuator element in the three-dimensional form. The assembly of such modules is, however, very costly because the circuit boards must all be fastened mechanically. By using film connectors with greater stiffness, circuit board pieces can be held over these directly without additional mechanical securing devices and the three-dimensional circuit board arrangement can be secured by appropriate securing devices in the three-dimensional form. A preferred application is for electronic modules with operator control and/or actuator elements where the space available is very limited, in particular for modules fitted in motor vehicles.

Abstract translation: 根据已知的方法，电子模块的三维布置中的几个电路板片由薄膜连接器电连接在一起，并以三维形式围绕操作者控制或致动器元件布置。 然而，这种模块的组装是非常昂贵的，因为电路板必须全部被机械地紧固。 通过使用具有更大硬度的胶片连接器，可以直接将电路板片固定在其上，而无需额外的机械固定装置，并且可以通过三维形式的适当的固定装置来固定三维电路板布置。 优选的应用是具有操作员控制和/或致动器元件的电子模块，其中可用空间非常有限，特别是对于安装在机动车辆中的模块。

公开(公告)号：US5986218A

公开(公告)日：1999-11-16

申请号：US652291

申请日：1996-07-10

Applicant: Hirotaka Muto ,  Toshinori Kimura ,  Haruhisa Fujii ,  Kazuharu Kato

Inventor： Hirotaka Muto ,  Toshinori Kimura ,  Haruhisa Fujii ,  Kazuharu Kato

IPC: H05K3/34 ,  H01L21/48 ,  H01L23/12 ,  H01L23/538 ,  H05K1/02 ,  H05K1/03 ,  H05K3/40 ,  H01R9/09

CPC classification number: H05K1/0256 ,  H01L21/4846 ,  H01L23/538 ,  H01L2924/0002 ,  H05K1/0254 ,  H05K1/0306 ,  H05K2201/09145 ,  H05K2201/09354 ,  H05K2201/098 ,  H05K3/4092

Abstract: A circuit board includes an insulating substrate having opposed first and second surfaces and a thickness; and first and second conductive layers disposed on the first and second surfaces of the insulating substrate, respectively, wherein the first conductive layer has an end surface projecting outwardly from the first conductive layer in a direction generally parallel to the first surface of the insulating substrate, and a contact surface in contact with the insulating substrate and joining the end surface at a junction, wherein the end surface is spaced from the first surface of the insulating substrate except at the junction.

Abstract translation: 电路板包括具有相对的第一和第二表面和厚度的绝缘基板; 以及分别设置在所述绝缘基板的所述第一表面和所述第二表面上的第一和第二导电层，其中所述第一导电层具有从所述第一导电层向大致平行于所述绝缘基板的第一表面的方向向外突出的端面， 以及与所述绝缘基板接触并在所述接合部处接合所述端面的接触表面，其中所述端表面与所述绝缘基板的除了所述接合点之外的所述第一表面间隔开。