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    Electronic device and liquid crystal display device
    72.
    发明申请
    Electronic device and liquid crystal display device 审中-公开
    电子装置和液晶显示装置

    公开(公告)号：US20070059991A1

    公开(公告)日：2007-03-15

    申请号：US11515042

    申请日：2006-09-05

    Applicant: Hideyuki Chikazawa ,  Mitsuhiro Moriyasu

    Inventor： Hideyuki Chikazawa ,  Mitsuhiro Moriyasu

    IPC: H01R13/42

    CPC classification number: H05K1/0266 ,  G02F1/13336 ,  G02F1/133603 ,  G02F2001/133354 ,  H05K1/142 ,  H05K2201/09936 ,  H05K2201/10106 ,  H05K2203/168

    Abstract: [PROBLEMS] To prevent mistake of fitting position and fitting direction of each substrate when a plurality of substrates is fitted in a base member. [MEANS FOR SOLVING PROBLEMS]Backlight unit X in a LCD device comprises such as a plurality of LED substrates 10 respectively mounting a plurality of LED elements 11 for illuminating each division multi-divided from the entire area of a LCD panel, and Chassis 1 as a base member in which LED substrates 10 are aligned and fitted, wherein Fitting position distinguishing mark 12 indicating a designed (qualified) fitting position of a relevant LED substrate 10 in Chassis 1 is recorded on each of a plurality of LED substrates 10. Fitting position distinguishing mark 12 is the mark graphically displaying the area to be covered by a relevant LED substrate 10 in the entire Chassis 1 when the LED substrate 10 is fitted in Chassis 1 as designed. And on every LED substrate adjusted in a designed fitting direction relative to Chassis 1, Fitting position distinguishing mark 12 is recorded in an area which is nearly the same area but other than the center nor vicinity thereof in LED substrate 10.

    Abstract translation: [问题]为了防止在将多个基板安装在基部构件中时，各基板的嵌合位置和嵌合方向错误。 解决问题的手段LCD装置中的背光单元X包括多个LED基板10，其分别安装多个LED元件11，用于照亮从LCD面板的整个区域多个分割的每个分区，并且底盘1作为 配置LED基板10的基座部件，其中，在多个LED基板10的每一个上记录有表示在底盘1中的相关的LED基板10的设计（合格的）配合位置的配合位置识别标记12。 装配位置识别标记12是当LED基板10按照设计安装在底盘1中时在整个底盘1中以相关LED基板10覆盖的区域的图形显示标记。 并且在相对于底盘1在设计的配合方向上调整的每个LED基板上，将配合位置识别标记12记录在LED基板10中几乎相同的区域而不是其中心或其附近的区域中。

    Using special visibility materials proximate candidate component locations to enhance recognition
    75.
    发明申请
    Using special visibility materials proximate candidate component locations to enhance recognition 失效
    使用靠近候选组件位置的特殊可见性材料来增强识别

    公开(公告)号：US20060054338A1

    公开(公告)日：2006-03-16

    申请号：US10939754

    申请日：2004-09-13

    Applicant: Thane Larson

    Inventor： Thane Larson

    IPC: H01L23/02

    CPC classification number: H05K13/08 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0269 ,  H05K3/303 ,  H05K2201/09936 ,  H05K2203/161 ,  H01L2224/0401

    Abstract: The invention in one implementation encompasses the use of special visibility material to enhance the ability of computer-aided visual inspection machines to detect errors in placement or orientation of components mounted to a printed circuit board. In another implementation, the visibility of labels to a repair technician is enhanced by using indicia formed using special visibility material disposed in a housing which substantially restricts the penetration outside ambient light into the interior of the housing.

    Abstract translation: 本发明在一个实施方案中包括使用特殊的可见性材料来增强计算机辅助视觉检查机器检测安装到印刷电路板的部件的位置或方向上的错误的能力。 在另一个实施方式中，通过使用设置在壳体中的特殊可见性材料形成的标记来增强标签对维修技术人员的可视性，该标记基本上将外部环境光的穿透基本上限制到壳体的内部。

    Printed circuit board and method of printing identification marks
    77.
    发明申请
    Printed circuit board and method of printing identification marks 失效
    印刷电路板和打印识别标记的方法

    公开(公告)号：US20050199421A1

    公开(公告)日：2005-09-15

    申请号：US11077247

    申请日：2005-03-10

    Applicant: Tatsuo Katayama

    Inventor： Tatsuo Katayama

    IPC: H05K1/02 ,  H05K1/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/22 ,  H05K3/30

    CPC classification number: H05K1/0266 ,  H05K1/0286 ,  H05K3/222 ,  H05K3/303 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/09936 ,  H05K2201/09972 ,  H05K2201/10363 ,  H05K2201/10636 ,  H05K2203/173 ,  Y02P70/611

    Abstract: It is an object of the invention to provide a printed circuit board capable of easily connecting a plurality of ground patterns corresponding to a plurality of circuit blocks, and of easily selecting the combination of the connection of the plurality of ground patterns. The printed circuit board comprises a plurality of blocks and a plurality of ground patterns are formed on the circuit blocks. Provided on the adjacent ground patterns are short lands, respectively, printed on the ground patterns disposed opposite to the ground patterns. Identification marks are printed adjacent to the short lands for identifying to which circuit block the short land belongs.

    Abstract translation: 本发明的目的是提供一种印刷电路板，其能够容易地连接与多个电路块相对应的多个接地图案，并且容易地选择多个接地图案的连接的组合。 印刷电路板包括多个块，并且在电路块上形成多个接地图案。 在相邻的接地图案上设置有分别印刷在与地面图案相对设置的接地图案上的短接地。 识别标记被印在邻近的短处，以识别短地所属的哪个电路块。

    Method of manufacturing multi-layer printed wiring board
    78.
    发明授权
    Method of manufacturing multi-layer printed wiring board 失效
    制造多层印刷线路板的方法

    公开(公告)号：US06893576B1

    公开(公告)日：2005-05-17

    申请号：US09713036

    申请日：2000-11-16

    Applicant: Akitaka Nakayama ,  Akio Ikeda ,  Kiyoshi Hyodo ,  Kazuo Uchida

    Inventor： Akitaka Nakayama ,  Akio Ikeda ,  Kiyoshi Hyodo ,  Kazuo Uchida

    IPC: H05K3/28 ,  G03F7/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/46 ,  H01B13/00 ,  G03F7/26

    CPC classification number: G03F7/0035 ,  H05K1/0266 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/28 ,  H05K2201/09936 ,  H05K2203/0505 ,  H05K2203/0551 ,  H05K2203/107

    Abstract: This invention is a method of manufacturing a multi-layer printed wiring board including an internal layer circuit forming step, a outer layer circuit forming step, and a solder resist forming step. In the solder resist forming step, the surface of a board subjected to the outer layer circuit forming step is coated with a photosensitive solder resist material, the solder resist material is coated with a photosensitive film; a light shielding mask is formed by irradiating a laser beam on the photosensitive film according to a formed pattern of the solder resist, the solder resist material is exposed by using the light shielding mask, the light shielding mask is removed, and the solder resist material which is not exposed is removed.

    Abstract translation: 本发明是一种制造包括内层电路形成步骤，外层电路形成步骤和阻焊剂形成步骤的多层印刷线路板的方法。 在阻焊剂形成工序中，将经过外层电路形成工序的板的表面涂敷有感光性阻焊材料，使阻光材料涂布感光性膜。 通过根据形成的阻焊剂图案将激光束照射在感光膜上形成遮光掩模，通过使用遮光掩模曝光阻焊材料，除去遮光掩模和阻焊材料 没有暴露的是被去除。

    Crystal oscillator
    79.
    发明申请
    Crystal oscillator 失效
    水晶振荡器

    公开(公告)号：US20050088251A1

    公开(公告)日：2005-04-28

    申请号：US10970245

    申请日：2004-10-21

    Applicant: Takashi Matsumoto

    Inventor： Takashi Matsumoto

    IPC: H03B5/32 ,  H05K3/34

    CPC classification number: H05K3/3405 ,  H03B5/32 ,  H05K2201/09181 ,  H05K2201/09936 ,  H05K2201/10371 ,  H05K2203/167 ,  H05K2203/168

    Abstract: A crystal oscillator comprises a rectangular circuit substrate for mounting circuit devices and its metal cover, said circuit substrate has grooves on each long side and on each short side and said metal cover has projections at each aperture end corresponding to the grooves, and which has a swelling from external to internal in each of the projections, wherein both the grooves provided on each short side and the projection of said metal cover are provided at one end of each long side or each short side.

    Abstract translation: 一种晶体振荡器包括用于安装电路器件及其金属盖的矩形电路基板，所述电路基板在每个长边和短边均具有凹槽，并且所述金属盖在与槽相对应的每个孔径处具有突起，并且具有 在每个突起中从外部膨胀到内部，其中设置在每个短边上的凹槽和所述金属盖的突起设置在每个长边或每个短边的一端。

    Printed board and method of displaying an identification mark on the same
    80.
    发明申请
    Printed board and method of displaying an identification mark on the same 审中-公开
    印刷板和在其上显示识别标记的方法

    公开(公告)号：US20050045370A1

    公开(公告)日：2005-03-03

    申请号：US10931892

    申请日：2004-09-01

    Applicant: Tatsuo Katayama

    Inventor： Tatsuo Katayama

    IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K13/08 ,  H05K1/00

    CPC classification number: H05K1/0266 ,  H05K1/18 ,  H05K3/3468 ,  H05K2201/09936 ,  H05K2203/159

    Abstract: The invention is intended to provide a printed board wherein a stable soldering processing can be executed on the basis of weight distribution in the printed board, and storage as well as control can be implemented on the basis of the weight distribution, and a method of displaying the identification mark on the printed board. The weight distribution in the printed board is found on the basis of weight information and reference position information, on circuit components to be mounted on the printed board, and mount information on the circuit components. That is, on the basis of the reference position information and the mount information, the coordinates of the center positions of the respective circuit components, on the printed board, are calculated, and weights of the respective circuit components are assigned to the coordinates of center positions of the respective circuit components, thereby finding the weight distribution. Identification marks 2 to 4, indicating heavy parts in terms of the weight distribution, respectively, are displayed on the printed board.

    Abstract translation: 本发明旨在提供一种印刷电路板，其中可以基于印刷电路板中的重量分布来执行稳定的焊接处理，并且可以基于重量分布来实现存储以及控制，以及显示方法 印刷板上的识别标记。 基于重量信息和参考位置信息，要安装在印刷电路板上的电路部件，以及关于电路部件的信息，找到印刷电路板的重量分布。 也就是说，基于参考位置信息和安装信息，计算印刷电路板上各个电路部件的中心位置的坐标，并将各个电路部件的重量分配给中心的坐标 各个电路部件的位置，从而找到重量分布。 在印刷电路板上显示识别标记2至4，分别表示重量分布方面的重部分。

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