公开(公告)号：US20110006718A1

公开(公告)日：2011-01-13

申请号：US12919686

申请日：2009-09-17

Applicant: Kazunori Teshima ,  Koji Toyama ,  Koji Nakano ,  Hidetaka Sato

Inventor： Kazunori Teshima ,  Koji Toyama ,  Koji Nakano ,  Hidetaka Sato

IPC: H02P1/00 ,  H02P27/00

CPC classification number: H05K7/1432 ,  H05K1/144 ,  H05K3/284 ,  H05K5/064 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1476

Abstract: There is provided an inverter device that is small in size and has high durability against long-term use with vibration. A power substrate 20 is placed at a bottom portion of a box-shaped module case 11, and a control substrate 30 forms a lid of an opening in the module case 11, and thus an inverter device 10 of the present invention is modularized, thereby reducing a height of the inverter device 10. In the inverter device 10, a capacitor 22 is provided between the power substrate 20 and the control substrate 30, and the capacitor 22 is covered with a resin mold layer 12 and fixed in the module case 11. The capacitor 22 is fixed in the module case 11 by the resin mold layer 12, which provides higher durability against vibration than that by conventional fastening with a screw.

Abstract translation: 提供了一种尺寸小且对长期使用振动具有高耐久性的逆变器装置。 电源基板20配置在箱状的模块壳体11的底部，控制基板30形成模块壳体11的开口盖，因此本发明的逆变器装置10被模块化，由此 降低逆变器装置10的高度。在逆变器装置10中，电容器22设置在电力基板20和控制基板30之间，电容器22被树脂模制层12覆盖并固定在模块壳体11中 电容器22通过树脂模制层12固定在模块壳体11中，与通过螺钉的常规紧固相比，其提供比振动更高的耐久性。

公开(公告)号：US07857627B2

公开(公告)日：2010-12-28

申请号：US12535361

申请日：2009-08-04

Applicant: Yung-Chang Cheng

Inventor： Yung-Chang Cheng

IPC: H01R12/00

CPC classification number: H01R12/62 ,  H01R12/721 ,  H01R13/6658 ,  H05K1/117 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10356

Abstract: A connector assembly includes an electric connector, and a cable assembly mated with the electric connector. The electric connector includes a housing, a plurality of contacts received in the housing. The cable assemble includes a base board with a plurality of golden fingers, and a plurality of wires electrically connected to the golden fingers. The base board includes a mating portion and a connecting portion connected to the mating portion. The golden fingers are arranged on the mating portion and the wires are physically connected to the connecting portion. The mating portion is inserted into the housing of the electric connector.

Abstract translation: 连接器组件包括电连接器和与电连接器配合的电缆组件。 电连接器包括壳体，容纳在壳体中的多个触点。 电缆组装包括具有多个金指的基板和电连接到金指的多根电线。 基板包括配合部分和连接到配合部分的连接部分。 金手指布置在配合部分上，并且电线物理连接到连接部分。 配合部分插入电连接器的外壳中。

公开(公告)号：US07839657B2

公开(公告)日：2010-11-23

申请号：US11414429

申请日：2006-04-28

Applicant: Thomas H. Nodine

Inventor： Thomas H. Nodine

IPC: H05K1/14

CPC classification number: H05K1/148 ,  H05K1/141 ,  H05K3/0052 ,  H05K2201/0909 ,  H05K2201/10128 ,  H05K2201/10287 ,  H05K2201/10484

Abstract: A circuit board assembly includes a mother board and a daughter board. The daughter board is defined by a plurality of frangible connections to the mother board and is disposed on a common plane with the mother board. After all the electronic devices are installed to the mother board and the daughter board on a common plane the frangible connections are broken to allow the daughter board to be moved to a desired position relative to the mother board. The electrical conductors that connect the daughter board to the mother board are semi-rigid to provide movement while maintaining a desired position of the daughter board relative to the mother board.

Abstract translation: 电路板组件包括母板和子板。 子板由与母板的多个易碎连接限定，并与母板设置在公共平面上。 在将所有电子设备安装到母板和母板上的公共平面上之后，易碎连接断开，以使子板相对于母板移动到所需的位置。 将子板连接到母板的电导体是半刚性的，以提供移动，同时保持子板相对于母板的期望位置。

公开(公告)号：US07813796B2

公开(公告)日：2010-10-12

申请号：US11455028

申请日：2006-07-24

Applicant: Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

Inventor： Robert J. Greenberg ,  Alfred E. Mann ,  Neil Talbot ,  Jerry Ok ,  Gaillard R. Nolan ,  Dau Min Zhou

IPC: A61N1/00

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US20100197153A1

公开(公告)日：2010-08-05

申请号：US12366053

申请日：2009-02-05

Applicant: DAVID STANLEY SZCZESNY ,  CANDACE EILEEN GILLETTE ,  RANDY K. RANNOW ,  LINDA ELLEN SHIELDS

Inventor： DAVID STANLEY SZCZESNY ,  CANDACE EILEEN GILLETTE ,  RANDY K. RANNOW ,  LINDA ELLEN SHIELDS

IPC: H01R12/00

CPC classification number: H05K3/301 ,  H01F2017/067 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10287 ,  H05K2201/10325

Abstract: A connector assembly configured to be mounted to a device substrate is provided. She connector assembly includes a connector substrate, an electronic component. contacts, and conductive wires. The connector substrate has a mounting side and an opposite supporting side interconnected by an edge. The mounting side is used to mount the connector substrate to the device substrate. The electronic component is disposed on the supporting side of the connector substrate. The contacts are provided on the mounting side of the connector substrate and are used to electrically couple the electronic component with the device substrate. The wires are joined to the electronic component and to the contacts. The wires extend along the supporting and mounting sides and wrap around the edge of the connector substrate. The conductive wires are separated from one another by a separation gap along the supporting side and the mounting side of the connector substrate.

Abstract translation: 提供了一种构造成安装到设备基板的连接器组件。 她的连接器组件包括连接器基板，电子部件。 触点和导线。 连接器基板具有通过边缘互连的安装侧和相对的支撑侧。 安装侧用于将连接器基板安装到器件基板。 电子部件设置在连接器基板的支撑侧。 触点设置在连接器基板的安装侧上，并用于将电子部件与器件基板电耦合。 电线连接到电子部件和触点。 电线沿着支撑和安装侧延伸并围绕连接器基板的边缘缠绕。 导线通过连接器基板的支撑侧和安装侧的分离间隙彼此分离。

公开(公告)号：US20100163295A1

公开(公告)日：2010-07-01

申请号：US12347600

申请日：2008-12-31

Applicant: Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

Inventor： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

IPC: H05K1/11

CPC classification number: H01L21/76877 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0222 ,  H05K3/4046 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/0401

Abstract: In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. In this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed and claimed.

Abstract translation: 在一些实施例中，呈现用于鲁棒电性能的同轴电镀通孔（PTH）。 在这方面，引入了包括集成电路器件和与集成电路器件耦合的衬底的器件，其中衬底包括：电镀通孔，填充有介电材料的电镀通孔和同轴铜线，以及导电迹线 以分开布线电镀通孔和同轴铜线。 还公开并要求保护其他实施例。

公开(公告)号：US20100158743A1

公开(公告)日：2010-06-24

申请号：US12665659

申请日：2008-06-27

Applicant: Shichio Funakoshi ,  Masaki Ohshima ,  Katsuya Ikeda ,  Man Ho Song

Inventor： Shichio Funakoshi ,  Masaki Ohshima ,  Katsuya Ikeda ,  Man Ho Song

IPC: B22F7/04 ,  B22F3/02

CPC classification number: H01F41/0246 ,  H01F17/04 ,  H01F27/255 ,  H01F2017/048 ,  H05K1/0373 ,  H05K1/165 ,  H05K3/103 ,  H05K3/20 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/09118 ,  H05K2201/10265 ,  H05K2201/10287

Abstract: A method of manufacturing a magnetic body in which insulating magnetic powder particles are stacked and press-molded in a molding space, and wiring is formed on a surface of the insulating magnetic powder particles solidified by press molding is provided according to the present invention. The method includes: a first step S10 of preparing a wiring plate which includes a sheet-shaped base plate and the wiring which is formed on the base plate and is removable from the base plate; a second step S20 of stacking the insulating magnetic powder particles in the molding space, arranging the wiring plate on a surface of the insulating magnetic powder particles in a state that the wiring faces the surface of the insulating magnetic powder particles in an opposed manner, and press-molding the insulating magnetic powder particles and the wiring plate; and a third step S30 of removing the base plate from the surface of the solidified insulating magnetic powder particles while leaving the wiring on the insulating magnetic powder particles in this order. According to the method of manufacturing a magnetic body of the present invention, it is possible to prevent the corrosion of the insulating magnetic powder particles thus realizing the manufacture of a highly reliable magnetic body.

Abstract translation: 根据本发明，提供一种制造磁性体的方法，其中绝缘磁性粉末颗粒在模制空间中堆叠并压模，并且通过压制成型固化的绝缘磁性粉末颗粒的表面上形成布线。 该方法包括：制备布线板的第一步骤S10，其包括片状基板和形成在基板上并且可从基板移除的布线; 将绝缘磁性粉末颗粒堆积在成形空间中的第二步骤S20，将布线板布置在绝缘磁性粉末颗粒的表面上，使布线以相反的方式面对绝缘磁性粉末颗粒的表面;以及 压制绝缘磁粉颗粒和布线板; 以及在将绝缘磁性粉末颗粒上的布线依次留下的同时从凝固的绝缘磁性粉末颗粒的表面除去基板的第三步骤S30。 根据本发明的磁体的制造方法，可以防止绝缘磁性粉末颗粒的腐蚀，从而实现高度可靠的磁性体的制造。

公开(公告)号：US07731504B2

公开(公告)日：2010-06-08

申请号：US12254592

申请日：2008-10-20

Applicant: Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

Inventor： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC: H01R9/00

CPC classification number: H05K3/4015 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

Abstract translation: 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 元件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。

公开(公告)号：US20100116869A1

公开(公告)日：2010-05-13

申请号：US12615202

申请日：2009-11-09

Applicant: Stephen C. Jacobsen ,  David P. Marceau ,  Shayne M. Zurn ,  David T. Markus

Inventor： Stephen C. Jacobsen ,  David P. Marceau ,  Shayne M. Zurn ,  David T. Markus

IPC: B23K31/02

CPC classification number: H01L23/4952 ,  H01L24/43 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/43 ,  H01L2224/45012 ,  H01L2224/45013 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45188 ,  H01L2224/4554 ,  H01L2224/45578 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2224/8582 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3421 ,  H05K2201/10287 ,  H05K2201/10356 ,  Y02P70/613 ,  H01L2924/20751 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Devices and methods for electrical interconnection for microelectronic circuits are disclosed. One method of electrical interconnection includes forming a bundle of microfilaments, wherein at least two of the microfilaments include electrically conductive portions extending along their lengths. The method can also include bonding the microfilaments to corresponding bond pads of a microelectronic circuit substrate to form electrical connections between the electrically conductive portions and the corresponding bond pads. A microelectronic circuit can include a bundle of microfilaments bonded to corresponding bond pads to make electrical connection between corresponding bonds pads and electrically-conductive portions of the microfilaments.

Abstract translation: 公开了用于微电子电路的电互连的装置和方法。 电互连的一种方法包括形成一束微丝，其中至少两个微丝包括沿其长度延伸的导电部分。 该方法还可以包括将微丝粘合到微电子电路基板的相应的接合焊盘，以在导电部分和相应的接合焊盘之间形成电连接。 微电子电路可以包括一束与对应的接合焊盘接合的微丝，以在相应的接合焊盘和微丝的导电部分之间形成电连接。

公开(公告)号：US07701144B2

公开(公告)日：2010-04-20

申请号：US11858701

申请日：2007-09-20

Applicant: Hironori Tsukamoto ,  Noriaki Ito

Inventor： Hironori Tsukamoto ,  Noriaki Ito

IPC: B60Q1/02

CPC classification number: B60Q1/2696 ,  B60Q1/0094 ,  F21S43/14 ,  F21S43/195 ,  H05K1/0284 ,  H05K1/14 ,  H05K1/148 ,  H05K1/189 ,  H05K3/202 ,  H05K3/328 ,  H05K2201/10106 ,  H05K2201/10272 ,  H05K2201/10287 ,  H05K2201/10651 ,  H05K2203/302

Abstract: A vehicular lamp includes a lamp body; a plurality of LED light sources disposed inside a lamp chamber formed by a front cover positioned in front of the lamp body; and a lighting circuit portion positioned behind the LED light sources. The LED light source is electrically connected to a conductive bus bar, and forms a light-emitting surface at a position opposite the front cover. The lighting circuit portion is formed on the back side of the light-emitting surface of the LED light source with respect to the front cover, and a circuit element thereof is electrically connected to the conductive bus bar. The conductive bus bar to which the LED light source is connected and the conductive bus bar to which the circuit element is connected are conductively connected.

Abstract translation: 车灯包括灯体; 多个LED光源，其设置在由位于灯体前方的前盖形成的灯室内; 以及位于LED光源后面的照明电路部分。 LED光源电连接到导电母线，并且在与前盖相对的位置处形成发光表面。 照明电路部分相对于前盖形成在LED光源的发光表面的背面上，并且其电路元件电连接到导电母线。 连接有LED光源的导电母线和连接有电路元件的导电母线导电连接。