公开(公告)号：US5051813A

公开(公告)日：1991-09-24

申请号：US619108

申请日：1990-11-27

Applicant: Mark R. Schneider ,  Michael J. Steidl

Inventor： Mark R. Schneider ,  Michael J. Steidl

IPC: H01L21/56 ,  H01L23/28 ,  H01L23/50 ,  H05K3/30 ,  H05K13/00

CPC classification number: H05K3/303 ,  H01L2224/48247 ,  H01L2224/49171 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10924 ,  H05K2203/166 ,  H05K2203/167 ,  Y02P70/613

Abstract: A plastic-packaged semiconductor device, method of making same, and mounting same to a printed circuit board is disclosed. The device has a body, and a plurality of leads extending from the body. Plastic webs are formed between adjacent leads for supporting the leads. Plastic bumps are formed at the ends of the webs, and align with recesses between conductors of wiring patterns on printed circuit boards, aiding in alignment of the device with the board.

Abstract translation: 公开了一种塑料封装半导体器件及其制造方法，并将其安装到印刷电路板上。 该装置具有主体和从主体延伸的多个引线。 在相邻引线之间形成塑料网以支撑引线。 塑料凸块形成在腹板的端部，并与印刷电路板上的布线图案的导体之间的凹槽对准，以帮助设备与板对准。

公开(公告)号：US5045976A

公开(公告)日：1991-09-03

申请号：US598569

申请日：1990-10-15

Applicant: Pierre Guilleminot

Inventor： Pierre Guilleminot

IPC: F16B21/00 ,  F16B21/08 ,  H05K1/18 ,  H05K3/30

CPC classification number: F16B21/088 ,  H05K3/308 ,  H05K2201/10568 ,  H05K2201/10598 ,  H05K2201/10787 ,  H05K2201/10878

Abstract: A device for mounting an element (10) on a board (20) which element (10) comprises at least one fixing lug (11) which is to engage in a slot (21) formed in the said board (20). According to the invention, the fixing lug (11) comprises a projection (12) engaging the board (20) inside the slot, and having a thickness which is at least equal to the width (1) of the slot (21). The invention is used to mount housings on printed circuit boards.

Abstract translation: 一种用于将元件（10）安装在板（20）上的装置，该元件（10）包括至少一个固定凸耳（11），所述固定凸耳（11）与形成在所述板（20）中的槽（21）啮合。 根据本发明，固定凸耳（11）包括在槽内部与板（20）接合并且具有至少等于槽（21）的宽度（1）的厚度的突起（12）。 本发明用于将外壳安装在印刷电路板上。

公开(公告)号：US4975763A

公开(公告)日：1990-12-04

申请号：US168049

申请日：1988-03-14

Applicant: Daniel A. Baudouin ,  Ernest J. Russell

Inventor： Daniel A. Baudouin ,  Ernest J. Russell

IPC: H05K1/18 ,  H01L23/495 ,  H01L23/50 ,  H05K3/30

CPC classification number: H05K3/303 ,  H01L23/49555 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

Abstract: A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

公开(公告)号：US4967262A

公开(公告)日：1990-10-30

申请号：US432598

申请日：1989-11-06

Applicant: Warren M. Farnsworth

Inventor： Warren M. Farnsworth

IPC: H01L23/495 ,  H01L25/10 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/49555 ,  H01L25/105 ,  H05K3/303 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1076 ,  H01L2924/0002 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/1572 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

Abstract: A semiconductor package having a gull-wing, zig-zag, inline-lead configuration and end-of-package anchoring devices for rigidly affixing the package to a circuit board such that each lead is in compressibe contact with its associated mounting pad on the board. The anchoring devices of a first embodiment comprise anchoring pins having fish-hook-type barbs which lock against the under side of the board when the pegs are inserted through holes in the board; a second embodiment utilizes anchoring pins which are adhesively bonded in recesses that have been drilled or molded into the board; a third embodiment utilizes anchoring pins, the ends of which can be bonded directly to planar peg-bonding regions on the surface of the board; and a fourth utilizes tapered anchoring ping which may be inserted with an interference fit into holes in the board. The invention eliminates the need for mechanical support of the packages during solder reflow operations used during board assembly and repair.

公开(公告)号：US4962442A

公开(公告)日：1990-10-09

申请号：US501784

申请日：1990-03-30

Applicant: Donald L. Clemens

Inventor： Donald L. Clemens

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/301 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10606 ,  H05K2201/2036 ,  H05K3/3447

Abstract: A stanchion having a base with holes passing therethrough is used to hold elongated electronic device packages in a vertical position during assembly of a circuit board. The leads extending from the end of the device package are positioned in the holes in the base and the device package retained in the vertical position by attachment arms extending upwardly from opposite sides of the base defining a cavity for receiving the device package. Legs extending from the base support the device package above the surface of the circuit board to permit cleaning of the assembly.

Abstract translation: 具有穿过其中的孔的基座的支柱用于在电路板的组装期间将细长的电子器件封装件保持在垂直位置。 从器件封装的端部延伸的引线定位在基座中的孔中，并且器件封装通过从基座的相对侧向上延伸的连接臂保持在垂直位置，该连接臂限定用于接收器件封装的空腔。 从基座延伸的腿部将电路板表面上的器件封装支撑，以允许组件的清洁。

公开(公告)号：US4962363A

公开(公告)日：1990-10-09

申请号：US335682

申请日：1989-04-10

Applicant: William F. Sexton, Jr.

Inventor： William F. Sexton, Jr.

IPC: H01H85/041 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01H85/0418 ,  H05K3/3442 ,  H01H2085/0414 ,  H05K2201/10181 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10916 ,  H05K3/303 ,  Y02P70/611 ,  Y02P70/613

Abstract: A surface mountable leadless fuse generally includes a tubular fuse sub-assembly with an insulating body molded thereto in intimate sealing relation. The tubular fuse sub-assembly includes a nonconductive tubular housing, cup-shaped metal end caps enclosing the housing. The insulating body includes an upper and lower portion which are integral as molded. The end caps protrude from a bottom surface of the insulating body so that the fuse can engage the flat conductive areas of a circuit board for soldering thereto without obstructiion of the insulting body. The end caps also protrude from the end surfaces so that visual inspection and solder wetting are unobstructed. The lower portion of the insulating body covers an exposed portion of the tubular housing. A pair of anti-rolling legs depend from opposed margins of the bottom surface to prevent the fuse from rolling off of the circuit board once placed there.

Abstract translation: 可表面安装的无铅保险丝通常包括管状保险丝子组件，其具有以密封密封关系模制到其上的绝缘体。 管状保险丝子组件包括不导电的管状壳体，封闭壳体的杯形金属端盖。 绝缘体包括上模和下模一体的模制件。 端盖从绝缘体的底面突出，使得保险丝可以与电路板的平坦导电区域接合，以焊接到绝缘体上，而不会妨碍绝缘体。 端盖也从端面突出，使得目视检查和焊料润湿不受阻碍。 绝缘体的下部覆盖管状壳体的暴露部分。 一对抗滚动支腿从底面的相对边缘取决于防止保险丝在放置于电路板之后从电路板滚下。

公开(公告)号：US4727456A

公开(公告)日：1988-02-23

申请号：US860246

申请日：1986-05-06

Applicant: Mahendra C. Mehta ,  Dirk J. Van Dalen

Inventor： Mahendra C. Mehta ,  Dirk J. Van Dalen

IPC: H05K3/30 ,  H05K3/34 ,  H05K7/10 ,  H05K7/04

CPC classification number: H05K7/1076 ,  H05K3/301 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10568 ,  Y02P70/613 ,  Y10S439/931

Abstract: A carrier for leadless electrical and electronic components has a plurality of recesses, for reception of components. Electrically conductive paths formed on surfaces in the recesses make contact with contacts on the components. The conductive paths extend onto a bottom surface of the carrier and over protrusions or feet on the bottom surface. The protrusions make contact with contact pads on a circuit pattern on a circuit board. The carrier holds components which otherwise could be as readily mounted to the surface of a circuit board as can the carrier. A high number of components per unit surface area of a circuit board can be mounted via the carrier. The carrier can be positioned by an automated apparatus.

Abstract translation: 用于无引线电气和电子部件的载体具有用于接收部件的多个凹部。 形成在凹部中的表面上的导电路径与部件上的触点接触。 导电路径延伸到载体的底表面和底表面上的突起或脚上。 突起与电路板上的电路图案上的接触焊盘接触。 载体保持其它可以如载体那样容易地安装到电路板的表面的部件。 电路板每单位表面积的大量部件可通过载体安装。 载体可以通过自动化装置定位。

公开(公告)号：US4637135A

公开(公告)日：1987-01-20

申请号：US718769

申请日：1985-04-01

Applicant: Dimitry G. Grabbe

Inventor： Dimitry G. Grabbe

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A manner of precisely mounting a surface mounting connector to a substrate is taught. Briefly stated, after soldering of the contacts of a connector to the substrate, a radially wound steel roll pin is positioned in the mounting holes of the connector housing and is then urged downwards so as to cut through the substrate. The radial forces of the roll pin are used to retain the roll pin in position in the connector housing and in the substrate, thereby rigidly holding the connector housing to the substrate upon which it is mounted.

Abstract translation: 教导了将表面安装连接器精确地安装到基板的方式。 简要地说，在将连接器的触点焊接到基板之后，将径向卷绕的钢辊销定位在连接器壳体的安装孔中，然后被向下推动以穿过基板。 辊销的径向力用于将辊销保持在连接器壳体和基板中的适当位置，从而将连接器壳体刚性地保持在其所安装的基板上。

公开(公告)号：US4575785A

公开(公告)日：1986-03-11

申请号：US636636

申请日：1984-08-01

Applicant: Gerard Lerude ,  Christine Roux

Inventor： Gerard Lerude ,  Christine Roux

IPC: G09F13/20 ,  H01L33/00 ,  H05K3/30 ,  H05K3/34 ,  H05K7/12 ,  F21V17/04

CPC classification number: H05K7/12 ,  H05K3/301 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/10568 ,  H05K2203/167 ,  H05K3/3447 ,  Y10S362/80

Abstract: A visual indicator lamp support is provided comprising an elongate insulating body having a front face and a rear face substantially perpendicular to its longitudinal dimension and forming, at its front face, jaws for insertion of the indicator lamp, a bearing surface inside said body cooperating with the rear face of the indicator lamp, holes through which the wires thereof extend formed through said body and means for securing to a printed circuit card, wherein said body forms a reference surface perpendicular to said rear face and joined thereto by a re-entrant surface adapted for freeing a portion of said wires and shaped so that bending back of said body from a first position in which its rear face is in abutment against the card and plays the role of spacer defining a pre-determined distance between said rear face of the indicator lamp and the surface of the printed circuit for soldering said wires to a second position in which said reference surface is in abutment against the card, results in causing pre-determined bending of said wires.

Abstract translation: 提供一种视觉指示灯支撑件，其包括细长绝缘体，其具有基本上垂直于其纵向尺寸的前表面和后表面，并且在其前表面处形成用于插入指示灯的钳口，所述身体内的支承表面与 指示灯的后表面，其电线通过所述主体形成的孔和用于固定到印刷电路卡的装置的孔，其中所述主体形成垂直于所述后表面的参考表面，并通过入口表面 适于释放所述电线的一部分并成形为使得所述主体从其后表面抵靠卡片的第一位置向后弯曲并且起到隔离物的作用，所述间隔件限定了所述电缆的所述背面之间的预定距离 指示灯和印刷电路的表面，用于将所述电线焊接到第二位置，在第二位置，所述参考表面与所述基准表面邻接 导致所述电线的预定弯曲。

公开(公告)号：US4254448A

公开(公告)日：1981-03-03

申请号：US38742

申请日：1979-05-14

Applicant: Gerald J. Martyniak

Inventor： Gerald J. Martyniak

IPC: H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K7/06

CPC classification number: H05K3/325 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/183 ,  H05K3/303 ,  H05K3/3421 ,  H05K1/111 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2201/10393 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10598 ,  H05K2201/10651 ,  H05K2201/10689 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.

Abstract translation: 电气部件（10或30）通过形成从板的安装表面突出的多个热塑性销（20,35）紧固到印刷电路板（11）的安装表面（16），邻近于部件的位置 被安置在。 部件被放置在板上，使得部件的一部分邻近销的部分定位，随后销的部分被加热并围绕部件的部分形成以形成塑料锁定部分（22或37） 组件到板的所需位置。 板的安装表面（16）可以形成有一个口袋（18或33），该口袋（18或33）将部件接收并定位在所需的位置，使得元件引线（17或32）沿着安装表面延伸， 接触区域（14,34），其沉积在安装表面上，之后通过回流焊接将引线附接到接触区域。