公开(公告)号：US20090325407A1

公开(公告)日：2009-12-31

申请号：US12164847

申请日：2008-06-30

Applicant: Hung Thai Nguyen ,  Brent D. Yohn

Inventor： Hung Thai Nguyen ,  Brent D. Yohn

IPC: H01R12/00

CPC classification number: H01R12/57 ,  H01R4/028 ,  H01R12/52 ,  H01R13/055 ,  H01R13/114 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/1084 ,  Y02P70/613

Abstract: An electrical connector includes a housing having a mating end and a board end. The housing has a plurality of contact cavities extending along a longitudinal axis between the mating and board ends. A plurality of contacts are received within the contact cavities. The contacts have a mating end and a mounting end, and the contacts have a flexible tail at the mounting end. The tail has a first portion extending along the longitudinal axis and a second portion angled with respect to the first portion with the second portion having a board mounting surface configured to mount to a circuit board. The tail includes a slot open along the board mounting surface.

Abstract translation: 电连接器包括具有配合端和板端的壳体。 壳体具有沿配合板和板端之间的纵向轴线延伸的多个接触腔。 多个触点被接收在接触腔内。 触点具有配合端和安装端，并且触头在安装端具有柔性尾部。 尾部具有沿着纵向轴线延伸的第一部分和相对于第一部分成角度的第二部分，第二部分具有被配置成安装到电路板的板安装表面。 尾部包括沿板安装表面开放的槽。

公开(公告)号：US20080292846A1

公开(公告)日：2008-11-27

申请号：US12123944

申请日：2008-05-20

Applicant: Masakazu MURANAGA

Inventor： Masakazu MURANAGA

IPC: B32B3/02 ,  B05D5/12

CPC classification number: H05K3/341 ,  H01L23/053 ,  H01L23/10 ,  H01L23/552 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/16152 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K9/0026 ,  H05K2201/10371 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10T428/24488 ,  H01L2924/014 ,  H01L2224/0401

Abstract: When manufacturing an electronic component having a flip chip or a surface mount component mounted on a sheet substrate and being covered with a shield cover, the above shield cover is dipped into cream solder and placed on the above sheet substrate after the above cream solder is attached to the peripheral edge sides of the above shield cover, and then the shield cover is fixed to the sheet substrate by reflow process. With such manufacturing, it becomes possible to efficiently fix the shield cover to the sheet substrate. Also, the shield cover can securely be fixed against the bend of the sheet substrate produced during the reflow.

Abstract translation: 当制造具有安装在片状基板上并覆盖有屏蔽罩的倒装芯片或表面安装部件的电子部件时，将上述屏蔽盖浸入膏状焊剂中，并且在上述膏状焊料附着之后放置在上述片状基材上 到上述屏蔽罩的周边边缘，然后通过回流工艺将屏蔽盖固定到片状基板。 通过这样的制造，可以将屏蔽罩有效地固定在片状基板上。 此外，屏蔽盖可以牢固地固定抵靠在回流期间产生的片状基板的弯曲。

公开(公告)号：US20080203422A1

公开(公告)日：2008-08-28

申请号：US12012379

申请日：2008-02-01

Applicant: Sheng-Jia Sheu ,  Chien-Chang Pei

Inventor： Sheng-Jia Sheu ,  Chien-Chang Pei

IPC: H01L33/00

CPC classification number: H05K3/326 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/1084 ,  Y10T29/41 ,  H01L2924/00

Abstract: A structure of a light emitting diode is provided. The light emitting diode comprises a light emitting diode die; two conductive frames electronically and respectively connecting to the cathode and anode of the light emitting diode die, and two substrates. Each conductive frame has a fixing hole and each substrate has a protrusive pillar. The upper opening of the fixing hole is broader than the bottom opening. The protrusive pillar is inserted into the fixing hole and the shape of the protrusive pillar is deformed for fitting and binding with the fixing hole.

Abstract translation: 提供发光二极管的结构。 发光二极管包括发光二极管管芯; 电子地分别连接到发光二极管管芯的阴极和阳极的两个导电框架和两个基板。 每个导电框架具有固定孔，并且每个基板具有突出支柱。 固定孔的上部开口比底部开口宽。 突出柱插入到固定孔中，突出柱的形状变形以与固定孔嵌合。

公开(公告)号：US20080049404A1

公开(公告)日：2008-02-28

申请号：US11827536

申请日：2007-07-12

Applicant: Jurgen Lappohn

Inventor： Jurgen Lappohn

IPC: H05K7/00

CPC classification number: H01R4/02 ,  H01R12/57 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/1084 ,  Y02P70/613

Abstract: The invention relates to a first component (12, 13, 31, 36a-36c, 50, 62) intended for being connected to a second component (14, 15, 51, 63a-63c). The first component (12, 13, 31, 36a-36c, 50, 62) comprises at least one recess (16, 17, 32, 37a-37c, 52a-52c, 64a-64c) having at least one opening (19, 20, 34, 35, 54a-54c) which will be filled at least in part by the second component (14, 15, 51, 63a-63c) which latter is in a flowing condition during establishment of the connection, at least in the area of the opening (19, 34, 54a-54c). A reduction in cross-section (18, 33, 38a-38c, 53a-53c, 65a-65c) is provided in the recess (16, 17, 32, 37a-37c, 52a-52c, 64a-64c) that will be back-filled by the second component (14, 15, 51, 63a-63c) during establishment of the connection. The reduction in cross-section (18, 33, 38a-38c, 53a-53c, 65a-65c) is provided in the recess (16, 17, 32, 37a-37c, 52a-52c, 64a-64c) on the side facing the second component (14, 15, 51, 63a-63c).

Abstract translation: 本发明涉及用于连接到第二部件（14,15,51,63a-63c）的第一部件（12,13,31,36a-36c，50,62）。 第一部件（12,13,31,36a-36c，50,62）包括至少一个凹部（16,17,32,37a-37c，52a-52c，64a-64c） 具有至少一个开口（19,20,34,35,54a-54c），其将被至少部分地由第二部件（14,15,51,63a-63c）填充，所述第二部件 至少在开口区域（19,34,54a-54c）中建立连接期间的流动状态。 在凹部（16,17,32,37a-37c，52a-55c）中设置横截面（18,33,38a-38c，53a-53c，65a-65c） 52 c，64 a-64 c），在连接建立过程中将由第二组件（14,15,51,63 a-63 c）反向填充。 在凹部（16,17,32,37a-37c，52a-65c）中设置横截面（18,33,38a-38c，53a-53c，65a-65c） 52c，64a-64c）在面向第二部件（14,15,51,63a-63c）的一侧。

公开(公告)号：US20070199926A1

公开(公告)日：2007-08-30

申请号：US11709728

申请日：2007-02-23

Applicant: Hirofumi Watanabe ,  Daisuke Yasukawa ,  Masaaki Suzuku

Inventor： Hirofumi Watanabe ,  Daisuke Yasukawa ,  Masaaki Suzuku

IPC: B23K26/22

CPC classification number: H05K3/328 ,  B23K26/244 ,  B23K2101/42 ,  H01R43/0221 ,  H05K3/202 ,  H05K2201/10689 ,  H05K2201/10818 ,  H05K2201/1084 ,  H05K2203/107

Abstract: The invention stabilizes a quality of a laser welding in a terminal in which an outer appearance characteristic is not stabilized, and achieves an improvement of a positioning characteristic at a time of executing the laser welding without generating a cost increase. A hole is formed in a terminal of an integrated circuit sealed by a plastic molding. At a time of welding, a welding operation position is positioned by recognizing the hole in accordance with an image recognition, and a laser welding is executed by irradiating a laser beam to a portion of a terminal and a bus bar positioned near an edge portion of the hole. The hole is preferably formed in a circular shape or a similar shape thereto.

Abstract translation: 本发明稳定了外观特性不稳定的端子中的激光焊接的质量，并且在执行激光焊接时实现了定位特性的提高，而不会导致成本增加。 在由塑料模制件密封的集成电路的端子中形成孔。 在焊接时，通过根据图像识别来识别孔来定位焊接操作位置，并且通过将激光束照射到位于端子的边缘部分附近的端子和母线的一部分来执行激光焊接 那个洞。 该孔优选形成为圆形或类似形状。

公开(公告)号：US20070117453A1

公开(公告)日：2007-05-24

申请号：US11624409

申请日：2007-01-18

Applicant: Slobadan Pavlovic

Inventor： Slobadan Pavlovic

IPC: H01R13/66

CPC classification number: H01R43/0256 ,  H01R4/023 ,  H01R13/41 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/10772 ,  H05K2201/1084 ,  Y02P70/613

Abstract: A surface mount electrical connector includes a terminal body having a first elongate member that cooperates with a housing to secure the terminal body to the connector housing. A second elongate member of the terminal body includes a curved portion having an aperture therethrough. The curved portion includes a convex surface that facilitates automated assembly operations, and the aperture helps to overcome surface tension in liquid solder, thereby promoting a secure electrical connection.

Abstract translation: 表面安装电连接器包括终端主体，其具有与壳体配合的第一细长构件，以将终端主体固定到连接器壳体。 终端主体的第二细长构件包括具有穿过其中的孔的弯曲部分。 弯曲部分包括有助于自动组装操作的凸面，并且该孔有助于克服液体焊料中的表面张力，由此促进安全的电连接。

公开(公告)号：US20070042618A1

公开(公告)日：2007-02-22

申请号：US11504323

申请日：2006-08-15

Applicant: Tetsuya Aihara

Inventor： Tetsuya Aihara

IPC: H05K1/00

CPC classification number: H01R43/0256 ,  H01R12/707 ,  H01R2201/20 ,  H05K3/3426 ,  H05K2201/1084 ,  Y02P70/613 ,  Y10S439/91

Abstract: A circuit board connector has a housing 10 and terminal fittings (30) mounted in the housing (10). The terminal fittings (30) have board connecting portions (34) drawn out of the housing (10). The board connecting portions (34) are arranged on the surface of a circuit board (K) and connected with conductors on the circuit board (K) by soldering. Notches (36) are formed in lateral edges (37) of the board connecting portions (34) and have upward-sloped surfaces (39) to which solder (H) applied to the conductors adheres. A solder test is conducted by observing from above the adhered state of the solder (H) to the sloped surfaces (39) of the notches (36).

Abstract translation: 电路板连接器具有壳体10和安装在壳体（10）中的端子接头（30）。 端子接头（30）具有从壳体（10）拉出的板连接部分（34）。 板连接部分（34）布置在电路板（K）的表面上，并通过焊接与电路板（K）上的导体连接。 在板连接部分（34）的横向边缘（37）上形成有凹口（36），并且具有向导向部分施加焊料（H）的向上倾斜表面（39）。 通过从上述焊料（H）的粘附状态观察到凹口（36）的倾斜表面（39）进行焊接试验。

公开(公告)号：US20070029572A1

公开(公告)日：2007-02-08

申请号：US11497233

申请日：2006-08-02

Applicant: Kyung Han ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

Inventor： Kyung Han ,  Seon Lee ,  Hun Hahm ,  Seong Han ,  Chang Song ,  Young Park

IPC: H01L33/00 ,  H01L21/00

CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H05K3/3426 ,  H05K3/3494 ,  H05K2201/10106 ,  H05K2201/10651 ,  H05K2201/1084 ,  H05K2203/0195 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The invention relates to an LED with an improved soldering structure, a method of assembling the LED to a PCB, and an LED assembly manufactured by the method. The LED includes an LED chip and a pair of leads with an end electrically connected the LED chip and the other end to be connected to an external power source, having a hole or a cutout part formed therein. The LED also includes a package body housing a part of the lead in the side of the LED chip, and a transparent lens placed on a surface of the package body in the side of the LED chip, for emitting light laterally. This improves soldering conditions for soldering with the other end of the lead placed on the solder, saving the amount of a solder paste while enhancing bonding strength after soldering.

Abstract translation: 本发明涉及具有改进的焊接结构的LED，将LED组装到PCB的方法以及通过该方法制造的LED组件。 LED包括LED芯片和一对引线，端部电连接LED芯片，另一端连接到外部电源，其中形成有孔或切口部分。 LED还包括容纳LED芯片侧的引线的一部分的封装体，以及位于LED芯片侧的封装体的表面上的透明透镜，用于横向发光。 这样可以提高钎焊焊接条件，同时提高焊接后的焊接强度。

公开(公告)号：US07098081B2

公开(公告)日：2006-08-29

申请号：US10490980

申请日：2002-09-27

Applicant: Masayuki Sakakibara ,  Masaru Morishita

Inventor： Masayuki Sakakibara ,  Masaru Morishita

IPC: H01L21/44 ,  H01L23/48

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/4867 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49582 ,  H01L23/49805 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/0347 ,  H05K2201/10689 ,  H05K2201/1084 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Cut faces 15a to 15h are formed on the front end faces 13a to 13h of the exposed portions 12a to 12h of respective lead terminals 11a to 11h of a semiconductor device 100, and plating for increasing the solderability is provided on the cut faces 15a to 15h.

Abstract translation: 在半导体装置100的各个引线端子11a至11h的暴露部分12a至12h的前端面13a至13h处形成切割面15至15h，并且用于增加可焊性的电镀是 设置在切割面15a至15h上。

公开(公告)号：US20050254224A1

公开(公告)日：2005-11-17

申请号：US10512012

申请日：2003-03-31

Applicant: Gustav Fagrenius ,  Fredrik Palmqvist

Inventor： Gustav Fagrenius ,  Fredrik Palmqvist

IPC: H05K3/34 ,  H05K7/14 ,  H05K9/00

CPC classification number: H05K9/0028 ,  H05K3/341 ,  H05K2201/10371 ,  H05K2201/1084 ,  H05K2201/10984 ,  Y02P70/613 ,  Y10T29/49002

Abstract: A method for providing a PCB (printed circuit board) with a shield can (1) comprising a metal shell with a free rim (5). The method prescribes that the rim (5) of the shield can (1) is provided with an extra amount of solder (8) before the shield can (1) is placed on the PCB. A shield can (1) is also described.

Abstract translation: 一种用于提供具有屏蔽罩的PCB（印刷电路板）的方法（1），其包括具有自由边缘（5）的金属外壳。 该方法规定，在屏蔽罐（1）放置在PCB上之前，屏蔽罩（1）的边缘（5）设置有额外的焊料（8）。 还描述了屏蔽罩（1）。