公开(公告)号：US4347552A

公开(公告)日：1982-08-31

申请号：US140263

申请日：1980-04-14

Applicant: Robert E. Pearcy ,  James E. Raus

Inventor： Robert E. Pearcy ,  James E. Raus

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/34 ,  H05K1/00

CPC classification number: H05K3/308 ,  H01R12/65 ,  H05K1/118 ,  H05K2201/10651 ,  H05K2201/1078 ,  H05K2201/10878 ,  H05K3/3447

Abstract: A lead (12) of an electrical component (10) is formed with an arrowhead-shaped tip (20) that functions to mechanically fasten the lead and component to a substrate (14), such as a flexible printed circuit (11). The tip is formed with barbs (21) extending rearwardly from the end (22) of the tip and having a width (W) across the barbs greater than the diameter (d) of a mounting hole (13) in the substrate. With this arrangement, the barbed tips may be inserted into and through the hole, with the barbs being compressed relatively inward with respect to the hole as the tip passes through the hole, so as to fasten the tips to the substrate in preparation for a soldering operation, in which the tips are soldered (30) to conductive pad areas (16) deposited on the surface of the substrate adjacent to the tips.

Abstract translation: 电气部件（10）的引线（12）形成有用于将引线和部件机械地紧固到诸如柔性印刷电路（11）的基板（14）的箭头形尖端（20）。 尖端形成有从尖端的端部（22）向后延伸的倒钩（21），并且跨越倒钩的宽度（W）大于衬底中的安装孔（13）的直径（d）。 通过这种布置，倒钩尖可以插入孔中并穿过孔，当尖端穿过孔时，倒钩相对于孔相对地被压缩，以便将尖端紧固到基底以准备焊接 操作，其中尖端焊接（30）到沉积在邻近尖端的衬底的表面上的导电焊盘区域（16）。

公开(公告)号：US4246627A

公开(公告)日：1981-01-20

申请号：US20328

申请日：1979-03-14

Applicant: Helmut H. Poensgen

Inventor： Helmut H. Poensgen

IPC: H01G2/06 ,  H01G2/12 ,  H01R4/02 ,  H05K3/30 ,  H05K3/34 ,  H05K1/04

CPC classification number: H01G2/06 ,  H01G2/12 ,  H05K3/308 ,  H01R4/02 ,  H05K2201/10651 ,  H05K2201/1078 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/1178 ,  H05K3/3447

Abstract: To seat an electrical circuit element in a metallized opening of a circuit board and permit escape of solder gases, a bead is placed on the insertion pin and formed with a surface facing the support board which is non-symmetrical with respect to the axis of the pin, and of the insertion opening. Preferably, the surface is conical, and on adjacent pins the cone angles are tilted in opposite directions to provide for the non-symmetrical positioning of any one cone and centered placement of the insertion pins in the insertion openings.

Abstract translation: 为了将电路元件放置在电路板的金属化开口中并允许焊接气体逸出，珠子被放置在插入销上并形成有面向支撑板的表面，该表面相对于轴线是不对称的 销和插入开口。 优选地，表面是圆锥形的，并且在相邻的销上，锥角在相反的方向上倾斜以提供将插入销的任何一个锥体和居中放置在插入开口中的非对称定位。

公开(公告)号：US3693052A

公开(公告)日：1972-09-19

申请号：US3693052D

申请日：1971-04-15

Applicant: WARWICK ELECTRONICS INC

Inventor： GALANTI FRANK

IPC: H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/18

CPC classification number: H05K1/141 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10446 ,  H05K2201/10651 ,  H05K2201/10765 ,  H05K2201/10878 ,  H05K2201/10939

Abstract: The connection of an electrical component to a printed circuit board wherein a lead to the component includes an offset being in frictional engagement with the walls of an opening within the circuit board, the apex of the offset being soldered to be able to electrically connect the lead to the printed circuit path on the underside of the board, the free end of the lead extending exteriorly of the board on the upper surface thereof.

Abstract translation: 电气部件与印刷电路板的连接，其中导向部件的引线包括与电路板内的开口的壁摩擦接合的偏移，所述偏移的顶点被焊接以能够电连接引线 在板的下侧上的印刷电路路径上，引线的自由端在其上表面上延伸到板的外部。

公开(公告)号：US3634601A

公开(公告)日：1972-01-11

申请号：US3634601D

申请日：1970-03-20

Applicant: AMP INC

Inventor： PAUZA WILLIAM VITO

IPC: H01R4/00 ,  H01R4/24 ,  H01R4/50 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K1/04

CPC classification number: H01R4/2491 ,  H01R4/50 ,  H01R12/58 ,  H05K3/308 ,  H05K3/34 ,  H05K2201/0281 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10356 ,  H05K2201/10765 ,  H05K2201/10878 ,  H05K2201/10962 ,  Y10S411/92

Abstract: A staking electrical contact for staking an electrical conductor onto a printed circuit board and in electrical engagement with a printed circuit path on the printed circuit board which comprises a body portion having spaced legs between which the electrical conductor is disposed and the legs are driven into slot means of the printed circuit board until the contact is bottomed whereupon the free ends of the legs are bent into engagement with the printed circuit path and soldered thereto.

Abstract translation: 用于将电导体放置在印刷电路板上并与印刷电路板上的印刷电路路径电接合的电接触件，其包括主体部分，该主体部分具有间隔开的支腿，电导体设置在该主体部分之间， 印刷电路板的装置，直到接点为底部，由此腿的自由端弯曲成与印刷电路路径接合并焊接到其上。

公开(公告)号：US3327284A

公开(公告)日：1967-06-20

申请号：US40139464

申请日：1964-10-05

Applicant: THOMAS & BETTS COMPANY INC

Inventor： CRIMMINS DAVID J

IPC: H01R4/10 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R4/10 ,  H01R12/58 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0281 ,  H05K2201/10765 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/49833 ,  Y10T29/49945

公开(公告)号：US3162721A

公开(公告)日：1964-12-22

申请号：US4542160

申请日：1960-07-26

Applicant: ILLINOIS TOOL WORKS

Inventor： RAYBURN CHARLES C

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K2201/10878

公开(公告)号：US2994057A

公开(公告)日：1961-07-25

申请号：US67809557

申请日：1957-08-14

Applicant: SPRAGUE ELECTRIC CO

Inventor： DONOHUE FRANK L ,  TEEPLE JAMES R

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/49169

公开(公告)号：US20240090130A1

公开(公告)日：2024-03-14

申请号：US17931651

申请日：2022-09-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Chad CHEN ,  Jiahui LIU ,  Wuxing XIA ,  Jingyan LIU

IPC: H05K1/18 ,  H01L23/495 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01L23/49555 ,  H05K3/3485 ,  H05K3/3494 ,  H05K2201/10757 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/10946

Abstract: A semiconductor device package may include a substrate having an insulating layer with a patterned conductive layer formed thereon, the patterned conductive layer including at least a first pattern portion and a second pattern portion. The semiconductor device package may include a leadframe having a lead that is soldered to the substrate with solder provided in an opening between the first pattern portion and the second pattern portion and with the lead inserted into the opening.

公开(公告)号：US09761972B2

公开(公告)日：2017-09-12

申请号：US15200695

申请日：2016-07-01

Applicant: MERCURY SYSTEMS, INC.

Inventor： Philip Beucler ,  Daniel Coolidge ,  Darryl J. McKenney ,  Kevin Jorczak

IPC: H01R9/05 ,  H01R12/71 ,  H01R12/58 ,  H01R13/652 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/716 ,  H01R4/028 ,  H01R9/091 ,  H01R12/526 ,  H01R12/58 ,  H01R12/714 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/421 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10878 ,  H05K2201/10901 ,  Y02P70/611

Abstract: An RF connector includes a conductive pin for carrying an RF signal. The conductive pin has a first longitudinal end that serves to interface with a male RF connector to receive the RF signal. The pin also includes a second longitudinal end for connecting with a printed circuit board (PCB). The second longitudinal end may be tapered, and the pin may have a groove formed above the tapered end. A housing encircles the conductive pin. The housing is shaped and sized to accept the male RF connector. A grounding element may be positioned on the bottom of the housing. The grounding element is to contact the PCB when the connector is connected to the PCB. The grounding element may be ring-shaped and soldered to the housing or epoxied to the housing.

公开(公告)号：US20150345766A1

公开(公告)日：2015-12-03

申请号：US14653945

申请日：2013-12-16

Applicant: Linhua WANG ,  Xiaolei ZHU ,  Lin ZHOU ,  Han ZHAO

Inventor： Linhua Wang ,  Xiaolei Zhu ,  Lin Zhou ,  Han Zhao

IPC: F21V23/06 ,  H01R33/22 ,  H01R33/18 ,  F21K99/00 ,  F21V23/00

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An electric connecting member and an LED lamp using the electric connecting member are provided. The electric connecting member is used for the electric connection between a light source substrate and a driving board of the LED lamp, and comprises an input terminal and an output terminal. The LED lamp comprises the driving board and the light source substrate. The output terminal is provided on the driving board of the LED lamp. The input terminal is disposed upon the light source substrate and is electrically connected to the light source substrate. The output terminal comprises two contacts, and one end of each of the two contacts is electrically connected to the driving board respectively. The input terminal comprises two connection heads which are respectively provided corresponding to the two contacts. One end of each of the two connection heads is electrically connected to the light source substrate respectively.

Abstract translation: 提供使用电连接构件的电连接构件和LED灯。 电连接构件用于光源基板和LED灯的驱动板之间的电连接，并且包括输入端子和输出端子。 LED灯包括驱动板和光源基板。 输出端子设置在LED灯的驱动板上。 输入端子设置在光源基板上并与光源基板电连接。 输出端子包括两个触点，两个触点中的每一个的一端分别电连接到驱动板。 输入端子包括分别对应于两个触头设置的两个连接头。 两个连接头中的每一个的一端分别电连接到光源基板。