公开(公告)号：US09793634B2

公开(公告)日：2017-10-17

申请号：US15060728

申请日：2016-03-04

Applicant: International Business Machines Corporation

Inventor： Na Fan ,  Jun Hu ,  Sen Xiong Huang ,  YongDong Shi ,  XiYuan Yin

IPC: H01R13/415 ,  H01R13/11 ,  H01R43/04 ,  H01R12/71

CPC classification number: H01R13/11 ,  H01R12/57 ,  H01R12/716 ,  H01R43/04 ,  H01R43/205 ,  H05K1/184 ,  H05K3/3447 ,  H05K7/1069 ,  H05K2201/10303 ,  H05K2201/10704 ,  H05K2201/1078 ,  H05K2201/10803

Abstract: A socket housing and contact assembly process includes forming the solder ball contact region after initial installation of a set of contacts into the housing. The contact regions of the set of contacts pass through corresponding contact cavities to extend beyond the housing and the contact regions are formed over at equal angles for solder ball placement.

公开(公告)号：US20170149155A1

公开(公告)日：2017-05-25

申请号：US14952242

申请日：2015-11-25

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/71 ,  H05K1/02 ,  H01R12/58

CPC classification number: H01R12/58 ,  H01R4/028 ,  H01R12/00 ,  H01R12/526 ,  H01R12/714 ,  H01R12/716 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/3421 ,  H05K3/42 ,  H05K3/421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/0455 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation from the surface interconnect during the soldering process. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US20150313024A1

公开(公告)日：2015-10-29

申请号：US14792713

申请日：2015-07-07

Applicant: FUJITSU COMPONENT LIMITED

Inventor： Takeshi Okuyama ,  Toshihiro Kusagaya ,  Tohru Yamakami

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H01R4/028 ,  H01R12/57 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/025 ,  H05K3/3494 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10803 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/04 ,  Y02P70/613

Abstract: Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.

Abstract translation: 公开了一种表面安装装置，其安装在基座构件上，包括多个引线单元，所述多个引线单元中的每一个包括：引线，其包括形成在引线端部的主体部分和脚部; 形成在引脚的脚部处的焊料部分朝向基部构件的方向突出以具有顶部部分，以及设置在引线上的防止扩散部分，用于防止焊料沿引线的主体部分扩散。

公开(公告)号：US20140160709A1

公开(公告)日：2014-06-12

申请号：US14236838

申请日：2012-08-03

Applicant: Tadashi Imai ,  Keisuke Yoshida ,  Kazunari Ueda ,  Toshiyuki Sudo ,  Makoto Makishima

Inventor： Tadashi Imai ,  Keisuke Yoshida ,  Kazunari Ueda ,  Toshiyuki Sudo ,  Makoto Makishima

IPC: H05K7/02 ,  H05K13/04

CPC classification number: H05K7/026 ,  H01R12/716 ,  H01R24/50 ,  H05K1/141 ,  H05K3/0008 ,  H05K3/308 ,  H05K13/04 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10803 ,  Y10T29/4913

Abstract: Provided is a tuner module including a tuner module main body involving a tuner board, a first leg projected from the tuner module main body and to be inserted into a first hole formed on a circuit board main body, a second leg projected from the tuner module main body and to be inserted into a second hole formed on the circuit board main body, the second leg being shorter than the first leg, and a signal terminal projected from the tuner board and to be inserted into a third hole formed on the circuit board main body, the signal terminal being shorter than the second leg. A taper is formed on at least tip end parts of the first leg and the second leg.

Abstract translation: 提供了一种调谐器模块，包括：调谐器模块主体，包括调谐器板;从调谐器模块主体突出并插入形成在电路板主体上的第一孔中的第一支脚;从调谐器模块 主体并插入到形成在电路板主体上的第二孔中，第二腿短于第一腿部，以及从调谐器板突出并插入形成在电路板上的第三孔中的信号端子 主体，信号端子比第二支腿短。 在第一腿部和第二腿部的至少前端部分上形成锥形部。

公开(公告)号：US20240268033A1

公开(公告)日：2024-08-08

申请号：US18436098

申请日：2024-02-08

Applicant: Robert Bosch GmbH

Inventor： Florian Eichkorn

IPC: H05K1/18

CPC classification number: H05K1/189 ,  H05K2201/05 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09745 ,  H05K2201/10181 ,  H05K2201/10803

Abstract: A flexible printed circuit board, in particular for connecting electrical and/or electronic components, includes a fuse conductor track (10). The fuse conductor track has a conductor width (B1) formed on the flexible printed circuit board (1). The fuse conductor track (10) has a taper (12) in a fuse area (11) of the fuse conductor track (10), at which the fuse conductor track (10) has a fuse width (B2) which is smaller than the conductor width (B1) of the fuse conductor track (10) outside the fuse area (11).

公开(公告)号：US09967977B1

公开(公告)日：2018-05-08

申请号：US14308283

申请日：2014-06-18

Applicant: Arkansas Power Electronics International, Inc.

Inventor： Brice McPherson

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K2201/10803 ,  H05K2201/1081

Abstract: A step etched metal electrical contact including a main body formed from a metal sheet defining a metal tab sized to match a die/device terminal and an electrical clearance aperture, electrical clearance trench, and/or an electrical clearance gaps. A heat sink may be combined with the step etched metal electrical contact to provide double sided module cooling for increased thermal performance of power modules.

公开(公告)号：US20170244184A1

公开(公告)日：2017-08-24

申请号：US15422978

申请日：2017-02-02

Applicant: MERCURY SYSTEMS, INC.

Inventor： Darryl J. MCKENNEY ,  Absu METHRATTA ,  Erica OUELLETTE

IPC: H01R12/71 ,  H05K1/02 ,  H05K1/11 ,  H01R13/405 ,  H01R13/05

CPC classification number: H01R12/58 ,  H01R4/028 ,  H01R12/00 ,  H01R12/526 ,  H01R12/714 ,  H01R12/716 ,  H01R13/05 ,  H01R13/405 ,  H01R13/652 ,  H05K1/0213 ,  H05K1/0237 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/181 ,  H05K1/184 ,  H05K3/308 ,  H05K3/34 ,  H05K3/3421 ,  H05K3/42 ,  H05K3/421 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09545 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/1078 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2203/0455 ,  Y02P70/611

Abstract: According to exemplary embodiments, a tapered surface interconnect is formed on a printed circuit board (PCB). A compliant pin of an electrical connector may be coupled to the tapered surface interconnect and soldered thereto. The surface interconnect may be formed by drilling through one or more layers of the PCB. The depth of the surface interconnect may be shorter than a height or a thickness of the PCB. The surface interconnect may have a tapered side wall to allow for a better fit with a tapered compliant pin. The inclination of the side wall of the surface interconnect may be linear or concave. The intersection between the tapered sidewall and the bottom of the surface interconnect may be rounded to minimize pin insertion issues and may allow for easier solder flux evacuation. The compliant pin may be soldered into place upon being coupled to the tapered surface interconnect.

公开(公告)号：US20160021747A1

公开(公告)日：2016-01-21

申请号：US14333774

申请日：2014-07-17

Applicant: DELPHI INTERNATIONAL OPERATIONS LUXEMBOURG, S.A.R.L.

Inventor： KIN YEAN CHOW

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/116 ,  H05K1/181 ,  H05K3/308 ,  H05K3/328 ,  H05K2201/10015 ,  H05K2201/10803 ,  H05K2201/10856 ,  H05K2201/10901 ,  H05K2201/10924 ,  H05K2203/107

Abstract: A circuit board assembly includes a printed circuit board and a component. The printed circuit board includes a plated thru-hole through the printed circuit board. The component includes a lead to interconnect the component to the printed circuit board. The lead is formed to define an opening through the lead. The lead is placed into the plated thru-hole such that at least part of the opening is within the plated thru-hole. The lead is laser welded to the plated thru-hole.

Abstract translation: 电路板组件包括印刷电路板和部件。 印刷电路板包括穿过印刷电路板的电镀通孔。 该部件包括用于将部件与印刷电路板互连的引线。 引线形成为通过引线定义开口。 引线被放置在电镀通孔中，使得开口的至少一部分在电镀通孔内。 铅被激光焊接到电镀通孔上。

公开(公告)号：US20140198471A1

公开(公告)日：2014-07-17

申请号：US14149864

申请日：2014-01-08

Applicant: FUJITSU LIMITED

Inventor： Naohiko Kajio ,  NAOFUMI KOSUGI ,  Yoshio Matsumoto

IPC: H05K1/14

CPC classification number: H05K1/142 ,  H05K1/144 ,  H05K7/142 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10568 ,  H05K2201/10803 ,  H05K2201/2036 ,  H05K2203/167

Abstract: First and second tapered holes are provided at facing positions of the first and second circuit boards. The elastic spacer including first and second spacers is attached between them to couple the two in parallel and thereby facilitate attachment of the two to a back panel. The first spacer is provided at one end part with a tapered part which fits with the first tapered hole and the second spacer is provided at one end part with a tapered part which fits with the second tapered hole. A spring is inserted between the two spacers. The first spacer is fit in the tapered hole and fastened by a screw to the first circuit board. The second circuit board is fastened by a screw to the first spacer in a state fitting the second tapered hole over the second spacer with the second circuit board approaching the first circuit board.

Abstract translation: 第一和第二锥形孔设置在第一和第二电路板的相对位置处。 包括第一和第二间隔件的弹性间隔件连接在它们之间以使两者平行连接，从而便于将两者附接到后面板。 第一间隔件在一端部设置有与第一锥形孔配合的锥形部，第二间隔件在一端部设置有与第二锥形孔配合的锥形部。 弹簧插入两个间隔件之间。 第一间隔件装配在锥形孔中，并通过螺钉固定在第一电路板上。 第二电路板通过螺钉固定在第一间隔件上，其状态是将第二锥形孔装配在第二间隔件上，而第二电路板接近第一电路板。

公开(公告)号：US20100099274A1

公开(公告)日：2010-04-22

申请号：US12495265

申请日：2009-06-30

Applicant: Sung-Yu Hsieh ,  Wen-Chin Wu

Inventor： Sung-Yu Hsieh ,  Wen-Chin Wu

IPC: H01R12/00 ,  H05K3/30

CPC classification number: H01R12/7005 ,  H01R12/7052 ,  H01R12/716 ,  H05K1/182 ,  H05K3/306 ,  H05K2201/09063 ,  H05K2201/09954 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2203/167 ,  Y10T29/49139

Abstract: A sinking type electrical connector is adapted for coupling to a circuit board. The sinking type electrical connector includes a body and at least one limiting unit. The body has a front end portion, a connecting portion provided in the front end portion, and a top surface. The limiting unit is provided at one side of the body and includes a plurality of limiting portions respectively located at different levels. A selected one of the limiting portions of the limiting unit which are at different levels is brought to engage the circuit board so that a distance from the top surface of the body to the circuit board is changeable.

Abstract translation: 沉没式电连接器适于耦合到电路板。 沉没式电连接器包括主体和至少一个限制单元。 主体具有前端部，设置在前端部的连接部和顶面。 限制单元设置在主体的一侧，并且包括分别位于不同级别的多个限制部分。 限制单元的不同级别的限定部分中的选定的一个使得电路板接合，使得从主体的顶表面到电路板的距离是可变的。