公开(公告)号：US20080017409A1

公开(公告)日：2008-01-24

申请号：US11806485

申请日：2007-05-31

Applicant: Satoshi Takeuchi ,  Hiroki Kamiya ,  Motoki Shimizu

Inventor： Satoshi Takeuchi ,  Hiroki Kamiya ,  Motoki Shimizu

IPC: H05K1/16

CPC classification number: H05K1/186 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/10909

Abstract: A multilayer board includes a base member made of an insulation material. A plurality of conductor patterns is disposed in the base member in a multi-layered manner. A plurality of interlayer connectors is disposed in the base member, and is electrically connected to the conductor pattern by a heating process. An electronic device is disposed in the base member, and is electrically connected to at least one of the interlayer connector and the conductor pattern. The electronic device includes an electrode made of a material having a melting point higher than a temperature of the heating process.

Abstract translation: 多层基板包括由绝缘材料制成的基座部件。 多个导体图案以多层方式设置在基底构件中。 多个层间连接器设置在基底构件中，并且通过加热工艺电连接到导体图案。 电子设备设置在基座构件中，并且电连接到层间连接器和导体图案中的至少一个。 电子装置包括由熔点高于加热过程的温度的材料制成的电极。

公开(公告)号：US07273988B2

公开(公告)日：2007-09-25

申请号：US11150210

申请日：2005-06-13

Applicant: Yuki Momokawa

Inventor： Yuki Momokawa

IPC: H05K1/16

CPC classification number: H05K3/3452 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/099 ,  H05K2201/10568 ,  H05K2201/10575 ,  H05K2201/10901 ,  H05K2201/10909 ,  H05K2201/2036 ,  H05K2201/2081 ,  H05K2203/0182 ,  H05K2203/0577 ,  H05K2203/0588 ,  H05K2203/1189 ,  H05K2203/1394

Abstract: An electronic device is mounted on a wiring board, which includes: a substrate having through holes, and lands extending on surfaces of the substrate and adjacent to openings of the through holes. Further, at least one coating layer is provided, which coats at least one part of an outer peripheral region of the at least one land, in order to cause that the at least one part is separated from a lead-less solder, thereby preventing any peel of the land from the surface of the substrate.

Abstract translation: 电子装置安装在布线板上，其包括：具有通孔的基板和在基板的表面上延伸并与通孔的开口相邻的台阶。 此外，提供至少一个涂层，其涂覆至少一个焊盘的外周区域的至少一部分，以便使至少一个部件与无铅焊料分离，从而防止任何 从基材表面剥离土地。

公开(公告)号：US07202677B2

公开(公告)日：2007-04-10

申请号：US10749028

申请日：2003-12-30

Applicant: David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

Inventor： David V. Pedersen ,  Benjamin N. Eldridge ,  Igor Y. Khandros

IPC: G01R31/02

CPC classification number: H01L25/16 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/01 ,  G01R31/2863 ,  G01R31/2886 ,  G01R31/2889 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/06 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L2223/54473 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19043 ,  H05K1/141 ,  H05K3/20 ,  H05K3/325 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/09472 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

Abstract translation: 提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。 插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。 公开了各种捕获垫结构。 通过邻近插座基板表面的导电迹线提供与外部设备的连接。 插座基板可以由支撑基板支撑。 在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

公开(公告)号：US20070047278A1

公开(公告)日：2007-03-01

申请号：US11478534

申请日：2006-06-30

Applicant: Shingo Yamamoto ,  Hiroyuki Ishibashi ,  Katsumi Matsuda

Inventor： Shingo Yamamoto ,  Hiroyuki Ishibashi ,  Katsumi Matsuda

IPC: H02M1/00

CPC classification number: H01L23/49582 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0233 ,  H05K3/202 ,  H05K3/244 ,  H05K2201/086 ,  H05K2201/10909 ,  H01L2924/00

Abstract: A wiring board (lead frame) has a configuration in which a high-frequency current suppression member formed of a conductive soft magnetic film having high magnetic permeability is provided in a near field (magnetic field dominant area) in a lead frame part (wiring part) which can be a radiation noise source, preferably, in the periphery of the lead frame part.

Abstract translation: 布线基板（引线框架）具有这样的结构，即在引线框架部分（布线部分）中的近场（磁场主导区域）中设置由具有高磁导率的导电软磁膜形成的高频电流抑制部件 ），其可以是辐射噪声源，优选地在引线框架部分的周边。

公开(公告)号：US07176388B2

公开(公告)日：2007-02-13

申请号：US10991401

申请日：2004-11-19

Applicant: Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

Inventor： Kazuhiko Tanabe ,  Hiroaki Terada ,  Masahiro Sugiura ,  Tetsuharu Mizutani ,  Keiichiro Imamura ,  Takashi Tanaka

IPC: H05K5/00

CPC classification number: H05K3/3415 ,  B23K1/085 ,  B23K1/20 ,  B23K3/0653 ,  B23K35/262 ,  B23K35/3613 ,  B23K35/3618 ,  H01L2924/0002 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3484 ,  H05K2201/10909 ,  H05K2203/044 ,  H05K2203/047 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.

Abstract translation: 在包含形成在电子部件的表面上的钯或钯合金层的电子部件的焊接方法中，还包括焊接引线端子到包括焊接区域和电镀通孔的印刷电路板上的焊锡层， 并且通过HAL处理在所述焊盘通孔的表面上形成作为主要部件的锌。 引线端子插入并安装在通孔中。 印刷电路板与含有锡和锌的焊料的喷射流作为主要成分接触，从而向焊盘和通孔提供焊料。

公开(公告)号：US07172438B2

公开(公告)日：2007-02-06

申请号：US11071774

申请日：2005-03-03

Applicant: Brian Vicich ,  Steve Koopman

Inventor： Brian Vicich ,  Steve Koopman

IPC: H01R12/00

CPC classification number: H01R12/57 ,  H01R12/707 ,  H01R13/02 ,  H01R13/03 ,  H01R13/41 ,  H01R43/00 ,  H01R43/0256 ,  H05K3/3426 ,  H05K2201/10909 ,  H05K2201/10984 ,  H05K2201/2081 ,  H05K2203/041 ,  Y02P70/613

Abstract: An electrical contact for use in an electrical connector, includes a contact body made of metal and having a contact head, a contact tail, and an anti-wicking region disposed between the contact head and the contact tail arranged to prevent wicking of a fusible material past the anti-wicking region in a direction toward the contact head. The anti-wicking region is defined by one of a laser-ablated portion, a laser marking material, a UV marking material, and an ink that is permanently disposed on the contact body.

Abstract translation: 用于电连接器的电接触件包括由金属制成并具有接触头，接触尾部和布置在接触头和接触尾部之间的防吸芯区域的接触体，其布置成防止易熔材料的芯吸 在朝向接触头的方向上穿过防吸芯区域。 防吸芯区域由激光烧蚀部分，激光打标材料，UV标记材料和永久地设置在接触体上的墨水之一限定。

公开(公告)号：US07064566B2

公开(公告)日：2006-06-20

申请号：US09042606

申请日：1998-03-16

Applicant: Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

Inventor： Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

公开(公告)号：US07060534B2

公开(公告)日：2006-06-13

申请号：US10757549

申请日：2004-01-15

Applicant: Manfred Dobler ,  Georg Erhard Eggers ,  Christian Stocken

Inventor： Manfred Dobler ,  Georg Erhard Eggers ,  Christian Stocken

IPC: H01L21/44

CPC classification number: H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00

Abstract: A housing, in particular for semiconductor devices, a semiconductor device pin, and a method for the manufacturing of pins wherein at least one pin is punched out from a basic body, in particular a lead framed, by means of one or a plurality of punching process steps, wherein the pin is coated with a separate metal layer after the final punching out of said pin.

Abstract translation: 一种用于半导体器件的壳体，半导体器件引脚和用于制造引脚的方法，其中至少一个引脚通过一个或多个冲压从基体（特别是引线框架）冲压出来 工艺步骤，其中在所述销的最后冲压之后，销被单独的金属层涂覆。

公开(公告)号：US20060033517A1

公开(公告)日：2006-02-16

申请号：US11256514

申请日：2005-10-19

Applicant: Igor Khandros ,  Gaetan Mathieu

Inventor： Igor Khandros ,  Gaetan Mathieu

IPC: G01R31/02

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/72

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

公开(公告)号：US06953986B2

公开(公告)日：2005-10-11

申请号：US09733718

申请日：2000-12-08

Applicant: Donald C. Abbott ,  Michael E. Mitchell ,  Paul R. Moehle ,  Douglas W. Romm

Inventor： Donald C. Abbott ,  Michael E. Mitchell ,  Paul R. Moehle ,  Douglas W. Romm

IPC: C25D5/12 ,  C25D7/00 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50 ,  H05K3/34

CPC classification number: C23C30/00 ,  C25D5/14 ,  C25D5/34 ,  H01L21/4821 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48764 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10689 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A leadframe for use in the assembly of integrated circuit chips comprising a base metal structure having an adherent layer of nickel covering said base metal; an adherent film of palladium on said nickel layer; and an adherent layer of palladium on said palladium film, selectively covering areas of said leadframe suitable for bonding wire attachment and solder attachment.

Abstract translation: 一种用于组装集成电路芯片的引线框，其包括具有覆盖所述母材的镍的粘附层的基底金属结构; 在所述镍层上的钯的粘附膜; 和在所述钯膜上的钯的粘附层，选择性地覆盖所述引线框的适合于接合引线附着和焊料附着的区域。