公开(公告)号：US12166137B2

公开(公告)日：2024-12-10

申请号：US18239636

申请日：2023-08-29

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Taeseok Kim ,  David Smith

IPC: H01L31/02 ,  H01L31/0216 ,  H01L31/18

Abstract: Aligned metallization approaches for fabricating solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a semiconductor layer over a semiconductor substrate. A first plurality of discrete openings is in the semiconductor layer and exposes corresponding discrete portions of the semiconductor substrate. A plurality of doped regions is in the semiconductor substrate and corresponds to the first plurality of discrete openings. An insulating layer is over the semiconductor layer and is in the first plurality of discrete openings. A second plurality of discrete openings is in the insulating layer and exposes corresponding portions of the plurality of doped regions. Each one of the second plurality of discrete openings is entirely within a perimeter of a corresponding one of the first plurality of discrete openings. A plurality of conductive contacts is in the second plurality of discrete openings and is on the plurality of doped regions.

公开(公告)号：US12159955B2

公开(公告)日：2024-12-03

申请号：US17409617

申请日：2021-08-23

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Richard Hamilton Sewell ,  Gabriela Elena Bunea

IPC: H01L31/18 ,  H01L31/0224 ,  H01L31/048 ,  H01L31/05 ,  H01L31/068

Abstract: Disclosed herein are approaches to fabricating solar cells, solar cell strings and solar modules using roll-to-roll foil-based metallization approaches. Methods disclosed herein can comprise the steps of providing at least one solar cell wafer on a first roll unit and conveying a metal foil to the first roll unit. The metal foil can be coupled to the solar cell wafer on the first roll unit to produce a unified pairing of the metal foil and the solar cell wafer. We disclose solar energy collection devices and manufacturing methods thereof enabling reduction of manufacturing costs due to simplification of the manufacturing process by a high throughput foil metallization process.

公开(公告)号：US20240387762A1

公开(公告)日：2024-11-21

申请号：US18197651

申请日：2023-05-15

Applicant: Maxeon Solar Pte. Ltd.

Inventor： David Smith ,  Gerly Reich

IPC: H01L31/068 ,  H01L31/02 ,  H01L31/028 ,  H01L31/0352 ,  H01L31/0368 ,  H01L31/0376 ,  H01L31/18 ,  H01L31/20

Abstract: Methods of fabricating solar cell emitter regions with differentiated P-type and N-type layouts and incorporating dotted diffusion, and resulting solar cells, are described. In an example, a solar cell includes a substrate having a light-receiving surface and a back surface. A first polycrystalline silicon emitter region of a first conductivity type is on a first thin dielectric layer on the back surface of the substrate. A second polycrystalline silicon emitter region of a second, different, conductivity type is on a second thin dielectric layer on the back surface of the substrate. The second polycrystalline silicon emitter region has a vertical thickness less than a vertical thickness of the first polycrystalline silicon emitter region.

公开(公告)号：US20240379884A1

公开(公告)日：2024-11-14

申请号：US18783283

申请日：2024-07-24

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  DAVID AARON RANDOLPH BARKHOUSE ,  JUNBO WU ,  MICHAEL CUDZINOVIC ,  PAUL LOSCUTOFF ,  JOSEPH BEHNKE ,  MICHEL ARSÈNE OLIVIER NGAMO TOKO

IPC: H01L31/0224 ,  H01L31/02 ,  H01L31/068 ,  H01L31/0745

Abstract: Approaches for the metallization of solar cells and the resulting solar cells are described. In an example, a method of fabricating a solar cell involves forming a barrier layer on a semiconductor region disposed in or above a substrate. The semiconductor region includes monocrystalline or polycrystalline silicon. The method also involves forming a conductive paste layer on the barrier layer. The method also involves forming a conductive layer from the conductive paste layer. The method also involves forming a contact structure for the semiconductor region of the solar cell, the contact structure including at least the conductive layer.

公开(公告)号：US20240372024A1

公开(公告)日：2024-11-07

申请号：US18143493

申请日：2023-05-04

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Mingchong Dai ,  Jianfang Si ,  Qiang Zhang ,  Hongshuai Xu ,  Jialin Shen ,  Nicholas Berry

IPC: H01L31/048 ,  H01L31/18

Abstract: A PV laminate and methods of assembly are provided. The PV cells of exemplary PV laminates may comprise a shingled linear array of PV cells where one or more spacers are employed near the connections between adjacent PV cells of the linear array. These spacers can serve to reduce stresses during assembly of the PV laminate and may be later substantially subsumed in encapsulant once assembly of the PV laminate is completed.

公开(公告)号：US20240372016A1

公开(公告)日：2024-11-07

申请号：US18773281

申请日：2024-07-15

Applicant: Maxeon Solar Pte. Ltd.

Inventor： STAFFAN WESTERBERG ,  SEUNG BUM RIM

IPC: H01L31/0216 ,  H01L31/0224 ,  H01L31/0236 ,  H01L31/028 ,  H01L31/0288 ,  H01L31/0368 ,  H01L31/0376 ,  H01L31/068 ,  H01L31/18 ,  H01L31/20

Abstract: Methods of fabricating solar cell emitter regions with differentiated P-type and N-type architectures and incorporating a multi-purpose passivation and contact layer, and resulting solar cells, are described. In an example, a solar cell includes a substrate having a light-receiving surface and a back surface. A P-type emitter region is disposed on the back surface of the substrate. An N-type emitter region is disposed in a trench formed in the back surface of the substrate. An N-type passivation layer is disposed on the N-type emitter region. A first conductive contact structure is electrically connected to the P-type emitter region. A second conductive contact structure is electrically connected to the N-type emitter region and is in direct contact with the N-type passivation layer.

公开(公告)号：US20240313133A1

公开(公告)日：2024-09-19

申请号：US18674200

申请日：2024-05-24

Applicant: Maxeon Solar Pte. Ltd.

Inventor： RICHARD HAMILTON SEWELL ,  ROBERT WOEHL ,  JENS DIRK MOSCHNER ,  NILS-PETER HARDER

IPC: H01L31/0224 ,  H01L31/068

CPC classification number: H01L31/022441 ,  H01L31/0682 ,  Y02E10/547

Abstract: Approaches for fabricating wire-based metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal wires. Each metal wire of the plurality of metal wires is parallel along a first direction to form a one-dimensional layout of a metallization layer for the solar cell.

公开(公告)号：US12081168B2

公开(公告)日：2024-09-03

申请号：US17824324

申请日：2022-05-25

Applicant: Maxeon Solar Pte. Ltd.

Inventor： Katherine Han ,  Jack Stewart ,  Hai-Yue Han

IPC: H02S50/10 ,  G01R31/08 ,  G01R31/11 ,  H02S40/34

CPC classification number: H02S50/10 ,  G01R31/086 ,  G01R31/11 ,  H02S40/34

Abstract: Testing to detect intermittent electrical pathways is described. Applied currents may be reversed to fully test all components of a workpiece. Various testing methodologies may be employed. These methodologies may include Time Domain Reflectometry (TDR), mechanical agitation, dark current/voltage testing, (dark IV), i.e., electrical testing of a workpiece using applied electricity, and thermographic imaging, e.g., infra-red thermal imaging. The sensed voltage during agitation may be compared to a benchmark voltage to determine whether or not an intermittent failure exists.

公开(公告)号：US12080817B2

公开(公告)日：2024-09-03

申请号：US18221600

申请日：2023-07-13

Applicant: MAXEON SOLAR PTE. LTD.

Inventor： Gabriel Harley

IPC: H01L31/05 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0224 ,  H01L31/048

CPC classification number: H01L31/048 ,  H01L31/0201 ,  H01L31/0203 ,  H01L31/022433 ,  H01L31/0504 ,  H01L31/0516 ,  Y02E10/50

Abstract: A photovoltaic laminate is disclosed. Embodiments include placing a first encapsulant on a substantially transparent layer that includes a front side of a photovoltaic laminate. Embodiments also include placing a first solar cell on the first encapsulant. Embodiments include placing a metal foil on the first solar cell, where the metal foil uniformly contacts a back side of the first solar cell. Embodiments include forming a metal bond that couples the metal foil to the first solar cell. In some embodiments, forming the metal bond includes forming a metal contact region using a laser source, wherein the formed metal contact region electrically couples the metal foil to the first solar cell. Embodiments can also include placing a backing material on the metal foil. Embodiments can further include forming a back layer on the backing material layer and curing the substantially transparent layer, first encapsulant, first solar cell, metal foil, backing material and back layer to form a photovoltaic laminate.

公开(公告)号：US20240266455A1

公开(公告)日：2024-08-08

申请号：US18623950

申请日：2024-04-01

Applicant: Maxeon Solar Pte. Ltd.

Inventor： AKIRA TERAO

IPC: H01L31/05 ,  H01L31/0224

CPC classification number: H01L31/0504 ,  H01L31/022441 ,  Y02E10/50

Abstract: Metallization and stringing methods for back-contact solar cells, and resulting solar cells, are described. In an example, in one embodiment, a method involves aligning conductive wires over the back sides of adjacent solar cells, wherein the wires are aligned substantially parallel to P-type and N-type doped diffusion regions of the solar cells. The method involves bonding the wires to the back side of each of the solar cells over the P-type and N-type doped diffusion regions. The method further includes cutting every other one of the wires between each adjacent pair of the solar cells.