公开(公告)号：US10816322B2

公开(公告)日：2020-10-27

申请号：US16463379

申请日：2017-07-27

Applicant: SHINKAWA LTD.

Inventor： Shigeru Hayata ,  Hiromi Tomiyama

IPC: G01B11/06 ,  G06T7/00

Abstract: A bonding apparatus having an optical system, an imaging element for acquiring an image formed by the optical system as a picture, an illumination unit for illuminating an electronic component, and a control part for processing the image acquired by the imaging element, the control part illuminating the electronic component through a first inclined optical path inclined with respect to the optical axis of a first portion of the optical system facing the electronic component and acquiring a first image, illuminating the electronic component through a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis and acquiring a second image of the electronic component as a subject, and calculating an amount of variation from a reference height of the electronic component on the basis of the positional offset amount between the first image and the second image.

公开(公告)号：US20200279762A1

公开(公告)日：2020-09-03

申请号：US16650871

申请日：2018-08-28

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA ,  Tetsuya UTANO ,  Yuichiro NOGUCHI

IPC: H01L21/677 ,  H01L21/52

Abstract: The present invention is provided with: first and second bases, which are guided by a guide rail to thereby linearly move; a linear scale provided with graduations at predetermined pitches in the moving direction; and first and second encoder heads attached to the first and second bases. In the present invention, while maintaining, at a predetermined interval a, a distance between the first and second encoder heads, and moving the first and second bases along the guide rail, first and second graduation numbers, at which the first and second encoder heads are positioned, are sequentially detected from the first and second encoder heads, and the amount of movement of the first and second bases is controlled on the basis of the ratio between the predetermined interval a and the distance on the scale between the first graduation numbers and the second graduation numbers.

公开(公告)号：US20200273742A1

公开(公告)日：2020-08-27

申请号：US16622297

申请日：2018-03-07

Applicant: SHINKAWA LTD.

Inventor： Shoji WADA

IPC: H01L21/687 ,  H01L21/67

Abstract: An apparatus for manufacturing a semiconductor device includes a base portion, a bonding stage arranged on the base portion and having a placement surface for placing a substrate; and one or more connecting members which connect the base portion and the bonding stage, wherein at least one of the one or more connecting members is a connecting plate that deflects following the expansion and contraction of the bonding stage in the plane direction caused by a temperature change.

公开(公告)号：US20200132438A1

公开(公告)日：2020-04-30

申请号：US16463379

申请日：2017-07-27

Applicant: SHINKAWA LTD.

Inventor： Shigeru HAYATA ,  Hiromi TOMIYAMA

IPC: G01B11/06 ,  G06T7/00

Abstract: A bonding apparatus having an optical system, an imaging element for acquiring an image formed by the optical system as a picture, an illumination unit for illuminating an electronic component, and a control part for processing the image acquired by the imaging element, the control part illuminating the electronic component through a first inclined optical path inclined with respect to the optical axis of a first portion of the optical system facing the electronic component and acquiring a first image, illuminating the electronic component through a second inclined optical path inclined toward the opposite side from the first inclined optical path with respect to the optical axis and acquiring a second image of the electronic component as a subject, and calculating an amount of variation from a reference height of the electronic component on the basis of the positional offset amount between the first image and the second image.

公开(公告)号：US10607959B2

公开(公告)日：2020-03-31

申请号：US15238732

申请日：2016-08-17

Applicant: SHINKAWA LTD.

Inventor： Kazumasa Sasakura ,  Hiroaki Yoshino ,  Yuki Sekine

IPC: H01L23/00 ,  G01R19/00 ,  G04F10/00

Abstract: A discharge examination device for examining discharge of a wire-bonding apparatus that applies a voltage between a torch electrode and a wire to procure the discharge therebetween includes a current detection unit, a timer unit and a discharge determination unit. The current detection unit detects a discharge current flowing through the wire. The timer unit measures discharge detection time after application of the voltage before detection of the discharge current. The discharge determination unit determines whether or not the discharge is abnormal based on the discharge detection time. With this, a discharge examination device, a wire-bonding apparatus, and a discharge examination method that are capable of detecting abnormality of discharge are provided.

公开(公告)号：US10568245B2

公开(公告)日：2020-02-18

申请号：US15680207

申请日：2017-08-18

Applicant: SHINKAWA LTD.

Inventor： Kohei Seyama

IPC: H05K13/04 ,  H01L23/00 ,  H01L21/67 ,  H05K3/30

Abstract: Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage (45) divided into a heating section (452) and a non-heating section (456), the heating section being for heating a substrate (200) fixed to a front surface of the heating section, the non-heating section not heating the substrate (200) suctioned to a front surface of the non-heating section. With this, it is possible to provide an electronic-component mounting apparatus that is simple and capable of efficiently mounting a large number of electronic components.

公开(公告)号：US10566307B2

公开(公告)日：2020-02-18

申请号：US15773169

申请日：2016-11-02

Applicant: SHINKAWA LTD.

Inventor： Yuu Hasegawa ,  Naoki Sekine ,  Yoshihito Hagiwara

IPC: H01L21/00 ,  H01L23/00 ,  H01L23/66

Abstract: The disclosure includes: a first lifting step for bonding a wire at a first position (13) with a capillary and for lifting the capillary up to a first height H1 while feeding the wire; a circular arc lifting step for carrying out a circular arc motion for moving the capillary in a circular arc toward a second position (14) by a first distance (L5), and then carrying out a lifting motion for lifting the capillary while feeding the wire; a circular arc motion step for moving the capillary in a circular arc toward the first position (13) by a second distance (L3+L4); a second lifting step for lifting the capillary up to a second height H4; and a looping step for looping the capillary to the second position (14), thereby forming a wire loop having a predetermined height on a substrate by bonding the wire at the second position (14).

公开(公告)号：US20190304852A1

公开(公告)日：2019-10-03

申请号：US16337927

申请日：2017-09-26

Applicant: SHINKAWA LTD.

Inventor： Kohei SEYAMA

IPC: H01L21/66 ,  H01L21/52 ,  H01L21/67

Abstract: A method for manufacturing a semiconductor device and a mounting apparatus are provided. The method for manufacturing a semiconductor device includes: a placing step for placing, on a bonding surface, a temporary substrate which is transmissive with respect to an alignment mark; an image acquisition step for acquiring an image of the alignment mark and an image of a semiconductor die; a correction step for correcting, on the basis of the image of the alignment mark and the image of the semiconductor die acquired in the image acquisition step, the position in the horizontal direction of a bonding head that pressure bonds the semiconductor die to the temporary substrate; and a pressure bonding step for pressure bonding the semiconductor die to the transmissive substrate on the basis of the corrected position in the horizontal direction.

公开(公告)号：US10388555B2

公开(公告)日：2019-08-20

申请号：US15247947

申请日：2016-08-26

Applicant: SHINKAWA LTD.

Inventor： Osamu Kakutani ,  Taito Kobayashi ,  Yasushi Sato

IPC: H01L21/67 ,  H01L23/00 ,  H01L21/677 ,  H01L21/687

Abstract: A bonding apparatus, which includes: an intermediate stage; a transfer unit configured to transfer a semiconductor chip and to place the semiconductor chip on the intermediate stage; and a first bonding unit and a second bonding unit each configured to pick up the semiconductor chip from the intermediate stage, and to bond the semiconductor chip to a circuit substrate. The intermediate stage moves between a first position and a second position. The first position is a position at which the first bonding unit is allowed to pick up the semiconductor chip, and the second position is a position at which the second bonding unit is allowed to pick up the semiconductor chip. With this, it is possible to provide a bonding apparatus capable of reducing processing time per circuit substrate and suppressing an increase of a space, as well as such a bonding method.

公开(公告)号：US20190237428A1

公开(公告)日：2019-08-01

申请号：US16320466

申请日：2017-06-13

Applicant: SHINKAWA LTD.

Inventor： Noboru FUJINO ,  Hisashi UEDA

IPC: H01L23/00

CPC classification number: H01L24/78 ,  H01L2224/78001 ,  H01L2224/78301

Abstract: A method for calibrating a wire clamp device includes: preparing a wire clamp device provided with a pair of arm parts having tips for clamping a wire, the arms extending from the tips toward base ends, and a drive part provided with a piezoelectric element for drive, connected to the base ends of the pair of arm parts and opening/closing the tips of the pair of arm parts; a step of detecting, by electrical continuity between the tips, a timing at which the pair of arm parts enters a closed state when the piezoelectric element for drive is driven, and acquiring a reference voltage; and a step of calibrating, on the basis of the reference voltage, an application voltage to be applied to the piezoelectric element for drive. Thus, it is possible to perform accurate and stable wire bonding.