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公开(公告)号：US20150083996A1
公开(公告)日：2015-03-26
申请号：US14556273
申请日：2014-12-01
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chung Yu Wang
CPC classification number: H01L33/647 , H01L23/481 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/73 , H01L24/94 , H01L24/97 , H01L27/15 , H01L33/0025 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/32 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/83385 , H01L2224/83815 , H01L2224/83895 , H01L2224/92247 , H01L2224/94 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01023 , H01L2924/01026 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2933/0066 , H01L2924/00014 , H01L2924/0781 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
Abstract: A light-emitting device (LED) package component includes a carrier wafer. The carrier wafer includes a first through-substrate via (TSV) configured to electrically connecting features on opposite sides of the carrier wafer. A light-emitting device (LED) is bonded onto the carrier wafer. The LED are electrically connected to the first TSV. A conductive thermal interface material (TIM) is located between, and adjoining, the first TSV and the LED.
Abstract translation: 发光器件（LED）封装部件包括载体晶片。 载体晶片包括被配置为电连接载体晶片的相对侧上的特征的第一穿通基板通孔（TSV）。 发光装置（LED）被结合到载体晶片上。 LED电连接到第一TSV。 导电热界面材料（TIM）位于第一TSV和LED之间并邻接第一TSV和LED。
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公开(公告)号：US20150053918A1
公开(公告)日：2015-02-26
申请号：US14472495
申请日：2014-08-29
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Ding-Yuan Chen , Chen-Hua Yu , Wen-Chih Chiou
CPC classification number: H01L33/145 , H01L33/0066 , H01L33/04 , H01L33/06 , H01L33/30 , H01L33/36 , H01L33/62 , H01L2933/0066
Abstract: A light-emitting diode (LED) device is provided. The LED device has a lower LED layer and an upper LED layer with a light-emitting layer interposed therebetween. A current blocking layer is formed in the upper LED layer such that current passing between an electrode contacting the upper LED layer flows around the current blocking layer. When the current blocking layer is positioned between the electrode and the light-emitting layer, the light emitted by the light-emitting layer is not blocked by the electrode and the light efficiency is increased. The current blocking layer may be formed by converting a portion of the upper LED layer into a resistive region. In an embodiment, ions such as magnesium, carbon, or silicon are implanted into the upper LED layer to form the current blocking layer.
Abstract translation: 提供了一种发光二极管（LED）装置。 LED装置具有较低的LED层和位于其间的发光层的上部LED层。 在上LED层中形成电流阻挡层，使得在与上层LED层接触的电极之间的电流流过电流阻挡层。 当电流阻挡层位于电极和发光层之间时，由发光层发射的光不被电极阻挡，并且光效率增加。 可以通过将上部LED层的一部分转换成电阻区域来形成电流阻挡层。 在一个实施方案中，诸如镁，碳或硅的离子注入上层LED层以形成电流阻挡层。
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公开(公告)号：US20140363910A1
公开(公告)日：2014-12-11
申请号：US14466172
申请日：2014-08-22
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Ding-Yuan Chen , Chen-Hua Yu , Wen-Chih Chiou
IPC: H01L33/00
CPC classification number: H01L33/0062 , H01L21/78 , H01L33/0066 , H01L33/0079 , H01L2924/01078 , H01S5/1231 , H01S5/2275
Abstract: A method of fabricating an LED is provided. A doped layer is formed over a silicon substrate. A plurality of dielectric plugs is formed over the silicon substrate. A light-emitting diode (LED) structure is formed over the doped layer. The LED structure is formed between the dielectric plugs. The dielectric plugs are removed, thereby forming a plurality of openings that partially expose the doped layer. The doped layer is converted into a porous layer at least in part by performing an electro-chemical anodization process through the openings. A conductive substrate is formed over the LED structure. Thereafter, the silicon substrate is removed. The removing of the silicon substrate comprises cleaving the porous layer or chemically etching the porous layer.
Abstract translation: 提供一种制造LED的方法。 在硅衬底上形成掺杂层。 在硅衬底上形成多个电介质塞。 在掺杂层上形成发光二极管（LED）结构。 LED结构形成在电介质塞之间。 去除电介质塞，从而形成部分地暴露掺杂层的多个开口。 至少部分地通过进行通过开口的电化学阳极氧化处理将掺杂层转变成多孔层。 在LED结构上方形成导电基板。 之后，除去硅衬底。 去除硅衬底包括切割多孔层或化学蚀刻多孔层。
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公开(公告)号：US20140295592A1
公开(公告)日：2014-10-02
申请号：US14303628
申请日：2014-06-13
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Ching-Yi Chen , Hao-Yu Yang
IPC: H01L33/58 , H01L25/075 , H01L33/00
CPC classification number: H01L33/58 , H01L25/0753 , H01L33/005 , H01L33/54 , H01L2224/48091 , H01L2924/01322 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/1815 , H01L2933/005 , H01L2924/00 , H01L2924/00012
Abstract: A batwing beam is produced from an optical emitter having a primary LED lens over a number of LED dies on a package substrate. The LED lens includes a batwing surface formed by rotating a parabolic arc about an end of the parabolic arc over a center of the optical emitter. A center of each of the LED dies is mounted to the package substrate about the focus of a parabola whose arc forms the batwing surface, for example, between about 0.5 to 1.5 of a focal distance from the vertex of the parabola. The batwing surface reflects light from the number of LED dies through total internal reflection (TIR) or through a reflectivity gel coating.
Abstract translation: 蝙蝠横梁是由封装基板上的多个LED管芯上的具有主要LED透镜的光发射器产生的。 LED透镜包括通过围绕光发射器的中心的抛物线弧的端部旋转抛物线形成的蝙蝠wing表面。 每个LED管芯的中心围绕其圆弧形成蝙蝠翼表面的抛物线的焦点安装到封装基板，例如，距抛物线顶点的焦距的约0.5至1.5。 蝙蝠槌表面通过全内反射（TIR）或通过反射性凝胶涂层反射来自LED管芯数量的光。
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公开(公告)号：US20140291610A1
公开(公告)日：2014-10-02
申请号：US14305067
申请日：2014-06-16
Applicant: TSMC SOLID STATE LIGHTING LTD.
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Min Lin
CPC classification number: H01L33/504 , H01L33/46 , H01L33/505 , H01L33/508 , H01L33/54 , H01L2933/0041
Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics.
Abstract translation: 本公开涉及照明装置。 照明装置包括发光装置。 发光器件包括第一掺杂半导体层。 发光层设置在第一掺杂半导体层上。 第二掺杂半导体层设置在发光层上。 第二掺杂半导体层具有与第一掺杂半导体层不同的导电类型。 光转换层涂覆在发光器件周围。 A透镜容纳发光器件和光转换层。 透镜包括第一子层和第二子层。 第一和第二子层具有不同的特征。
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Patent Agency Ranking
公开(公告)号：US20140264410A1
公开(公告)日：2014-09-18
申请号：US13955353
申请日：2013-07-31
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chih-Chia Lin , Hsing-Kuo Hsia , Ching-Hui Chen , Jacob C. Tarn
IPC: H01L25/16
CPC classification number: H01L25/167 , H01L2224/16225 , H01L2224/48091 , H01L2224/73265 , H05K1/181 , H05K2201/10106 , H05K2201/10545 , H05K2203/1316 , H05K2203/1327 , Y02P70/611 , H01L2924/00014
Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). A carrier having a first side and a second opposite the first side is provided. The carrier includes a plurality of conductive interconnect elements. An integrated circuit (IC) die is bonded to the first side of the carrier. A packaging material having light-reflective properties is molded over the first and second sides of the carrier such that the IC die is sealed by the packaging material. A portion of the packaging material is molded into a reflective cap structure. A light-emitting diode (LED) is bonded to the second side of the carrier. Sidewalls of the reflective cap structure circumferentially surround the LED. The LED and the IC die are electrically coupled together through the conductive interconnect elements in the carrier. A lens is then formed over the LED.
Abstract translation: 本公开涉及封装发光二极管（LED）的方法。 提供具有第一侧和与第一侧相对的第二侧的载体。 载体包括多个导电互连元件。 集成电路（IC）管芯结合到载体的第一侧。 具有光反射特性的包装材料被模制在载体的第一和第二侧上，使IC芯片被包装材料密封。 包装材料的一部分被模制成反射盖结构。 发光二极管（LED）结合到载体的第二侧。 反射盖结构的侧壁周向地围绕LED。 LED和IC管芯通过载体中的导电互连元件电耦合在一起。 然后在LED上形成透镜。
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公开(公告)号：US20140264268A1
公开(公告)日：2014-09-18
申请号：US14294537
申请日：2014-06-03
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi-Xiang Tseng , Hsiao-Wen Lee , Min-Sheng Wu , Tien-Ming Lin
CPC classification number: H01L33/505 , H01L33/46 , H01L2933/0041
Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and over side surfaces of the first and second doped semiconductor layers and the light-emitting layer. The photo-conversion layer has an angular profile.
Abstract translation: 本公开涉及照明装置。 照明装置包括第一掺杂半导体层。 发光层设置在第一掺杂半导体层上。 第二掺杂半导体层设置在发光层上。 第二掺杂半导体层具有与第一掺杂半导体层不同的导电类型。 光转换层设置在第二掺杂半导体层和第一和第二掺杂半导体层和发光层的越侧表面上。 光转换层具有角度轮廓。
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公开(公告)号：US08835202B2
公开(公告)日：2014-09-16
申请号：US14140906
申请日：2013-12-26
Applicant: TSMC Solid State Lighting Ltd.
Inventor： Chi Xiang Tseng , Hsiao-Wen Lee , Tien-Ming Lin , Min-Sheng Wu
CPC classification number: H01L33/505 , H01L27/153 , H01L33/504 , H01L33/508 , H01L2933/0041
Abstract: The present disclosure provides a light emitting diode (LED) apparatus. The LED apparatus includes an LED emitter having a top surface; and a phosphor feature disposed on the LED emitter. The phosphor feature includes a first phosphor film disposed on the top surface of the LED emitter and having a first dimension defined in a direction parallel to the top surface of the LED emitter; a second phosphor film disposed on the first phosphor film and having a second dimension defined in the direction; and the second dimension is substantially less than the first dimension.
Abstract translation: 本公开提供了一种发光二极管（LED）装置。 LED装置包括具有顶表面的LED发射器; 以及设置在LED发射器上的荧光体特征。 荧光体特征包括设置在LED发射器的顶表面上并具有在平行于LED发射器的顶表面的方向上限定的第一尺寸的第一荧光膜; 第二荧光体膜，设置在所述第一荧光膜上并具有沿所述方向限定的第二尺寸; 并且第二尺寸基本上小于第一尺寸。
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公开(公告)号：US20140252380A1
公开(公告)日：2014-09-11
申请号：US13792136
申请日：2013-03-10
Applicant: TSMC SOLID STATE LIGHTING LTD.
Inventor： Ming-Shing Lee , Chyi-Shyuan Chern , Hsin-Hsien Wu , Yung-Chang Chen , Ming-Hua Lo , Chu-Ching Tsai
IPC: H01L33/08
CPC classification number: H01L33/08 , C23C4/01 , H01L21/00 , H01L21/68721 , H01L2933/0041
Abstract: A shadow mask assembly includes a securing assembly configured to hold a substrate that is configured to hold a plurality of dies. The securing assembly includes a number of guide pins and a shadow mask comprising holes for the guide pins, said holes allowing the guide pins freedom of motion in one direction. The securing assembly includes a number of embedded magnets configured to secure the shadow mask to the securing assembly.
Abstract translation: 荫罩组件包括固定组件，其被配置为保持构造成保持多个模具的衬底。 固定组件包括多个引导销和一个包括用于引导销的孔的荫罩，所述孔允许导销在一个方向上自由运动。 固定组件包括多个嵌入式磁体，其构造成将荫罩固定到固定组件。
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公开(公告)号：US20140239323A1
公开(公告)日：2014-08-28
申请号：US14272626
申请日：2014-05-08
Applicant: TSMC SOLID STATE LIGHTING LTD.
Inventor： Chyi Shyuan Chern , Hsin-Hsien wu , Chih-Kuang Yu , Hung-Yi Kuo
IPC: H01L33/62
CPC classification number: H01L33/62 , H01L23/49513 , H01L25/0753 , H01L33/0095 , H01L33/08 , H01L2924/0002 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A plurality of conductive pads are disposed on a substrate. A plurality of semiconductor dies are each disposed on a respective one of the conductive pads. A mold device is positioned over the substrate. The mold device contains a plurality of recesses that are each configured to accommodate a respective one of the semiconductor dies underneath.
Abstract translation: 多个导电焊盘设置在基板上。 多个半导体管芯各自设置在相应的一个导电焊盘上。 模具装置位于衬底上。 模具装置包括多个凹槽，每个凹槽被配置为容纳下面的半导体模具中的相应的一个。
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