公开(公告)号：US20140076697A1

公开(公告)日：2014-03-20

申请号：US13614936

申请日：2012-09-13

Applicant: Arun K. Gupta ,  William C. McDonald

Inventor： Arun K. Gupta ,  William C. McDonald

IPC: B81B3/00

CPC classification number: H02N2/12 ,  B81B3/0008 ,  B81B3/001 ,  B81B3/0013 ,  B81B7/02 ,  B81B2201/016 ,  B81B2201/0221 ,  B81B2203/0109 ,  B81B2203/0181 ,  B81B2203/053 ,  B81B2203/058 ,  B81B2203/06

Abstract: A MEMS electrostatic actuator includes a bottom plate affixed to a substrate and a top plate suspended above the bottom plate. The top plate has a parallel plate center section and two rotating members electrically connected to the center section. Each rotating member is attached centrally of the rotating member for rotation about an axis of rotation to a set of anchor posts. The attachment includes at least one pair of torsional springs attached along each axis, each spring comprising a rectangular metal square that twists as the rotational members rotate. Electrostatic pull-down electrodes are underneath each rotational member.

Abstract translation: MEMS静电致动器包括固定到基板的底板和悬挂在底板上方的顶板。 顶板具有平行板中心部分和两个电连接到中心部分的旋转部件。 每个旋转构件安装在旋转构件的中心，用于围绕旋转轴线旋转到一组锚柱。 附件包括沿着每个轴线附接的至少一对扭转弹簧，每个弹簧包括矩形金属正方形，随着旋转构件的旋转，该正方形扭曲。 静电下拉电极位于每个旋转构件的下方。

公开(公告)号：US20130032385A1

公开(公告)日：2013-02-07

申请号：US13197162

申请日：2011-08-03

Applicant: Peng Cheng Lin ,  Mario Francisco Velez

Inventor： Peng Cheng Lin ,  Mario Francisco Velez

IPC: H05K1/18 ,  H05K3/30

CPC classification number: B81B7/0058 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/095 ,  B81C2203/0136 ,  B81C2203/0163 ,  G01P1/023 ,  H01G5/16 ,  H01L23/315 ,  H01L23/552 ,  H01L2924/0002 ,  Y10T29/49146 ,  H01L2924/00

Abstract: This disclosure provides systems and methods for forming a metal thin film shield over a thin film cap to protect electromechanical systems devices in a cavity beneath. In one aspect, a dual or multi layer thin film structure is used to seal a electromechanical device. For example, a metal thin film shield can be mated over an oxide thin film cap to encapsulate the electromechanical device and prevent degradation due to wafer thinning, dicing and package assembly induced stresses, thereby strengthening the survivability of the electromechanical device in the encapsulated cavity. During redistribution layer processing, a metal thin film shield, such as a copper layer, is formed over the wafer surface, patterned and metalized.

Abstract translation: 本公开提供了用于在薄膜盖上形成金属薄膜屏蔽以保护下面空腔中的机电系统装置的系统和方法。 在一个方面，使用双层或多层薄膜结构来密封机电装置。 例如，金属薄膜屏蔽可以配合在氧化物薄膜帽上以封装机电装置，并防止由于晶片变薄，切割和封装组件引起的应力引起的劣化，从而增强机电装置在封装空腔中的生存性。 在再分配层处理期间，在晶片表面上形成诸如铜层的金属薄膜屏蔽，被图案化和金属化。

公开(公告)号：US20110241135A1

公开(公告)日：2011-10-06

申请号：US13050083

申请日：2011-03-17

Applicant: Yoshihiko Kurui ,  Yoshiaki Shimooka ,  Hiroaki Yamazaki ,  Akihiro Kojima

Inventor： Yoshihiko Kurui ,  Yoshiaki Shimooka ,  Hiroaki Yamazaki ,  Akihiro Kojima

IPC: H01L29/84

CPC classification number: B81B3/0086 ,  B81B2201/0221

Abstract: According to an embodiment of the present invention, a MEMS element includes: a semiconductor substrate; an island insulating layer formed on the substrate, the insulating layer including an air gap layer having an air gap group, the air gap group including a plurality of air gaps disposed in an in-plane direction; and a MEMS capacitor formed above the air gap group on the insulating layer.

Abstract translation: 根据本发明的实施例，MEMS元件包括：半导体衬底; 形成在所述基板上的岛绝缘层，所述绝缘层包括具有气隙组的气隙层，所述气隙组包括沿面内方向设置的多个气隙; 以及形成在绝缘层上的气隙组上方的MEMS电容器。

公开(公告)号：US20110221300A1

公开(公告)日：2011-09-15

申请号：US13018696

申请日：2011-02-01

Applicant: Takeaki SHIMANOUCHI ,  Masahiko Imai ,  Takashi Katsuki ,  Osamu Toyoda ,  Satoshi Ueda

Inventor： Takeaki SHIMANOUCHI ,  Masahiko Imai ,  Takashi Katsuki ,  Osamu Toyoda ,  Satoshi Ueda

IPC: H02N1/08

CPC classification number: B81C1/00698 ,  B81B2201/0221 ,  H01G5/18

Abstract: A driving method for driving an electrostatic actuator including a fixed electrode and a movable electrode opposing each other with a dielectric layer interposed therebetween, includes applying a first voltage, between the fixed electrode and the movable electrode, to bring the movable electrode into contact with the dielectric layer, and applying a second voltage, between the fixed electrode and the movable electrode, after application of the first voltage is stopped and before the movable electrode moves away from the dielectric layer. Here, the second voltage has a polarity opposite to a polarity of the first voltage and an absolute value smaller than an absolute value of the first voltage.

Abstract translation: 一种用于驱动静电致动器的驱动方法，所述静电致动器包括固定电极和可动电极，所述固定电极和可动电极之间具有介电层彼此相对，包括在所述固定电极和所述可动电极之间施加第一电压以使所述可动电极与所述可动电极接触 并且在施加第一电压之后并且在可移动电极远离电介质层之前，在固定电极和可动电极之间施加第二电压。 这里，第二电压具有与第一电压的极性相反的极性和小于第一电压的绝对值的绝对值。

公开(公告)号：US20110115039A1

公开(公告)日：2011-05-19

申请号：US12621526

申请日：2009-11-19

Applicant: Chien-Hsin Huang ,  Bang-Chiang Lan ,  Ming-I Wang ,  Hui-Min Wu ,  Tzung-I Su ,  Chao-An Su ,  Tzung-Han Tan ,  Min Chen ,  Meng-Jia Lin

Inventor： Chien-Hsin Huang ,  Bang-Chiang Lan ,  Ming-I Wang ,  Hui-Min Wu ,  Tzung-I Su ,  Chao-An Su ,  Tzung-Han Tan ,  Min Chen ,  Meng-Jia Lin

IPC: H01L29/84 ,  H01L21/02

CPC classification number: H04R19/005 ,  B81B3/0072 ,  B81B2201/0221 ,  B81B2201/0257 ,  B81B2203/0127 ,  H01L29/84

Abstract: A micro electro mechanical system (MEMS) structure is disclosed. The MEMS structure includes a backplate electrode and a 3D diaphragm electrode. The 3D diaphragm electrode has a composite structure so that a dielectric is disposed between two metal layers. The 3D diaphragm electrode is adjacent to the backplate electrode to form a variable capacitor together.

Abstract translation: 公开了一种微机电系统（MEMS）结构。 MEMS结构包括背板电极和3D隔膜电极。 3D隔膜电极具有复合结构，使得电介质设置在两个金属层之间。 3D隔膜电极与背板电极相邻，以形成可变电容器。

公开(公告)号：US20100288047A1

公开(公告)日：2010-11-18

申请号：US12778498

申请日：2010-05-12

Applicant: Shigekazu TAKAGI

Inventor： Shigekazu TAKAGI

IPC: G01P15/125

CPC classification number: G01P15/125 ,  B81B2201/0221 ,  B81B2207/015 ,  B81C1/00246 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/082

Abstract: A MEMS sensor includes: a supporting portion; a movable weight portion; a connecting portion that couples the supporting portion with the movable weight portion and is elastically deformable; a first fixed electrode portion protruding from the supporting portion; and a first movable electrode portion protruding from the movable weight portion and disposed so as to face the first fixed electrode portion, wherein the movable weight portion is formed by stacking a conductive layer and an insulating layer in a first direction, plugs having a larger specific gravity than the insulating layer are embedded in the insulating layer, the conductive layer is connected to the first movable electrode portion, and one of the first fixed electrode portion and the first movable electrode portion has a first electrode portion and a second electrode portion in the first direction.

Abstract translation: MEMS传感器包括：支撑部分; 移动重物部分; 连接部，其将所述支撑部与所述可动重物部分联接并且可弹性变形; 从所述支撑部突出的第一固定电极部; 以及第一可移动电极部分，其从所述可动配重部分突出并且设置成面对所述第一固定电极部分，其中所述可动配重部分通过沿第一方向层叠导电层和绝缘层而形成， 导电层与第一可动电极部连接，第一固定电极部和第一可动电极部中的一方具有第一电极部和第二电极部， 第一个方向

公开(公告)号：US20100240215A1

公开(公告)日：2010-09-23

申请号：US12686878

申请日：2010-01-13

Applicant: Yao-Te Huang ,  Chia-Hua Chu ,  Yu-Nu Hsu ,  Chun-Wen Cheng ,  Li-Chung Peng

Inventor： Yao-Te Huang ,  Chia-Hua Chu ,  Yu-Nu Hsu ,  Chun-Wen Cheng ,  Li-Chung Peng

IPC: H01L21/28 ,  B05D1/32 ,  B05D5/12 ,  B05D3/14 ,  H01G9/00

CPC classification number: H01G7/06 ,  B81B2201/0221 ,  B81C1/0015 ,  B81C2201/0109 ,  H01G7/00 ,  H01L28/60

Abstract: MEMS devices and methods for utilizing sacrificial layers are provided. An embodiment comprises forming a first sacrificial layer and a second sacrificial layer over a substrate, wherein the second sacrificial layer acts as an adhesion layer. Once formed, the first sacrificial layer and the second sacrificial layer are patterned such that the second sacrificial layer is undercut to form a step between the first sacrificial layer and the second sacrificial layer. A top capacitor electrode is formed over the second sacrificial layer, and the first sacrificial layer and the second sacrificial layer are removed in order to free the top capacitor electrode.

Abstract translation: 提供了用于利用牺牲层的MEMS器件和方法。 一个实施例包括在衬底上形成第一牺牲层和第二牺牲层，其中第二牺牲层用作粘附层。 一旦形成，第一牺牲层和第二牺牲层被图案化，使得第二牺牲层被底切以在第一牺牲层和第二牺牲层之间形成台阶。 在第二牺牲层上形成顶部电容器电极，并且去除第一牺牲层和第二牺牲层以便释放顶部电容器电极。

公开(公告)号：US20190002276A1

公开(公告)日：2019-01-03

申请号：US15405558

申请日：2017-01-13

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Risto MUTIKAINEN ,  Juha LAHDENPERÄ

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0022 ,  B81B3/0051 ,  B81B2201/0221 ,  B81B2201/025 ,  B81C1/0038 ,  B81C1/00531 ,  B81C1/00674

Abstract: A sensor device and a method for manufacturing the sensor device. The sensor device is equipped with an impact element that includes an inner part of dielectric bulk material and an outer part of diamond-like coating material. The inner part is made to be lower at the edges than in the middle, and the outer part is formed of a diamond-like coating layer that covers the inner part. The DLC coated impact element is mechanically more robust than the rectangular prior art structures. Furthermore, the tapered form of the impact element improves conductivity of the DLC coating such that discharge of static buildup in the impact element is effectively enabled.

公开(公告)号：US10062517B2

公开(公告)日：2018-08-28

申请号：US15374719

申请日：2016-12-09

Applicant: wiSpry, Inc.

Inventor： Arthur S. Morris, III ,  Dana DeReus ,  Norito Baytan

IPC: H01G5/16 ,  B81C1/00 ,  B81B3/00 ,  H01G7/00 ,  H01G5/18

CPC classification number: H01G5/16 ,  B81B3/0008 ,  B81B3/0016 ,  B81B3/0051 ,  B81B2201/0221 ,  B81C1/00166 ,  B81C1/00476 ,  B81C2201/0109 ,  B81C2201/013 ,  H01G5/18 ,  H01G7/00

Abstract: Systems, devices, and methods for micro-electro-mechanical system (MEMS) tunable capacitors can include a fixed actuation electrode attached to a substrate, a fixed capacitive electrode attached to the substrate, and a movable component positioned above the substrate and movable with respect to the fixed actuation electrode and the fixed capacitive electrode. The movable component can include a movable actuation electrode positioned above the fixed actuation electrode and a movable capacitive electrode positioned above the fixed capacitive electrode. At least a portion of the movable capacitive electrode can be spaced apart from the fixed capacitive electrode by a first gap, and the movable actuation electrode can be spaced apart from the fixed actuation electrode by a second gap that is larger than the first gap.

公开(公告)号：US09948212B2

公开(公告)日：2018-04-17

申请号：US14889118

申请日：2014-05-16

Applicant: CAVENDISH KINETICS, INC.

Inventor： Cong Quoc Khieu ,  James Douglas Huffman ,  Richard L. Knipe ,  Vikram Joshi ,  Robertus Petrus Van Kampen

IPC: H02N1/00 ,  B81B7/00 ,  H01G5/18 ,  H01H59/00 ,  B81B7/02 ,  H01G5/011

CPC classification number: H02N1/006 ,  B81B7/008 ,  B81B7/02 ,  B81B2201/0221 ,  H01G5/011 ,  H01G5/18 ,  H01H59/0009 ,  H03J2200/39

Abstract: The present invention generally relates to a method of operating a MEMS DVC while minimizing impact of the MEMS device on contact surfaces. By reducing the drive voltage upon the pull-in movement of the MEMS device, the acceleration of the MEMS device towards the contact surface is reduced and thus, the impact velocity is reduced and less damage of the MEMS DVC device occurs.