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    Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
    81.
    发明授权
    Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures 有权
    在结构的电化学制造期间保持层的平行度和/或实现所需厚度的层的方法和装置

    公开(公告)号：US07588674B2

    公开(公告)日：2009-09-15

    申请号：US11028944

    申请日：2005-01-03

    Applicant: Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

    Inventor： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

    IPC: C25D5/52

    CPC classification number: C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

    Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

    Abstract translation: 本发明的一些实施例提供了用于电化学制造多层结构（例如中尺度或微结构）的方法和装置，其具有改进的端点检测和用于在电化学制造过程中被平坦化的材料（例如层）的并行维护。 一些方法涉及在平坦化期间使用夹具，其确保材料的平面化平面平行于给定公差内的其它沉积平面。 一些方法涉及使用端点检测夹具，其相对于第一沉积层或相对于在制造过程期间形成的一些其它层，相对于衬底的初始表面确保沉积材料的精确高度。 在一些实施例中，平面化可以通过研磨发生，而其他实施例可以使用金刚石切片机。

    Method for Electrochemical Fabrication
    82.
    发明申请
    Method for Electrochemical Fabrication 审中-公开
    电化学加工方法

    公开(公告)号：US20080179279A1

    公开(公告)日：2008-07-31

    申请号：US11927361

    申请日：2007-10-29

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: B32B38/00 ,  C25F3/16

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Multilayer MEMS device and method of making same
    84.
    发明授权
    Multilayer MEMS device and method of making same 失效
    多层MEMS器件及其制造方法

    公开(公告)号：US07368228B2

    公开(公告)日：2008-05-06

    申请号：US10742276

    申请日：2003-12-19

    Applicant: Michael C. Weisberg

    Inventor： Michael C. Weisberg

    IPC: G03F7/00

    CPC classification number: G03F7/00 ,  B33Y10/00 ,  B81C1/00492 ,  B81C2201/0159 ,  B81C2201/0197 ,  G03F7/0035

    Abstract: A method of creating a microelectromechanical systems (MEMS) device includes applying a layer of photoresist to a lower layer to create a multilayer MEMS device. The method includes transferring the layer of photoresist to the lower layer. The method can also include spincoating the photoresist onto a release layer, softbaking the spincoated photoresist to at least partially dry it, transferring the photoresist to form a layer of the multilayer MEMS device, and exposing the photoresist to light to crosslink it. The multilayer MEMS device includes a plurality of layers of photoresist.

    Abstract translation: 创建微机电系统（MEMS）装置的方法包括将光致抗蚀剂层施加到下层以产生多层MEMS器件。 该方法包括将光致抗蚀剂层转移到下层。 该方法还可以包括将光致抗蚀剂旋涂到剥离层上，将旋涂的光致抗蚀剂软化至少部分地干燥，转移光致抗蚀剂以形成多层MEMS器件的层，并将光致抗蚀剂曝光以使其交联。 多层MEMS器件包括多层光致抗蚀剂。

    Method for electrochemical fabrication
    85.
    发明授权
    Method for electrochemical fabrication 有权
    电化学制造方法

    公开(公告)号：US07351321B2

    公开(公告)日：2008-04-01

    申请号：US10677548

    申请日：2003-10-01

    Applicant: Adam L. Cohen

    Inventor： Adam L. Cohen

    IPC: C25D5/02 ,  C25D5/48 ,  C25D5/52

    CPC classification number: C25D5/10 ,  B33Y10/00 ,  B33Y70/00 ,  B81C1/00126 ,  B81C2201/0181 ,  B81C2201/0197 ,  B81C2201/032 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/12 ,  C25D5/22 ,  C25D17/06 ,  H01L21/2885 ,  H05K3/241 ,  Y10T428/12486 ,  Y10T428/239

    Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

    Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。

    Process for forming microstructures
    86.
    发明授权
    Process for forming microstructures 有权
    微结构形成工艺

    公开(公告)号：US07271022B2

    公开(公告)日：2007-09-18

    申请号：US11102982

    申请日：2005-04-11

    Applicant: Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Hak Tea ,  Melvin B Khoo ,  Raffi Garabedian ,  Lakshimikanth Namburi

    Inventor： Weilong Tang ,  Tseng-Yang Hsu ,  Salleh Ismail ,  Nim Hak Tea ,  Melvin B Khoo ,  Raffi Garabedian ,  Lakshimikanth Namburi

    IPC: H01L21/00 ,  H01L21/4763

    CPC classification number: B81C1/00436 ,  B81C1/00666 ,  B81C2201/0107 ,  B81C2201/0197

    Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

    Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

    Process for forming MEMS
    87.
    发明授权
    Process for forming MEMS 有权
    MEMS成型工艺

    公开(公告)号：US07264984B2

    公开(公告)日：2007-09-04

    申请号：US11019912

    申请日：2004-12-21

    Applicant: Raffi Garabedian ,  Salleh Ismail ,  Nim Hak Tea ,  Tseng-Yang Hsu ,  Melvin B Khoo ,  Weilong Tang

    Inventor： Raffi Garabedian ,  Salleh Ismail ,  Nim Hak Tea ,  Tseng-Yang Hsu ,  Melvin B Khoo ,  Weilong Tang

    IPC: H01L21/44 ,  H01L21/302

    CPC classification number: B81C1/00666 ,  B81C2201/0109 ,  B81C2201/0197

    Abstract: The present invention relates to a process for forming microstructures on a substrate. A plating surface is applied to a substrate. A first layer of photoresist is applied on top of the plating base. The first layer of photoresist is exposed to radiation in a pattern to render the first layer of photoresist dissolvable in a first pattern. The dissolvable photoresist is removed and a first layer of primary metal is electroplated in the area where the first layer of photoresist was removed. The remainder of the photoresist is then removed and a second layer of photoresist is then applied over the plating base and first layer of primary metal. The second layer of photoresist is then exposed to a second pattern of radiation to render the photoresist dissolvable and the dissolvable photoresist is removed. The second pattern is an area that surrounds the primary structure, but it does not entail the entire substrate. Rather it is an island surrounding the primary metal. The exposed surface of the secondary metal is then machined down to a desired height of the primary metal. The secondary metal is then etched away.

    Abstract translation: 本发明涉及一种在基板上形成微观结构的方法。 将电镀表面施加到基板。 将第一层光致抗蚀剂施加在电镀基底上。 第一层光致抗蚀剂以图案暴露于辐射，以使第一层光致抗蚀剂以第一图案溶解。 去除可溶解的光致抗蚀剂，并且在去除第一层光致抗蚀剂的区域中电镀第一层初级金属。 然后除去光致抗蚀剂的其余部分，然后将第二层光致抗蚀剂涂覆在镀覆基底和第一层金属的第一层上。 然后将第二层光致抗蚀剂暴露于第二辐射图案，以使光致抗蚀剂可溶解并除去可溶解的光致抗蚀剂。 第二图案是围绕一次结构的区域，但不包含整个基板。 相反，它是一个围绕着主要金属的岛屿。 然后将次级金属的暴露表面加工到初级金属的期望高度。 然后将二次金属蚀刻掉。

    Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns
    88.
    发明申请
    Methods of and Apparatus for Molding Structures Using Sacrificial Metal Patterns 审中-公开
    使用牺牲金属图案模制结构的方法和设备

    公开(公告)号：US20070199822A1

    公开(公告)日：2007-08-30

    申请号：US11621429

    申请日：2007-01-09

    Applicant: Christopher Bang

    Inventor： Christopher Bang

    IPC: C25D1/00

    CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

    Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

    Abstract translation: 提供了模制结构，制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其他模具部件组合，并将模塑材料注入模具中并硬化。 层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

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