公开(公告)号：US5483060A

公开(公告)日：1996-01-09

申请号：US107319

申请日：1993-08-17

Applicant: Wataru Sugiura ,  Katsuteru Miwa

Inventor： Wataru Sugiura ,  Katsuteru Miwa

IPC: B60H1/00 ,  G01B11/26 ,  G01J1/02 ,  G01J1/04 ,  G01J1/42 ,  G01S3/786 ,  G01W1/12

CPC classification number: G01S3/7861 ,  G01J1/04 ,  G01J1/0437 ,  G01J1/4228 ,  G01J1/0209 ,  G01J2001/4266

Abstract: In an optical position sensor capable of detecting a direction of incidence of light and intensity, this invention contemplates to make the sensor compact by reducing the number of pixels constituting light reception sensors and reducing the light reception area. To accomplish this object, a detection element portion 10 comprises a glass substrate 22, a light shading film 24 formed on a surface of the glass substrate 22 and having mutually criss-crossing slits 24a, 24b and a light reception portion 26 fixed to the back of the glass substrate 22. Unidimensional photo-diode arrays 26X, 26Y for receiving the slit beams passing through the slits 24a, 24b respectively, and a signal processing circuit 28 for scanning the photo-diode arrays 26X, 26Y and taking out light reception signals are disposed in the light reception portion 26.

Abstract translation: 在能够检测光的入射方向和强度的光学位置传感器中，本发明考虑通过减少构成光接收传感器的像素的数量并减少光接收面积来使传感器紧凑化。 为了实现该目的，检测元件部分10包括玻璃基板22，形成在玻璃基板22的表面上并具有相互交叉的狭缝24a，24b和固定到背面的光接收部分26的遮光膜24 分别用于接收通过狭缝24a，24b的狭缝光束的一维光电二极管阵列26X，26Y和用于扫描光电二极管阵列26X，26Y并取出光接收信号的信号处理电路28 设置在光接收部26中。

公开(公告)号：US3819940A

公开(公告)日：1974-06-25

申请号：US36772173

申请日：1973-06-07

Applicant: HAWKER SIDDELEY DYNAMICS LTD

Inventor： LAWS A

IPC: G01J1/04 ,  G01J1/42 ,  G01S3/781 ,  G02B6/06 ,  G02B6/08 ,  G02B27/00 ,  G02B5/14

CPC classification number: G02B6/08 ,  G01J1/0209 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0425 ,  G01J1/4228 ,  G01S3/781 ,  G02B6/06

Abstract: An optical instrument wherein an optical signal is projected on to a sensor array or sensitive medium and angular deflections of the path of the optical signal about an instrument signal source as centre appear as displacements from a datum lying in the general plane of the sensor array or sensitive medium, the instrument having an optical axis passing through said source and normal to said plane, characterized in that, to correct for the tangent law error that would otherwise arise, a correcting optical device is interposed in the signal path and has its surface receiving the signal curved, in the concave sense, about a centre lying on or intersecting the optical axis of the instrument, the curvature being of radius R, where R is greater than the distance t from said instrument signal source to the point in said curved surface that lies on said optical axis, the surface of the correcting optical device facing the sensor array being plane.

公开(公告)号：US3711722A

公开(公告)日：1973-01-16

申请号：US3711722D

申请日：1958-07-28

Applicant: AMERICAN OPTICAL CORP

Inventor： KAVANAGH A

IPC: G01J1/04 ,  G01J1/06 ,  G02B3/06 ,  H01L31/00 ,  H01J3/14

CPC classification number: G01J1/06 ,  G01J1/0209 ,  G01J1/04 ,  G01J1/0411 ,  G01J1/0422 ,  G02B3/06 ,  G02B19/0014 ,  G02B19/0076 ,  H01L31/00

Abstract: 1. A light-collecting and detecting system comprising a lens having an annularly shaped toric refracting surface formed thereon in concentric relation to a central axis of said system, and in predetermined spaced relation to a preselected focal point on said axis, said lens having a second surface thereon transversely intersecting said axis substantially at said focal point, a layer of photosensitive material of relatively small size carried by said second surface adjacent said focal point, said annular refracting surface being, in all radial sections thereof, so disposed in offset relation to said axis and so spaced relative to said focal point and so convexly elliptically curved as to face outwardly in predetermined angular relation to said optical axis and simultaneously direct and concentrate substantially all of the light being received from corresponding parts of a conically shaped hollow annular object field of predetermined mean angular value and width onto said layer, whereby any material change in intensity in the light being received from any part of said annular object field will be detected by said photosensitive layer.

Abstract translation: 1.一种集光和检测系统，包括透镜，所述透镜具有形成在其上的环形复曲面折射表面，所述折射表面与所述系统的中心轴线同心，并且以与所述轴线上的预选焦点成预定间隔的关系，所述透镜具有 基本上在所述焦点处横向与所述轴线相交的第二表面，与所述焦点相邻的由所述第二表面承载的相对较小尺寸的感光材料层，所述环形折射表面在其所有径向部分中以与 所述轴线相对于所述焦点间隔开，并且如此凸出地椭圆形地弯曲成面向与所述光轴成预定角度关系的外侧，并且同时引导并集中从锥形中空环形物体场的相应部分接收的所有光 的预定平均角度值和宽度 由所述感光层检测出从所述环形物场的任何部分接收的光中的强度变化。

公开(公告)号：US3119086A

公开(公告)日：1964-01-21

申请号：US13461961

申请日：1961-08-29

Applicant: BARNES ENG CO

Inventor： DREYFUS MARC G

IPC: G01J5/02 ,  G01J5/20 ,  H01C7/04

CPC classification number: G01J1/02 ,  G01J1/0209 ,  G01J1/04 ,  G01J1/0422 ,  G01J1/0477 ,  G01J5/04 ,  G01J5/046 ,  G01J5/08 ,  G01J5/0803 ,  G01J5/0815 ,  G01J5/0884 ,  G01J5/20 ,  H01C7/04

公开(公告)号：US20240175745A1

公开(公告)日：2024-05-30

申请号：US18434706

申请日：2024-02-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Ying-Chung CHEN

IPC: G01J1/02

CPC classification number: G01J1/0209 ,  G01J1/0214

Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

公开(公告)号：US20180231414A1

公开(公告)日：2018-08-16

申请号：US15895477

申请日：2018-02-13

Applicant: ABLIC Inc. ,  Tohoku Techno Arch Co., Ltd.

Inventor： Koji TSUKAGOSHI ,  Shigetoshi SUGAWA ,  Rihito KURODA

IPC: G01J1/42 ,  H05K1/03 ,  H05K1/02 ,  G01J1/04

CPC classification number: G01J1/429 ,  G01J1/0209 ,  G01J1/0403 ,  G01J1/0488 ,  G01J1/4228 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/10151

Abstract: This optical sensor device includes a first light receiving portion having sensitivity to ultraviolet light, a first sealing portion covering the first light receiving portion, a second light receiving portion having sensitivity to ultraviolet light, and a second sealing portion which covers the second light receiving portion. At least one of the first sealing portion and the second sealing portion is configured to transmit at least part of a ultraviolet light wavelength band, the first sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a first wavelength is set as a lower limit value of a transmission wavelength band, and the second sealing portion is formed from one or more resin layers and has transmission spectral characteristics that a second wavelength different from the first wavelength is set as a lower limit value of the transmission wavelength band.

公开(公告)号：US20180136419A1

公开(公告)日：2018-05-17

申请号：US15869226

申请日：2018-01-12

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Young Tak HAN ,  Sang Ho PARK ,  Yong Soon BAEK ,  Jang Uk SHIN ,  Yong Hwan KWON ,  Jong Hoi KIM

IPC: G02B6/42 ,  H04B10/60 ,  G01J1/02 ,  G02B6/12 ,  G01J3/02 ,  G01J1/44

CPC classification number: G02B6/4224 ,  G01J1/0209 ,  G01J1/44 ,  G01J3/0259 ,  G01J2001/444 ,  G02B6/12019 ,  G02B6/4239 ,  G02B6/4257 ,  G02B6/4279 ,  G02B6/4281 ,  H04B10/60

Abstract: Provided herein are a multi-channel receiver optical sub-assembly and a manufacturing method thereof. The multi-channel receiver optical sub-assembly includes a PLC chip having a first side into which an optical signal is received and a second side from which the received signal is outputted, with an inclined surface formed on the second side of the PLC chip at a preset angle, a PD carrier bonded onto the PLC chip and made of a glass material, and an SI-PD bonded onto the PD carrier, a lens being integrated therein. The PLC chip, the PD carrier, and the SI-PD are passively aligned by at least one alignment mark and then are bonded.

公开(公告)号：US09952089B2

公开(公告)日：2018-04-24

申请号：US14536210

申请日：2014-11-07

Applicant: Lingsen Precision Industries, Ltd.

Inventor： Ming-Te Tu ,  Yu-Chang Huang

IPC: H01J40/14 ,  G01J1/02 ,  G01J1/42 ,  G01S17/02 ,  G01S7/481

CPC classification number: G01J1/0271 ,  G01J1/0209 ,  G01J1/0233 ,  G01J1/42 ,  G01S7/4813 ,  G01S7/4815 ,  G01S17/026

Abstract: An optical sensing module includes a substrate, a cover, a plurality of light-emitting chips, a light-receiving chip, and a plurality of encapsulants. The cover is disposed on the substrate. A plurality of first chambers and a second chamber are formed between the cover and the substrate. The cover has a plurality of light-emitting holes communicating with the first chambers, respectively, and a light-receiving hole communicating with the second chamber. The light-emitting chips are disposed on the substrate and in the first chambers, respectively. The light-receiving chip is disposed on the substrate and in the second chamber. The encapsulants fill the first and second chambers and enclose the light-emitting chips and the light-receiving chip, respectively. Hence, characterized in that: the light-emitting chips and the light-receiving chip are disposed on the substrate, and the light-emitting chips emit light beams in different colors to enhance light emission efficiency.

公开(公告)号：US20180066981A1

公开(公告)日：2018-03-08

申请号：US15808051

申请日：2017-11-09

Applicant: ROHM CO., LTD.

Inventor： Toshikazu MUKAI ,  Jae-young KIM ,  Kazuisao TSURUDA

IPC: G01J1/02 ,  G01J1/06 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/0304 ,  H01L31/109 ,  H01L31/167

CPC classification number: G01J1/0271 ,  G01J1/0209 ,  G01J1/06 ,  G01J5/045 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/03046 ,  H01L31/109 ,  H01L31/167 ,  H03B7/08 ,  H03B2200/0084

Abstract: The THz device module includes: a substrate; a THz device disposed on a front side surface of the substrate, and configured to oscillate or detect THz waves; a cap covering the THz device being separated from the THz device, and comprising an opening formed at a position opposite to the THz device in a vertical direction of the front side surface of the substrate; and a sealing member covering the opening of the cap so as to seal the THz device in conjunction with the substrate and the cap. A distance from the THz device to the sealing member is within a near-field pattern to which an electric field of the THz waves can be reached without interruption from a surface of the THz device to the sealing member. The THz device module efficiently emits or detects THz waves from the opening, thereby suppressing upsizing of the cap.

公开(公告)号：US09911877B2

公开(公告)日：2018-03-06

申请号：US15347664

申请日：2016-11-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Chia Yun Hsu ,  Tsung-Yu Lin

IPC: H01L31/0232 ,  F21V8/00 ,  G01J1/02 ,  G01J1/04 ,  H01L31/12 ,  H01L31/0203 ,  H01L31/18

CPC classification number: H01L31/02327 ,  G01J1/0209 ,  G01J1/0425 ,  G02B6/0028 ,  G06K9/00046 ,  H01L31/0203 ,  H01L31/125 ,  H01L31/173 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. The second light guide structure is disposed over the light receiver and coupled to the first light guide structure. The light receiver and the second light guide structure defines a cavity between the light receiver and the second light guide structure.