公开(公告)号：US20100330338A1

公开(公告)日：2010-12-30

申请号：US12822609

申请日：2010-06-24

Applicant: Mary C. Boyce ,  Simona Socrate ,  Christopher M. Boyce ,  Brian P. Greviskes

Inventor： Mary C. Boyce ,  Simona Socrate ,  Christopher M. Boyce ,  Brian P. Greviskes

IPC: B32B3/00 ,  B29C71/00

CPC classification number: B29C59/02 ,  B29C59/16 ,  B29C2791/009 ,  B29C2793/00 ,  B32B3/266 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/046 ,  H05K2201/09063 ,  Y10T428/24314 ,  Y10T428/24479 ,  H01L2924/00

Abstract: A flexible and stretchable patterned substrate is provided having a strain-permitting material comprising a patterned conformation that allows the flexible patterned substrate to experience local strain or local strain domains lower than the macroscopic strain of the flexible and stretchable patterned substrate.

Abstract translation: 提供了一种柔性和可拉伸的图案化基底，其具有包含图案化构象的应变允许材料，其允许柔性图案化基底经历比柔性和可拉伸图案化基底的宏观应变低的局部应变或局部应变结构域。

公开(公告)号：US20100307803A1

公开(公告)日：2010-12-09

申请号：US12813556

申请日：2010-08-23

Applicant: Sankar Paul ,  Scott D. Kennedy ,  Dirk M. Baars

Inventor： Sankar Paul ,  Scott D. Kennedy ,  Dirk M. Baars

IPC: H05K1/09 ,  C08L9/00 ,  C08K3/22 ,  C08K3/38 ,  C08K3/28 ,  C08L53/00 ,  B32B37/14 ,  H05K1/00 ,  H05K1/11

CPC classification number: H05K3/4626 ,  B32B3/04 ,  B32B3/08 ,  B32B3/18 ,  B32B3/30 ,  B32B5/08 ,  B32B5/16 ,  B32B5/30 ,  B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B15/14 ,  B32B15/16 ,  B32B15/20 ,  B32B25/08 ,  B32B25/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/14 ,  B32B27/20 ,  B32B27/26 ,  B32B27/285 ,  B32B27/302 ,  B32B27/32 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2260/025 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/14 ,  B32B2264/10 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/12 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/30 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2307/308 ,  B32B2307/7265 ,  B32B2457/00 ,  B32B2457/08 ,  C08G65/485 ,  C08K3/013 ,  C08L9/00 ,  C08L13/00 ,  C08L15/00 ,  C08L19/006 ,  C08L51/04 ,  C08L71/12 ,  C08L71/126 ,  C08L2666/08 ,  C08L2666/14 ,  C09J107/00 ,  C09J113/00 ,  C09J171/12 ,  H05K1/0393 ,  H05K3/00 ,  H05K3/462 ,  H05K3/4641 ,  H05K3/4676 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0355 ,  H05K2201/10378 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/263 ,  Y10T428/31544 ,  Y10T428/31931 ,  C08L2666/04

Abstract: A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Abstract translation: 一种电路子组件，包括由电介质组合物形成的电介质层，所述电介质层包含基于所述组合物的总体积：约15至约65体积％的介电填料; 和约35至约85体积％的热固性组合物，其包含：聚（亚芳基醚）和羧基官能化聚丁二烯或聚异戊二烯聚合物。

公开(公告)号：US07836585B2

公开(公告)日：2010-11-23

申请号：US12106462

申请日：2008-04-21

Applicant: Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

Inventor： Gareth G. Hougham ,  Brian S. Beaman ,  Evan G. Colgan ,  Paul W. Coteus ,  Stefano S. Oggioni ,  Enrique Vargas

IPC: H01K3/00 ,  H01R12/00

CPC classification number: H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A method of operatively combining a plurality of components to form a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

公开(公告)号：US20100288416A1

公开(公告)日：2010-11-18

申请号：US12747129

申请日：2008-11-13

Applicant: Kazunori Hamazaki

Inventor： Kazunori Hamazaki

IPC: B29C65/02

CPC classification number: H01L24/75 ,  H01L21/67005 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75315 ,  H01L2224/75316 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2203/0278 ,  Y10T156/10 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/0401

Abstract: An electronic component mounting apparatus is capable of significantly reducing a warpage amount of an electronic component warped in a case of thermocompression bonding using a conductive adhesive agent having conductive particles and a low minimum melt viscosity where a thin electronic component having a thickness smaller than or equal to 200 μm is mounted on a wiring board. In the mounting apparatus, an anisotropic conductive adhesive film having the minimum melt viscosity lower than or equal to 1.0×103 Pa·s is placed on a wiring board placed on a base, and an IC chip having a thickness smaller than or equal to 200 μm is placed on the anisotropic conductive adhesive film. In the mounting apparatus, the IC chip is pressurized by a thermocompression bonding head having a compression bonding portion made of elastomer having a rubber hardness lower than or equal to 60, so that the IC chip is bonded onto the wiring board by thermocompression.

Abstract translation: 电子部件安装装置能够显着降低使用导电性粒子的导电性粘合剂和低熔融粘度的热压接时的翘曲翘曲量，其中薄的电子部件的厚度小于或等于 至200μm安装在布线板上。 在安装装置中，将具有低于或等于1.0×10 3 Pa·s的最小熔体粘度的各向异性导电粘合剂膜放置在放置在基座上的布线板上，并且具有小于或等于200的厚度的IC芯片 μm放置在各向异性导电粘合膜上。 在安装装置中，IC芯片由具有由橡胶硬度低于或等于60的弹性体制成的压接部分的热压接头加压，使得IC芯片通过热压接合到布线板上。

公开(公告)号：US20100273958A1

公开(公告)日：2010-10-28

申请号：US12747017

申请日：2008-11-26

Applicant: Scott C. Schmidt ,  Robert J. Barsotti ,  Noah E. Macy ,  Rabi Inoubli ,  Pierre Gerard

Inventor： Scott C. Schmidt ,  Robert J. Barsotti ,  Noah E. Macy ,  Rabi Inoubli ,  Pierre Gerard

IPC: C08L53/00

CPC classification number: H05K1/0353 ,  C08F293/005 ,  C08F2438/02 ,  H05K1/0393 ,  H05K2201/0133 ,  C08F220/14 ,  C08F2220/1825 ,  C08F220/06 ,  C08F2220/286 ,  C08F220/54

Abstract: The invention relates to a liquid rubber acrylic block copolymer, and its use in modifying a thermoset composition. The liquid rubber acrylic block copolymer adds toughness and flexibility to a thermoset composition. The acrylic block copolymers are especially useful for modifying epoxy compositions.

Abstract translation: 本发明涉及液体橡胶丙烯酸类嵌段共聚物及其在改性热固性组合物中的用途。 液体橡胶丙烯酸类嵌段共聚物为热固性组合物增加韧性和柔韧性。 丙烯酸类嵌段共聚物特别适用于改性环氧组合物。

公开(公告)号：US20100270065A1

公开(公告)日：2010-10-28

申请号：US12507627

申请日：2009-07-22

Applicant: Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

Inventor： Jae Choon Cho ,  Jun Rok Oh ,  Moon Soo Park ,  Sung Taek Lim ,  Hwa Young Lee

IPC: H05K1/03 ,  C08L63/00

CPC classification number: H05K1/0373 ,  C08G59/304 ,  C08L63/00 ,  C08L83/04 ,  H05K2201/0133 ,  H05K2201/0212 ,  C08L2666/14

Abstract: Disclosed is a resin composition for a printed circuit board, which includes a complex epoxy resin including a bisphenol A epoxy resin obtained by dispersing silicone elastomer particles having a core-shell structure in a diglycidyl ether of bisphenol A epoxy resin, a cresol novolac epoxy resin, and a phosphorus-based epoxy resin; a bisphenol A curing agent; a curing accelerator; and an inorganic filler. A printed circuit board using the resin composition is also provided.

Abstract translation: 公开了一种用于印刷电路板的树脂组合物，其包括复合环氧树脂，其包括通过将双酚A环氧树脂的二缩水甘油醚中分散有具有核 - 壳结构的有机硅弹性体颗粒，甲酚酚醛环氧树脂 和磷系环氧树脂; 双酚A固化剂; 固化促进剂; 和无机填料。 还提供了使用该树脂组合物的印刷电路板。

公开(公告)号：US07790267B2

公开(公告)日：2010-09-07

申请号：US11795388

申请日：2006-01-30

Applicant: Yasuhito Kinpara ,  Makoto Iida

Inventor： Yasuhito Kinpara ,  Makoto Iida

IPC: B32B15/00

CPC classification number: H05K3/0047 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2203/0214 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/249953 ,  Y10T428/31938

Abstract: A workpiece boring/cutting operation aiding plate material comprising a rubber-containing styrene resin composition and an inorganic filler, wherein these are compounded in a weight ratio of 80:20 to 40:60; and a molding making use of the same.

Abstract translation: 一种包含含橡胶的苯乙烯树脂组合物和无机填料的工件镗/切割操作辅助板材料，其中以80:20至40:60的重量比混合; 和使用其的模制品。

公开(公告)号：US07789057B2

公开(公告)日：2010-09-07

申请号：US11643516

申请日：2006-12-21

Applicant: Wolfgang Schmid ,  Robert Ingenbleek

Inventor： Wolfgang Schmid ,  Robert Ingenbleek

IPC: H01T13/00 ,  H05K1/02 ,  B60R16/02

CPC classification number: H05K7/026 ,  H05K3/202 ,  H05K2201/0133 ,  H05K2203/1366

Abstract: A device for the protection of stamped conducting paths particularly in a motor vehicle. The device having a complete envelope (4) around the conducting paths which can be made from a sprayed elastic material.

Abstract translation: 一种用于保护冲压的导电路径的装置，特别是在机动车辆中。 该装置具有围绕导电路径的完整的外壳（4），其可以由喷射的弹性材料制成。

公开(公告)号：US20100186894A1

公开(公告)日：2010-07-29

申请号：US12753533

申请日：2010-04-02

Applicant: Takashi Matsumura

Inventor： Takashi Matsumura

IPC: B32B37/02

CPC classification number: H05K3/303 ,  B30B5/02 ,  B30B15/024 ,  B30B15/065 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32157 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75251 ,  H01L2224/753 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/8323 ,  H01L2224/83855 ,  H01L2224/83868 ,  H01L2224/8388 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K2201/0133 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/066 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/0401

Abstract: A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device includes first and second pressing rubbers. Electric components can be simultaneously packaged on the front face and the rear face of a substrate by sandwiching the substrate between the first and second pressing rubbers. The electric components are not subjected to a force for horizontally moving them because the first and second pressing rubbers are prevented from horizontal extension by a first dam member. Thus, the electric components are connected to the substrate without misalignment, thereby obtaining a highly reliable electric device.

Abstract translation: 提供一种能够在基板的两侧封装电气部件的压接装置。 压接装置包括第一和第二按压橡胶。 电子部件可以通过将基板夹在第一和第二按压橡胶之间而同时包装在基板的正面和背面上。 由于第一和第二按压橡胶被第一阻挡件防止水平延伸，电气部件不会受到水平移动的力。 因此，电子部件与基板连接而没有对准，从而获得高度可靠的电气装置。

公开(公告)号：US20100163281A1

公开(公告)日：2010-07-01

申请号：US12477146

申请日：2009-06-03

Applicant: Ngai Tsang ,  Kuo-Shu Kao

Inventor： Ngai Tsang ,  Kuo-Shu Kao

IPC: H05K1/00 ,  B05D5/12 ,  B32B38/00 ,  B29C43/20

CPC classification number: H05K3/02 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/118 ,  H05K3/06 ,  H05K3/386 ,  H05K2201/0133 ,  H05K2201/0373 ,  H05K2201/09909

Abstract: A base of circuit board, a circuit board, and a method of fabricating thereof are provided. The circuit board includes a substrate, a plurality of elastic bumps and a patterned circuit layer. The elastic bumps arranged in at least an array are located on the substrate. The patterned circuit layer is located on a portion of the elastic bumps and a portion of the substrate. The base of the circuit board and the method of fabricating thereof are also included in the present invention.

Abstract translation: 提供电路基板，电路板及其制造方法。 电路板包括衬底，多个弹性凸块和图案化电路层。 排列成至少阵列的弹性凸块位于基板上。 图案化电路层位于弹性凸块的一部分和基板的一部分上。 电路基板的基座及其制造方法也包括在本发明中。