公开(公告)号：US20140367150A1

公开(公告)日：2014-12-18

申请号：US14355141

申请日：2013-09-19

Applicant: PANASONIC CORPORATION

Inventor： Hiroharu Inoue ,  Koji Kishino

IPC: H05K1/02 ,  H05K1/03 ,  C08J5/24

CPC classification number: H05K1/0271 ,  B32B15/14 ,  C08G59/621 ,  C08J5/24 ,  C08J2333/02 ,  C08J2363/00 ,  C08J2433/02 ,  C08L63/00 ,  C08L2205/02 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/029 ,  Y10T428/249921 ,  Y10T442/20

Abstract: The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000: wherein X:Y=0:1 to 0.35:0.65, R1 represents H or CH3, and R2 represents H or an alkyl group.

Abstract translation: 本公开内容涉及通过加热干燥浸渍有树脂组合物的织物基材形成的预浸料，直到树脂组合物处于半固化状态。 树脂组合物含有（A）具有萘骨架的环氧树脂和酚类固化剂中的至少一种; 和（B）具有由下式（I）和（II）表示的结构的聚合物，碳原子之间的不饱和键，环氧值为0.2至0.8 ep / kg，重均分子量为20万 至850,000：其中X：Y = 0：1至0.35：0.65，R1表示H或CH3，R2表示H或烷基。

公开(公告)号：US20140353021A1

公开(公告)日：2014-12-04

申请号：US14285733

申请日：2014-05-23

Applicant: KYOCERA SLC Technologies Corporation

Inventor： Hidetoshi YUGAWA

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/10 ,  H05K1/03

CPC classification number: H05K1/115 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H05K2201/09854 ,  H05K2201/2054 ,  H05K2201/2072 ,  H05K2203/1476

Abstract: A wiring board 10 includes a lower wiring conductor 1, an upper insulating layer 2 laminated on the lower wiring conductor 1 and having a via hole 5 where a bottom surface is the lower wiring conductor 1, and a via conductor 3 connected to the lower wiring conductor 1 and filling the via hole 5; and the upper insulating layer 2 includes a first resin layer 2a and a second resin layer 2b sequentially laminated on the lower wiring conductor 1, the via hole 5 has an annular groove 5a over a whole circumference of the inner wall in a boundary between both resin layers 2a and 2b, and the via conductor 3 fills the groove 5.

Abstract translation: 布线基板10具有：下布线导体1，层叠在下布线导体1上的上绝缘层2，底面是下布线导体1的通路孔5;以及与下布线 导体1并填充通孔5; 并且上绝缘层2包括顺序地层叠在下布线导体1上的第一树脂层2a和第二树脂层2b，通孔5在两个树脂之间的边界内的内壁的整个圆周上具有环形槽5a 层2a和2b，通孔导体3填充槽5。

公开(公告)号：US08900491B2

公开(公告)日：2014-12-02

申请号：US13102306

申请日：2011-05-06

Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Robert E. Meyer, III

IPC: C09K21/08 ,  C01B3/12 ,  C01B33/12 ,  C07F7/18 ,  H05K1/03 ,  C08K3/00

CPC classification number: C07F7/0878 ,  C07F7/081 ,  C07F7/0889 ,  C07F7/0896 ,  C07F7/10 ,  C07F7/1804 ,  C08K3/016 ,  C08K5/5419 ,  C08K5/5465 ,  C08K9/06 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209

Abstract: A flame retardant filler having brominated silica particles, for example, imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In this example, brominated silica particles serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a flame retardant filler comprised of brominated silica particles. In an exemplary method of synthesizing the brominated silica particles, a monomer having a brominated aromatic functional group is reacted with functionalized silica particles (e.g., isocyanate, vinyl, amine, or epoxy functionalized silica particles). Alternatively, a monomer having a brominated aromatic functional group may be reacted with a silane to produce a brominated alkoxysilane monomer, which is then reacted with the surface of silica particles.

Abstract translation: 具有溴化二氧化硅颗粒的阻燃填料例如赋予制造品例如印刷电路板（PCB），连接器以及使用热塑性塑料或热塑性塑料的其它制品的阻燃性。 在该实施例中，溴化二氧化硅颗粒既用作流变控制（粘度，流动等）和阻燃剂的填料。 在示例性应用中，PCB叠层叠层包括通过包含由溴化二氧化硅颗粒构成的阻燃填料的介电材料彼此分离的导电平面。 在合成溴化二氧化硅颗粒的示例性方法中，具有溴化芳族官能团的单体与官能化二氧化硅颗粒（例如异氰酸酯，乙烯基，胺或环氧官能化二氧化硅颗粒）反应。 或者，具有溴化芳族官能团的单体可以与硅烷反应生成溴化烷氧基硅烷单体，然后与二氧化硅颗粒的表面反应。

公开(公告)号：US20140342161A1

公开(公告)日：2014-11-20

申请号：US14352893

申请日：2011-10-18

Applicant: Xianping Zeng

Inventor： Xianping Zeng

IPC: C08G59/42 ,  H05K1/05 ,  C08L63/04

CPC classification number: C08G59/4223 ,  C08G59/24 ,  C08G59/3218 ,  C08G59/4215 ,  C08G59/4276 ,  C08L63/04 ,  H05K1/0326 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  Y10T428/31522 ,  C08L67/00

Abstract: Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.

Abstract translation: 提供环氧树脂组合物和使用它们的预浸料和覆铜层压板。 环氧树脂组合物包含以下主要成分：（A）含有萘酚结构的环氧树脂; （B）活性酯固化剂; （C）固化促进剂。 本发明的环氧组合物可用于制备具有低吸水性和低介电损耗值的环氧树脂缩合物。 制造的预浸料和覆铜层压板具有良好的介电性能，耐湿性和耐热性能以及高玻璃化转变温度。

公开(公告)号：US20140327024A1

公开(公告)日：2014-11-06

申请号：US14236584

申请日：2012-07-31

Applicant: Masamichi Ishihara ,  Kenshu Oyama ,  Shoji Murakami ,  Hitonobu Onosaka

Inventor： Masamichi Ishihara ,  Kenshu Oyama ,  Shoji Murakami ,  Hitonobu Onosaka

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K1/056 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device includes an electrical insulating layer with superior heat resistance, heat dissipation, and durability, and which is manufactured through a process with good cost performance and process performance. In a semiconductor device including a first substrate to which a semiconductor chip is mounted directly or indirectly, and a white insulating layer formed on a surface of the first substrate and functioning as a reflecting material, the semiconductor chip is an LED, at least the surface of the first substrate is made of a metal, and a stacked structure of the white insulating layer and a metal layer is formed by coating a liquid material, which contains SiO2 in the form of nanoparticles and a white inorganic pigment, over the surface of the first substrate and baking the coated liquid material.

Abstract translation: 半导体器件包括具有优异的耐热性，散热性和耐久性的电绝缘层，并且通过具有良好的性价比和工艺性能的工艺制造。 在包括直接或间接安装有半导体芯片的第一基板和形成在第一基板的表面上并用作反射材料的白色绝缘层的半导体器件中，半导体芯片至少是表面 的第一衬底由金属制成，并且通过在其表面上涂覆含有纳米颗粒和白色无机颜料形式的SiO 2的液体材料来形成白色绝缘层和金属层的层叠结构 第一衬底和烘烤涂覆的液体材料。

公开(公告)号：US08877843B2

公开(公告)日：2014-11-04

申请号：US14002970

申请日：2011-11-28

Applicant: Yuko Konno ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Hiroaki Fujiwara ,  Shingo Yoshioka

Inventor： Yuko Konno ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Hiroaki Fujiwara ,  Shingo Yoshioka

IPC: H05K1/03 ,  H05K3/00 ,  C08L33/02 ,  C09D125/08 ,  H05K3/18 ,  H05K3/10 ,  C08K5/00

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract translation: 本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。 使用的树脂组合物是树脂组合物，当∈1表示通过将溶剂中溶解在树脂组合物形成的树脂膜2中制备的溶液中的树脂膜2的每单位重量的吸光度系数作为 在要照射树脂膜2的光波长处的液体，∈1为至少0.01（L /（g·cm））。

公开(公告)号：US20140322541A1

公开(公告)日：2014-10-30

申请号：US13964070

申请日：2013-08-10

Applicant: Elite Electronic Material (Kunshan) Co., Ltd

Inventor： RONG-TAO WANG ,  LI-CHIH YU ,  YU-TE LIN ,  YI-JEN CHEN ,  WENJUN TIAN ,  ZIQIAN MA ,  WENFENG LU

IPC: C08L63/04 ,  H05K1/05

CPC classification number: C08L63/04 ,  C08G59/4064 ,  C08G59/621 ,  C08K5/0066 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/31529 ,  C08L63/00

Abstract: A halogen-free resin composition, a copper clad laminate using the same, and a printed circuit board using the same are introduced. The halogen-free resin composition comprising (A) 100 parts by weight of epoxy resin; (B) 3 to 15 parts by weight of diaminodiphenyl sulfone (DDS); and (C) 5 to 70 parts by weight of phenolic co-hardener. The halogen-free resin composition features specific ingredients and proportion to thereby achieve satisfactory maximum preservation period of the prepreg manufactured from the halogen-free resin composition, control the related manufacturing process better, and attain satisfactory laminate properties, such as a high degree of water resistance, a high degree of heat resistance, and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract translation: 引入无卤素树脂组合物，使用其的覆铜层压板和使用其的印刷电路板。 无卤树脂组合物包含（A）100重量份的环氧树脂; （B）3〜15重量份的二氨基二苯砜（DDS）; 和（C）5〜70重量份的酚共聚硬化剂。 无卤素树脂组合物具有特定成分和比例，从而实现了由无卤素树脂组合物制成的预浸料坯的令人满意的最大保存期，更好地控制了相关制造工艺，并获得令人满意的层压性能，如高水量 电阻，高耐热性和良好的介电性能，因此适用于制备预浸料或树脂膜，从而可应用于覆铜层压板和印刷电路板。

公开(公告)号：US08847081B2

公开(公告)日：2014-09-30

申请号：US13736130

申请日：2013-01-08

Applicant: Kuo-Ching Chiang

Inventor： Kuo-Ching Chiang

IPC: H05K1/16 ,  F28F3/00 ,  H05K1/09 ,  B82Y10/00 ,  B82Y30/00

CPC classification number: F28F3/00 ,  B82Y10/00 ,  B82Y30/00 ,  H05K1/09 ,  H05K1/092 ,  H05K1/095 ,  H05K2201/0108 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K2201/0329

Abstract: A planar thermal dissipation patch comprises a polymer substrate; an adhesive layer attached under the polymer substrate; a protection sheet over the adhesive layer, the protection sheet is removed from the adhesive layer before attaching the planar thermal dissipation patch; a thermal dissipation layer formed on the polymer substrate; wherein the thermal dissipation layer is formed of CNT, conductive polymer, graphite or the combination thereof.

Abstract translation: 平面散热贴片包括聚合物基底; 附着在聚合物基材下面的粘合剂层; 在粘合剂层之上的保护片，在附着平面散热贴片之前，将保护片从粘合剂层上除去; 形成在所述聚合物基板上的散热层; 其中所述散热层由CNT，导电聚合物，石墨或其组合形成。

公开(公告)号：US20140246765A1

公开(公告)日：2014-09-04

申请号：US14277226

申请日：2014-05-14

Applicant: IBIDEN CO., LTD.

Inventor： Naoto ISHIDA ,  Takema Adachi

IPC: H01L23/495 ,  H05K1/02

CPC classification number: H01L23/49544 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/0298 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0209 ,  H05K2201/068

Abstract: A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup layer laminated on first surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the first buildup layer, and a second buildup layer laminated on second surface of the substrate and including the outermost interlayer resin insulation layer and the outermost conductive layer formed on the outermost interlayer resin insulation layer of the second buildup layer. The outermost interlayer resin insulation layer of the first buildup layer has thermal expansion coefficient which is set lower than thermal expansion coefficient of the outermost interlayer resin insulation layer of the second buildup layer.

Abstract translation: 印刷电路板包括芯基板，容纳在基板中的电子部件，层叠在基板的第一表面上的第一累积层，并且包括最外层间树脂绝缘层和最外层导体层，最外层导体层形成在最外层的层间树脂绝缘层上 第一累积层和层叠在基板的第二表面上的第二堆积层，并且包括形成在第二堆积层的最外层间树脂绝缘层上的最外层间树脂绝缘层和最外导电层。 第一堆积层的最外层间树脂绝缘层的热膨胀系数设定为低于第二堆积层的最外层间树脂绝缘层的热膨胀系数。

公开(公告)号：US08823145B2

公开(公告)日：2014-09-02

申请号：US12331734

申请日：2008-12-10

Applicant: Kyung Ho Shin

Inventor： Kyung Ho Shin

IPC: H01L23/48 ,  H01L23/495 ,  H01L29/06

CPC classification number: H05K1/0206 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/49113 ,  H01L2924/13062 ,  H01L2924/13091 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided are a multilayer board and a light-emitting module having the same. The light-emitting module comprises a light-emitting diode chip and a multilayer board. The multilayer board is electrically connected to the light-emitting diode chip and comprises a nonconductive heat sink via and a thin copper layer.

Abstract translation: 提供了一种多层板和具有该多层板的发光模块。 发光模块包括发光二极管芯片和多层板。 多层板电连接到发光二极管芯片，并包括非导电散热片和薄铜层。