公开(公告)号：US20120234585A1

公开(公告)日：2012-09-20

申请号：US13395659

申请日：2010-09-09

Applicant: Wolfgang Schmidt ,  Kirsten Barth-Gremmel

Inventor： Wolfgang Schmidt ,  Kirsten Barth-Gremmel

IPC: H05K1/09 ,  H05K3/00 ,  B32B5/18

CPC classification number: B41M5/5218 ,  B41M5/506 ,  B41M5/52 ,  B41M5/5254 ,  H01L51/0096 ,  H05K1/0386 ,  H05K1/0393 ,  H05K3/1208 ,  H05K3/125 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/05 ,  H05K2203/013 ,  Y02E10/549 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/249979

Abstract: Support materials for printing electrically conductive structures by means of inkjet printing with inks which contain conductive particles lead to low resistances for the printed structures without thermal post-treatment when they contain a microporous layer with a mean pore size of less than 100 nm as an outer layer.

Abstract translation: 用于通过喷墨印刷印刷导电结构的支撑材料，其中含有导电颗粒的油墨导致印刷结构的低电阻，当它们含有平均孔径小于100nm的微孔层作为外部时，无需热后处理 层。

公开(公告)号：US20110293851A1

公开(公告)日：2011-12-01

申请号：US13147424

申请日：2006-02-02

Applicant: Roger Bollström ,  Anni Määttänen ,  Petri Ihalainen ,  Martti Toivakka ,  Jouko Peltonen

Inventor： Roger Bollström ,  Anni Määttänen ,  Petri Ihalainen ,  Martti Toivakka ,  Jouko Peltonen

IPC: B32B21/04 ,  B05D5/00 ,  B05D5/12 ,  B32B29/00 ,  B05D3/06 ,  B05D7/06 ,  B05D3/12 ,  B05D1/30 ,  B05D1/38 ,  B05D3/00

CPC classification number: H01L51/0097 ,  B41M5/5218 ,  B41M2205/38 ,  H01L51/0036 ,  H01L51/0037 ,  H01L51/052 ,  H01L51/0541 ,  H05K1/0366 ,  H05K1/0386 ,  H05K2201/0209 ,  H05K2201/0284 ,  Y02E10/549 ,  Y10T428/31971 ,  Y10T428/31989

Abstract: The invention relates to a method for creating a substrate for printed or coated functionality. The method comprises obtaining a base web substrate comprising cellulose and/or wood fibres, coating the base web substrate with a barrier layer, and coating the barrier layer with a top coat layer comprising mineral and/or pigment particles. The invention relates also to a substrate for printed or coated functionality, comprising a base web substrate layer comprising cellulose and/or wood fibres, a barrier layer, coated on the base web substrate layer, and a top coat layer comprising mineral and/or pigment particles, coated on the barrier layer. The invention relates also to a functional device and its use.

Abstract translation: 本发明涉及一种用于制造用于印刷或涂布功能的基材的方法。 该方法包括获得包含纤维素和/或木纤维的基底纤维网基材，用阻挡层涂覆基底纤维网基材，并用包含矿物和/或颜料颗粒的顶涂层涂覆阻挡层。 本发明还涉及一种用于印刷或涂布的功能性的基材，其包括基材纤维网基材层，其包含纤维素和/或木纤维，涂覆在基材纤维网基材层上的阻挡层和包含矿物和/或颜料的面漆层 颗粒，涂在阻挡层上。 本发明还涉及一种功能装置及其用途。

公开(公告)号：US20110005821A1

公开(公告)日：2011-01-13

申请号：US12922253

申请日：2009-03-25

Applicant: Tom Marttila

Inventor： Tom Marttila

IPC: H05K1/00 ,  H05K3/02

CPC classification number: H05K1/115 ,  B32B37/1292 ,  B32B38/10 ,  B32B2310/0843 ,  B32B2457/08 ,  G08B13/244 ,  H05K1/0366 ,  H05K1/0386 ,  H05K3/027 ,  H05K3/046 ,  H05K3/386 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/0284 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0522 ,  H05K2203/1388 ,  H05K2203/1394 ,  H05K2203/1545 ,  Y10T29/49156

Abstract: A method for manufacturing a circuit board featuring conductive patterns, said method comprising the following steps of:i) affixing a conductive layer, such as a metal foil (3), to a substrate material (1) selectively, such that a part of the conductive layer, such as the metal foil (3), comprising desired areas (3a) for the final product and narrow areas (3c) between the final product's conducting areas, is affixed to the substrate material (1) by means of a bond (2), and removal-intended more extensive areas (3b) of the conductive layer, for example the metal foil (3), are left substantially unattached to the substrate material in such a way that the removable area (3b) is in attachment with the substrate material (1) by not more than its edge portion to be patterned in a subsequent step ii) and possibly by sites which preclude a release of the removable areas prior to a step iii); ii) patterning, by a removal of material, the conductive layer, such as the metal foil (3), from narrow gaps between the desired conducting areas (3a), and from an outer periphery of the area (3b) removable in a solid state, for establishing conductor patterns; iii) removing the removable areas (3b), not affixed to the substrate material (1), from the conductive layer, such as the metal foil (3), in a solid state after the conductive layer's edge area, which was removed from the removable area's outer periphery during the course of step ii), no longer holds the removable areas (3b) attached by their edges to the substrate material.

Abstract translation: 一种制造具有导电图案的电路板的方法，所述方法包括以下步骤：i）选择性地将诸如金属箔（3）的导电层固定到基底材料（1）上，使得部分 导电层，例如金属箔（3），其包含用于最终产品的所需区域（3a）和最终产品的导电区域之间的狭窄区域（3c），通过粘合剂（1）固定到基底材料（1） 导电层，例如金属箔（3）的移除目的更广泛的区域（3b）基本上不附着于基底材料，使得可移除区域（3b）与 基底材料（1）不超过其后续步骤ii）中待图案化的边缘部分，并且可能通过在步骤iii）之前排除可释放区域的释放的部位; ii）通过从所需导电区域（3a）之间的狭窄间隙和从固体可移除的区域（3b）的外周边去除导电层（例如金属箔（3））的图案， 状态，用于建立导体图案; iii）在导电层的边缘区域从固体状态除去导电层的边缘区域之后，从导电层（例如金属箔（3））上去除不附着于基底材料（1）的可移除区域（3b） 在步骤ii）的过程中，可移除区域的外围不再将其边缘附着的可移除区域（3b）保持在衬底材料上。

公开(公告)号：US20100108276A1

公开(公告)日：2010-05-06

申请号：US12529845

申请日：2008-03-04

Applicant: Hiroaki Kuwahara ,  Yoshio Bando ,  Chunyi Zhi ,  Chengchun Tang ,  Dmitri Golberg

Inventor： Hiroaki Kuwahara ,  Yoshio Bando ,  Chunyi Zhi ,  Chengchun Tang ,  Dmitri Golberg

IPC: D21H13/46

CPC classification number: D21H13/46 ,  B82Y10/00 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0386 ,  H05K2201/026 ,  H05K2201/0284

Abstract: A boron nitride fiber paper having a very small fiber diameter and exhibiting excellent heat resistance, mechanical properties and heat conductivity. The fiber paper is composed of a fiber assembly which contains boron nitride fibers having a fiber diameter of not more than 1 μm in an amount of not less than 40 wt %.

Abstract translation: 具有非常小的纤维直径且显示出优异的耐热性，机械性能和导热性的氮化硼纤维纸。 纤维纸由含有不小于40重量％的纤维直径不大于1μm的氮化硼纤维的纤维集合体组成。

公开(公告)号：US20100009169A1

公开(公告)日：2010-01-14

申请号：US12398762

申请日：2009-03-05

Applicant: Mark D. Holte

Inventor： Mark D. Holte

IPC: B32B5/16

CPC classification number: H05K1/0373 ,  B32B5/28 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/2998 ,  Y10T428/31703

Abstract: Epoxy laminates, e.g. CEM-1 laminates, include polymeric particles, particularly core-shell particles having an average diameter of about 0.05 to 30 μm, which reduce the dust produced during manufacture of printed circuit boards.

Abstract translation: 环氧层压板，例如 CEM-1层压体包括聚合物颗粒，特别是具有约0.05至30μm的平均直径的核 - 壳颗粒，其减少印刷电路板制造期间产生的粉尘。

公开(公告)号：US20090264036A1

公开(公告)日：2009-10-22

申请号：US12374220

申请日：2007-07-13

Applicant: Hiroyuki Yano ,  Masaya Nogi ,  Shinsuke Ifuku ,  Kentarou Abe ,  Keishin Handa

Inventor： Hiroyuki Yano ,  Masaya Nogi ,  Shinsuke Ifuku ,  Kentarou Abe ,  Keishin Handa

IPC: B32B23/02 ,  D21C9/00 ,  D21B1/04 ,  D21C3/22 ,  D21C3/02

CPC classification number: H05K1/0366 ,  D21H11/08 ,  H05K2201/0251 ,  H05K2201/0284 ,  Y10T442/2869

Abstract: Provided is a nanofiber sheet that sufficiently refined by fibrillation and has high crystallinity of cellulose fiber and can realize a fiber-reinforced composite material exhibiting high transparency, a high elastic modulus, a low coefficient of linear thermal expansion, and high heat resistance and being high in flatness and smoothness. This nanofiber sheet includes crystalline cellulose as the main component and a lignin in an amount of from 10 ppm to 10 wt %. When a fiber/resin composite material obtained by impregnating the nanofiber sheet with tricyclodecane dimethacrylate, subjecting the impregnated product to UV-curing at 20 J/cm2, and heating the cured product in vacuum at 160° C. for two hours includes 60 wt % of the cured tricyclodecane dimethacrylate and 40 wt % of nanofiber, the following physical characteristics (i) to (iii) are satisfied: (i) the parallel light transmittance of light of a wavelength of 600 nm at a sheet thickness of 100 μm is 70% or more; (ii) the Young's modulus is 5.0 GPa or more; and (iii) the coefficient of linear thermal expansion is 20 ppm/K or less.

Abstract translation: 本发明提供一种纳米纤维片，其通过原纤维化进行充分精制并具有高纤维素纤维素结晶度，并且可以实现具有高透明度，高弹性模量，低热膨胀系数和高耐热性的纤维增强复合材料，并且高 平坦度平滑。 该纳米纤维片包含结晶纤维素作为主要成分，木素含量为10〜10重量％。 当通过用三环癸烷二甲基丙烯酸酯浸渍纳米纤维片而获得的纤维/树脂复合材料，使浸渍产物以20J / cm 2进行UV固化，并且在160℃下真空加热固化产物2小时包括60重量％ 的固化的三环癸烷二甲基丙烯酸酯和40重量％的纳米纤维，满足以下物理特性（i）至（iii）：（i）100μm厚度的波长为600nm的光的平行光透射率为70 ％ 或者更多; （ii）杨氏模量为5.0GPa以上; 和（iii）线性热膨胀系数为20ppm / K以下。

公开(公告)号：US20080117238A1

公开(公告)日：2008-05-22

申请号：US11941363

申请日：2007-11-16

Applicant: Takuro SEKIYA

Inventor： Takuro SEKIYA

IPC: B41J3/00

CPC classification number: H05K3/125 ,  B41J2/2135 ,  B41J2/2142 ,  B41J3/28 ,  B41J3/407 ,  B41J3/543 ,  H05K1/0313 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/1208 ,  H05K2201/0284 ,  Y10T442/2762 ,  Y10T442/277

Abstract: A functional device fabrication apparatus is provided for forming a wiring pattern or an electronic device on a substrate using paper or paper-based material by depositing solid content of a solution on the substrate. The functional device fabrication apparatus includes a jet head. The jet head jets the solution including electronic function material onto the substrate as dot patterns. The jet head includes a device for dispensing a droplet of the solution from the jet head. A drive signal applied to the device is configured to cause the droplet jetted by the device to have a specific shape before impacting a face of the substrate.

Abstract translation: 提供了一种功能元件制造装置，用于通过在基板上沉积溶液的固体含量，使用纸或纸基材料在基板上形成布线图案或电子器件。 功能元件制造装置包括喷头。 喷射头将包含电子功能材料的溶液喷射到基板上作为点图案。 喷射头包括用于从喷射头分配溶液的液滴的装置。 施加到装置的驱动信号被配置为使得在冲击基板的表面之前由装置喷射的液滴具有特定形状。

公开(公告)号：US20070098882A1

公开(公告)日：2007-05-03

申请号：US11642732

申请日：2006-12-20

Applicant: Minoru Koyama ,  Yasunori Yamazaki

Inventor： Minoru Koyama ,  Yasunori Yamazaki

IPC: C23C26/00

CPC classification number: H05K3/125 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/038 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/1208 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/0284 ,  Y10T428/24802

Abstract: This device for manufacture of an electronic circuit forms a desired circuit pattern P by permeating liquid material (10, 40) including a material for circuit pattern formation into a permeable electronic substrate (100). This device for manufacture comprises an ink jet type head (20, 50) which discharges liquid material (10, 40) against an electronic substrate (100), and a shifting device (70) which relatively shifts the ink jet type head (20, 50) and the electronic substrate (100) with respect to one another.

Abstract translation: 用于制造电子电路的装置通过将包括用于电路图案形成的材料的液体材料（10,40）渗透到可渗透电子基板（100）中而形成期望的电路图案P. 该制造装置包括将液体材料（10,40）排放到电子基板（100）上的喷墨型头（20,50）和相对移动喷墨头（20）的移动装置（70） 50）和电子基板（100）。

公开(公告)号：US20060216486A1

公开(公告)日：2006-09-28

申请号：US11222586

申请日：2005-09-09

Applicant: Fuh-Shyong Chen

Inventor： Fuh-Shyong Chen

IPC: B32B27/38 ,  B32B27/36 ,  B32B27/30 ,  B32B27/04 ,  B32B7/02

CPC classification number: H05K3/0047 ,  B23B35/005 ,  B32B21/06 ,  B32B27/08 ,  B32B27/10 ,  B32B27/12 ,  B32B27/308 ,  B32B2255/02 ,  B32B2255/12 ,  B32B2262/067 ,  B32B2307/402 ,  B32B2307/412 ,  B32B2307/716 ,  B32B2457/08 ,  H05K2201/0284 ,  H05K2203/0156 ,  H05K2203/0214 ,  H05K2203/161 ,  Y10T428/24942 ,  Y10T428/31511 ,  Y10T428/31794 ,  Y10T428/31935 ,  Y10T428/31993

Abstract: An entry board suitable for use during drilling of an integrated circuit board includes a main laminated structure sequentially formed with a base layer made from wood fibers, a reinforcing layer of a thermosetting resin, and a hard layer of a UV-cured resin. The laminated structure further includes a coating layer interposed between the base layer and the reinforcing layer, or a paper layer interposed between the reinforcing layer and the hard layer. The coating layer or paper layer has a color different from that of the base layer.

Abstract translation: 适合于在集成电路板的钻孔期间使用的入口板包括依次形成有由木纤维制成的基层，热固性树脂的增强层和UV固化树脂的硬层的主叠层结构。 叠层结构还包括插入在基层和增强层之间的涂层或介于加强层和硬层之间的纸层。 涂层或纸层具有与基层不同的颜色。

公开(公告)号：US20050112344A1

公开(公告)日：2005-05-26

申请号：US10922382

申请日：2004-08-19

Applicant: Sean Redfern ,  Paul St. John ,  James Miller

Inventor： Sean Redfern ,  Paul St. John ,  James Miller

IPC: B23B35/00 ,  B23Q11/10 ,  H05K3/00 ,  B32B7/02

CPC classification number: B23B35/00 ,  B23B2228/36 ,  H05K3/0047 ,  H05K2201/0284 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0214 ,  H05K2203/127 ,  Y10T428/24934 ,  Y10T428/2495

Abstract: This invention relates to materials and methods of drilling printed circuit boards. In one embodiment, this invention provides a lubricated backup board comprising a core material, a lubricant, and an outer shell material and a process for using said backup board. In another embodiment, this invention provides an entry board comprising a lubricant and an outer shell material and a process for using said entry board. In preferred embodiments the lubricant layers are substantially separate and distinct layers. In preferred embodiments, adhesive is used to secure the layers together. In one embodiment, said processes allows for reuse and/or replacement of various layers of preferred backup and/or entry boards.

Abstract translation: 本发明涉及钻印印刷电路板的材料和方法。 在一个实施例中，本发明提供了一种润滑的备用板，其包括芯材料，润滑剂和外壳材料以及使用所述备用板的工艺。 在另一个实施例中，本发明提供一种包括润滑剂和外壳材料的入口板以及使用所述入口板的方法。 在优选实施例中，润滑剂层是基本上分离的和不同的层。 在优选实施例中，使用粘合剂将层固定在一起。 在一个实施例中，所述过程允许重用和/或替换优选的备份和/或进入板的各个层。