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    Wired circuit board and producing method thereof
    81.
    发明申请
    Wired circuit board and producing method thereof 有权
    有线电路板及其制造方法

    公开(公告)号：US20110284274A1

    公开(公告)日：2011-11-24

    申请号：US13067149

    申请日：2011-05-12

    Applicant: Katsutoshi Kamei ,  Yuu Sugimoto ,  Kimihide Kitamura

    Inventor： Katsutoshi Kamei ,  Yuu Sugimoto ,  Kimihide Kitamura

    IPC: H05K1/09 ,  H05K3/10 ,  H05K1/00

    CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K2201/0338 ,  Y10T29/49162

    Abstract: A wired circuit board includes an insulating layer, and a first conductive pattern and a second conductive pattern formed on the insulating layer. The first conductive pattern includes a first outer terminal on which a metal plating layer is provided, a first inner terminal to be solder connected, and a first wire which connects the first outer terminal and the first inner terminal. The second conductive pattern includes a second outer terminal to be solder connected, a second inner terminal to be solder connected, and a second wire which connects the second outer terminal and the second inner terminal. The first inner terminal and the second inner terminal are arranged in opposed relation with each other so as to be solder connected to the common electric component and preflux processing is performed thereon, and a metal plating layer is provided on the second wire.

    Abstract translation: 布线电路板包括绝缘层，以及形成在绝缘层上的第一导电图案和第二导电图案。 第一导电图案包括设置有金属镀层的第一外部端子，要被焊接的第一内部端子和连接第一外部端子和第一内部端子的第一导线。 第二导电图案包括要被焊接的第二外部端子，要被焊接的第二内部端子和连接第二外部端子和第二内部端子的第二导线。 第一内端子和第二内端子以彼此相对的关系布置，以便与公共电气部件焊接，并且在其上进行预过程处理，并且金属镀层设置在第二导线上。

    Circuit Board and Structure Using the Same
    84.
    发明申请
    Circuit Board and Structure Using the Same 有权
    电路板和结构使用它

    公开(公告)号：US20110100691A1

    公开(公告)日：2011-05-05

    申请号：US12609989

    申请日：2009-10-30

    Applicant: Hidetoshi YUGAWA

    Inventor： Hidetoshi YUGAWA

    IPC: H05K1/16 ,  H05K1/00

    CPC classification number: H05K3/388 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/072

    Abstract: A circuit board includes an insulating layer and a conductive layer formed on the insulating layer. The insulating layer contains a resin with high heat resistance. The conductive layer includes a metal carbide layer bonded to the insulating layer and containing a carbide of a first metal in group IV, V, or VI of the periodic table, and a first metal layer bonded to the metal carbide layer and containing the first metal.

    Abstract translation: 电路板包括绝缘层和形成在绝缘层上的导电层。 绝缘层包含具有高耐热性的树脂。 所述导电层包括金属碳化物层，该金属碳化物层与所述绝缘层结合，并且含有周期表第Ⅳ，Ⅴ或Ⅵ族中的第一金属的碳化物，和与所述金属碳化物层接合并含有所述第一金属的第一金属层 。

    Nickel structures and methods for manufacturing the same by removal of an underlying material
    86.
    发明授权
    Nickel structures and methods for manufacturing the same by removal of an underlying material 失效
    镍结构及其制造方法，通过去除下层材料

    公开(公告)号：US07755260B2

    公开(公告)日：2010-07-13

    申请号：US12045523

    申请日：2008-03-10

    Applicant: Patrick C. P. Cheung

    Inventor： Patrick C. P. Cheung

    IPC: H01L41/053 ,  H01L41/047

    CPC classification number: H05K3/4092 ,  H05K3/062 ,  H05K3/326 ,  H05K2201/0338 ,  H05K2201/0397 ,  H05K2201/10083 ,  H05K2203/1184 ,  Y10T428/24331

    Abstract: A printed circuit board includes a multiple-layer electrical circuit board and a nickel arm, wherein the nickel arm has an unconnected end located opposite to the connected end of the nickel arm, wherein the nickel arm has a front side and a backside located opposite to the front side of the nickel arm, wherein the backside of the nickel arm is located adjacent to the multiple layer electrical circuit board. A dimple is formed at the unconnected end of the nickel arm and on the front side of the nickel arm. An air gap is formed between the backside of the arm and the multiple layer electrical circuit board, wherein the air gap permits the arm to flex within the air gap. A lead zirconium titanate element is laminated to the printed circuit board, wherein the dimple on the front side of the arm contacts a surface of the lead zirconium titanate element, wherein a restoring spring force of the nickel arm maintains electrical contactivity between the dimple and the lead zirconium titanate element.

    Abstract translation: 印刷电路板包括多层电路板和镍臂，其中镍臂具有与镍臂的连接端相对的未连接端，其中镍臂具有正面和背面， 镍臂的前侧，其中镍臂的背面位于多层电路板附近。 在镍臂的未连接的端部和镍臂的前侧形成凹坑。 在臂的背面和多层电路板之间形成气隙，其中气隙允许臂在气隙内弯曲。 钛酸铅元素层压到印刷电路板上，其中臂的正面上的凹坑接触钛酸铅锆酸盐元件的表面，其中镍臂的恢复弹簧力保持凹坑和凹部之间的电接触性 锆钛酸铅元素。

    METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRCUIT BOARD OBTAINED BY THE MANUFACTURING METHOD
    88.
    发明申请
    METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD AND A PRINTED CIRCUIT BOARD OBTAINED BY THE MANUFACTURING METHOD 有权
    制造印刷电路板的方法和制造方法获得的印刷电路板

    公开(公告)号：US20100139959A1

    公开(公告)日：2010-06-10

    申请号：US12733105

    申请日：2008-06-23

    Applicant: Harumi Nagao ,  Yoshiyuki Asakawa ,  Kenji Ikeuchi

    Inventor： Harumi Nagao ,  Yoshiyuki Asakawa ,  Kenji Ikeuchi

    IPC: H05K1/09 ,  C23F1/00

    CPC classification number: H05K3/067 ,  C23C22/52 ,  C23C22/58 ,  C23F1/18 ,  C23F1/28 ,  H05K3/26 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2201/0761 ,  H05K2203/0796

    Abstract: A method for manufacturing a printed circuit board enables a metal residue between wirings to be removed inexpensively without side etching of a copper layer while having sufficient insulation reliability for micro wiring working. The method includes forming a base metal layer directly at least on one face of an insulator film without an adhesive, and a copper coat layer formed on the base metal layer to form adhesiveless copper clad laminates, then forming a pattern on the adhesiveless copper clad laminates by an etching method. The etching method includes a process of etching treatment for the adhesiveless copper clad laminates with an iron (III) chloride solution or a copper (II) chloride solution containing hydrochloric acid and then, a process of treatment with an acid oxidant containing permanganate and acetic acid.

    Abstract translation: 印刷电路板的制造方法能够廉价地除去布线之间的金属残留物，而不会对铜层进行侧蚀刻，同时具有足够的微布线工作的绝缘可靠性。 该方法包括直接在绝缘膜的至少一个表面上形成基底金属层，而无需粘合剂，以及形成在基底金属层上的铜涂层，以形成无粘合剂的铜包覆层压板，然后在无粘合剂覆铜层压板上形成图案 通过蚀刻方法。 蚀刻方法包括用氯化铁（III）溶液或含有盐酸的氯化铜（II）溶液对无粘合剂铜包覆层压板进行蚀刻处理的方法，然后使用含有高锰酸盐和乙酸的酸式氧化剂进行处理 。

    Wired circuit board
    89.
    发明授权
    Wired circuit board 有权
    有线电路板

    公开(公告)号：US07638873B2

    公开(公告)日：2009-12-29

    申请号：US11606021

    申请日：2006-11-30

    Applicant: Jun Ishii ,  Yasuhito Funada

    Inventor： Jun Ishii ,  Yasuhito Funada

    IPC: H01L23/04

    CPC classification number: H05K1/056 ,  H05K3/388 ,  H05K3/44 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/09845 ,  H05K2203/0723 ,  Y10T428/24917

    Abstract: A wired circuit board is provided which can reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a metal foil and an insulating layer to improve the adhesion between the metal foil and the insulating layer and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board by sputtering or electrolytic plating. A metal foil is formed on the first metal thin film by electrolytic plating. A second metal thin film is formed over the metal foil and the metal supporting board by electroless plating or sputtering. An insulating base layer is formed on the second metal thin film. A conductive pattern is formed as a wired circuit pattern on the insulating base layer. An insulating cover layer is formed on the insulating base layer to cover the conductive pattern.

    Abstract translation: 提供一种布线电路板，其可以通过简单的层结构降低传输损耗，并且还通过防止金属箔和绝缘层之间的离子迁移现象的发生而具有优异的长期可靠性，以提高金属箔和绝缘层之间的粘附性 绝缘层和导体的导电性。 制备金属支撑板，并且通过溅射或电解电镀在金属支撑板上形成第一金属薄膜。 通过电解电镀在第一金属薄膜上形成金属箔。 通过无电镀或溅射在金属箔和金属支撑板上形成第二金属薄膜。 在第二金属薄膜上形成绝缘基层。 导电图案形成为绝缘基底层上的布线电路图案。 绝缘覆盖层形成在绝缘基底层上以覆盖导电图案。

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