公开(公告)号：US07838107B2

公开(公告)日：2010-11-23

申请号：US11575262

申请日：2005-09-07

Applicant: Goh Iwamoto ,  Hideki Hirotsuru ,  Kazunori Hirahara

Inventor： Goh Iwamoto ,  Hideki Hirotsuru ,  Kazunori Hirahara

IPC: B32B5/14 ,  B32B5/22 ,  B32B3/26 ,  G11B11/105 ,  B22F3/00 ,  B32B9/00

CPC classification number: H05K1/05 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00844 ,  H01L23/13 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/09018 ,  Y10T428/12007 ,  Y10T428/249957 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/26 ,  C04B35/565 ,  C04B38/00 ,  C04B41/4521 ,  C04B41/4523 ,  H01L2924/00

Abstract: An aluminum/silicon carbide composite prepared by infiltrating a flat silicon carbide porous body with a metal containing aluminum as the main component, including an aluminum alloy layer made of a metal containing aluminum as the main component on both principal planes, and one principal plane is bonded to a circuit plate and the other principal plane is utilized as a radiation plane. The silicon carbide porous body is formed or machined into a convexly bowed shape, and after infiltration with the metal containing aluminum as the main component, the aluminum alloy layer on the radiation plane is further machined to form the bow shape. The aluminum/silicon carbide composite is suitable as a base plate for a ceramic circuit plate on which semiconductor components are mounted, for which high reliability is required.

Abstract translation: 通过以包含铝作为主要成分的金属浸渍扁平碳化硅多孔体制备的铝/碳化硅复合体，包括由铝构成的金属作为主要成分在两个主平面上的铝合金层和一个主平面， 结合到电路板，另一个主平面用作辐射平面。 碳化硅多孔体形成或加工成凸形状，并且在以含有铝的金属为主要成分的渗透后，辐射面上的铝合金层进一步加工成弓形。 铝/碳化硅复合材料适合作为安装半导体元件的陶瓷电路板的基板，需要高可靠性。

公开(公告)号：US20100238612A1

公开(公告)日：2010-09-23

申请号：US12430889

申请日：2009-04-27

Applicant: Po-Wen HSIAO ,  Yuan-Chih Tsai ,  Ted-Hong Shinn

Inventor： Po-Wen HSIAO ,  Yuan-Chih Tsai ,  Ted-Hong Shinn

IPC: H05K1/00

CPC classification number: H05K1/189 ,  G02F1/133305 ,  G02F2001/133388 ,  G02F2201/54 ,  G09F9/301 ,  H05K1/0281 ,  H05K3/284 ,  H05K2201/09018 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A flexible display device includes a display panel and a plurality of curving-restricting structures. The display panel has a display surface and a bottom surface opposite thereto. The display surface has a visible region and an outer region surrounding the visible region. The curving-restricting structures may be disposed on at least one of the outer region of the display surface and the bottom surface of the display panel. Each curving-restricting structure has a top surface and at least a slanted side wall. The top surfaces of adjacent curving-restricting structures are spaced with each other, and the slanted side walls of adjacent curving-restricting structures face each other. When the flexible display device are curved to a predetermined extent, adjacent curving-restricting structures may resist against with each other to prevent the display panel from being unduly curved to be damaged, and thus a use reliability of the flexible display device is improved.

Abstract translation: 柔性显示装置包括显示面板和多个弯曲限制结构。 显示面板具有显示面和与其相反的底面。 显示表面具有可见区域和围绕可见区域的外部区域。 弯曲限制结构可以设置在显示面的外部区域和显示面板的底面的至少一个上。 每个弯曲限制结构具有顶表面和至少一个倾斜的侧壁。 相邻的弯曲限制结构的顶面彼此间隔开，相邻弯曲限制结构的倾斜侧壁彼此面对。 当柔性显示装置弯曲到预定的程度时，相邻的弯曲限制结构可以彼此抵抗以防止显示面板被过度弯曲以致损坏，从而提高了柔性显示装置的使用可靠性。

公开(公告)号：US20100229382A1

公开(公告)日：2010-09-16

申请号：US12785887

申请日：2010-05-24

Applicant: Michael S. Randall ,  Chris Wayne ,  John McConnell

Inventor： Michael S. Randall ,  Chris Wayne ,  John McConnell

IPC: H05K3/30

CPC classification number: H05K1/141 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0306 ,  H05K1/147 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09018 ,  Y10T29/435 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169

Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.

Abstract translation: 提供一种形成电气部件的方法。 该方法包括通过将集成电路电连接到柔性电路来准备子组件; 以及将所述子组件附接到具有曲率偏差超过0.008英寸/英寸的安装表面的多层陶瓷电容器。

公开(公告)号：US20100206227A1

公开(公告)日：2010-08-19

申请号：US12770528

申请日：2010-04-29

Applicant: Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

Inventor： Donald C. Sedberry ,  Derek S. Rollins ,  David S. Metzger

IPC: B05C5/00

CPC classification number: H05K3/1216 ,  H01Q1/42 ,  H05K1/0284 ,  H05K3/0091 ,  H05K3/4664 ,  H05K2201/09018 ,  H05K2203/1366 ,  H05K2203/1476 ,  H05K2203/1554

Abstract: An electric circuit is applied to an object having a curved surface. The curved surface of the object is divided into sections, and the circuit is applied one section at a time. The circuit is formed between layers of dielectric material. The dielectric is applied by a computer-controlled device, which controls the position of a spray head and the rotation of the object, such that the spray head is held substantially perpendicular to the surface of the object at all times, and such that a controlled thickness of dielectric material can be deposited. The fine-featured circuits formed by the invention are rugged, and can be used on objects intended to be exposed to harsh environments.

Abstract translation: 电路被施加到具有曲面的物体上。 物体的曲面被分成几部分，电路一次应用一个部分。 该电路形成在介电材料层之间。 电介质通过计算机控制的装置施加，其控制喷头的位置和物体的旋转，使得喷头始终保持基本上垂直于物体的表面，并且使得受控的 介电材料的厚度可以沉积。 由本发明形成的精细电路是坚固的，并且可以用于旨在暴露于恶劣环境的物体上。

公开(公告)号：US20100065986A1

公开(公告)日：2010-03-18

申请号：US12063088

申请日：2006-08-17

Applicant: Kazuya Nakamura ,  Nobuo Imaizumi ,  Yoshihito Hiyama ,  Ryutaro Maeda ,  Hiroshi Goto

Inventor： Kazuya Nakamura ,  Nobuo Imaizumi ,  Yoshihito Hiyama ,  Ryutaro Maeda ,  Hiroshi Goto

IPC: B29C59/04

CPC classification number: B29C59/04 ,  B29C43/021 ,  B29C43/06 ,  B29C2043/025 ,  B29C2043/463 ,  B29C2059/023 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F9/00 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/465 ,  H05K2201/0129 ,  H05K2201/09018 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/167

Abstract: There is provided a nanoimprint apparatus. The nanoimprint apparatus transfers a pattern formed on a surface of a mold to a transfer layer which is formed partially or entirely on a side surface of a substantially cylindrical or columnar substrate. The nanoimprint apparatus includes: a first jig which is in contact with the substrate 102; a second jig which rotatably supports the first jig; a press unit which is connected to the second jig to press the substrate on the mold 104 through the first and second jigs; and a movable holding unit which holds the mold and moves the mold 104 in a direction substantially perpendicular to a pressing force.

Abstract translation: 提供了一种纳米压印装置。 纳米压印装置将形成在模具表面上的图案转移到部分或全部形成在基本上圆柱形或柱状衬底的侧表面上的转印层。 纳米压印装置包括：与基板102接触的第一夹具; 第二夹具，其可旋转地支撑所述第一夹具; 压接单元，其连接到第二夹具，以通过第一和第二夹具将基板压在模具104上; 以及可移动保持单元，其保持模具并使模具104沿大致垂直于按压力的方向移动。

公开(公告)号：US20100046232A1

公开(公告)日：2010-02-25

申请号：US12612553

申请日：2009-11-04

Applicant: Nobuyuki Matsui ,  Hideo Nagai ,  Keiji Nishimoto ,  Toshifumi Ogata

Inventor： Nobuyuki Matsui ,  Hideo Nagai ,  Keiji Nishimoto ,  Toshifumi Ogata

IPC: F21V29/00

CPC classification number: F21V29/004 ,  F21V19/0055 ,  F21V29/763 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/10106 ,  Y10S362/80 ,  H01L2924/00014

Abstract: A lighting device includes a heatsink 70, a socket 10 and an LED module 60. The LED module 60 has a light emitting unit 62 in a central part of a top side of a metal base substrate 63 composed of an insulating plate and a metal plate. The LED module 60 is warped such that the central part protrudes on a heatsink 70 side, which is the side opposite to the light emitting unit 62 side. The LED module 60 is mounted on the heatsink 70 in a state of the surrounds of the light emitting unit 62 being pressed according to pressing units 14T, 14L, and 14D of the socket 10. Pressing the surrounds of the light emitting unit 62 against the heatsink 70 ensures that a central part of the warping of the LED module 60 contacts the heatsink 70.

Abstract translation: 照明装置包括散热器70，插座10和LED模块60. LED模块60具有在由绝缘板和金属板构成的金属基底63的顶侧的中心部分中的发光单元62 。 LED模块60翘曲，使得中心部分在与发光单元62侧相反的一侧的散热器70侧突出。 LED模块60在发光单元62的围绕根据插座10的按压单元14T，14L和14D被按压的状态下安装在散热器70上。将发光单元62的环绕压在 散热器70确保LED模块60的翘曲的中心部分接触散热器70。

公开(公告)号：US20080156520A1

公开(公告)日：2008-07-03

申请号：US12005308

申请日：2007-12-27

Applicant: Chang-Liang Lin ,  Chi-Lung Lee ,  Hui-Yuan Liang ,  Jiu-Yan Yan

Inventor： Chang-Liang Lin ,  Chi-Lung Lee ,  Hui-Yuan Liang ,  Jiu-Yan Yan

IPC: H05K1/03

CPC classification number: H05K1/021 ,  H05K1/0272 ,  H05K1/182 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/10106

Abstract: A complex printed circuit board structure including a flexible printed wiring board and a heat-dissipating substrate bonded with the flexible printed wiring board. Parts of surface material of the flexible printed wiring board is removed to form depressions or through holes for laying electronic elements therein. The surfaces of the electronic elements can at least partially get closer to or directly contact the heat-dissipating substrate through the depressions or through holes of the flexible printed wiring board. Therefore, the heat generated by the electronic elements can be more quickly and directly conducted to the heat-dissipating substrate and dissipated at high efficiency.

Abstract translation: 一种复合印刷电路板结构，包括柔性印刷线路板和与柔性印刷线路板接合的散热基板。 柔性印刷电路板的表面材料的一部分被去除以形成用于在其中铺设电子元件的凹陷或通孔。 电子元件的表面可以至少部分地通过柔性印刷线路板的凹陷或通孔更靠近或直接接触散热基板。 因此，电子元件产生的热量可以更快速并且直接传导到散热基板并以高效率消散。

公开(公告)号：US20080134501A1

公开(公告)日：2008-06-12

申请号：US11815528

申请日：2006-02-20

Applicant: Christian Desagulier ,  Alain Lacombe ,  Bruno Esmiller

Inventor： Christian Desagulier ,  Alain Lacombe ,  Bruno Esmiller

IPC: H05K3/02

CPC classification number: H05K3/061 ,  H01Q1/38 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/013 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The invention concerns a method which consists in coating uniformly the non-developable surface (6) with an electrically conductive material (9), which is in turn coated, by spraying, with a pattern (10) of polymerizable protective material, said pattern being polymerized as it is being formed, and then selectively eliminating, through the openings (10.8) of said pattern (10), the portions of said electrically conductive material (9) which do not over said electrically conductive patterns.

Abstract translation: 本发明涉及一种方法，该方法包括用导电材料（9）均匀地涂覆不可显影表面（9），该导电材料（9）又通过喷涂具有可聚合保护材料的图案（10），所述图案是 然后通过所述图案（10）的开口（10.8）选择性地去除所述导电材料（9）的不超过所述导电图案的部分。

公开(公告)号：US20080118681A1

公开(公告)日：2008-05-22

申请号：US11865613

申请日：2007-10-01

Applicant: Yukihiro UENO

Inventor： Yukihiro UENO

IPC: B32B3/02 ,  B32B37/02

CPC classification number: B32B37/0046 ,  B32B38/0004 ,  B32B38/145 ,  B32B2037/109 ,  B32B2037/243 ,  B32B2309/68 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/0082 ,  H05K3/064 ,  H05K3/125 ,  H05K3/187 ,  H05K3/241 ,  H05K3/4652 ,  H05K2201/09018 ,  H05K2203/013 ,  H05K2203/0134 ,  H05K2203/0165 ,  H05K2203/0285 ,  H05K2203/095 ,  H05K2203/107 ,  H05K2203/1105 ,  Y10T428/13

Abstract: According to an embodiment of the present invention, a printed wiring board manufacturing apparatus being provided with a drum unit having a processing cylinder that holds the printed wiring board material and comprises a cylinder outer circumference and a processing unit that performs processing on the printed wiring board material held by the processing cylinder.

Abstract translation: 根据本发明的实施例，一种印刷线路板制造装置，具有：滚筒单元，具有保持印刷线路板材料的处理圆筒，并且包括圆筒外周和对印刷线路板进行处理的处理单元 由加工圆筒保持的材料。

公开(公告)号：US07352601B1

公开(公告)日：2008-04-01

申请号：US10997515

申请日：2004-11-24

Applicant: Michael Paul Minneman ,  Michael Crawford

Inventor： Michael Paul Minneman ,  Michael Crawford

IPC: H01R13/66 ,  H01R24/00 ,  H01R33/00

CPC classification number: H05K1/181 ,  H05K1/0284 ,  H05K1/117 ,  H05K3/325 ,  H05K3/4015 ,  H05K5/0278 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/10159 ,  H05K2201/1028 ,  Y02P70/611

Abstract: A memory device for interconnection with a Universal Serial Bus (USB) Series A type receptacle of an electronic device includes a housing wherein the housing is largely rectangular, with the width and height of a USB Series A plug standard housing; a connector within the housing, electrical terminals in the housing; the housing and terminals of a form to connect with a USB Series A receptacle of an electronic device; and a data memory and a controller within the housing. The memory device may be used in combination with a portable computing device or peripheral or with a cell phone, gps or other electrical or electronic device that includes a receptacle to house the memory device of the type disclosed herein, wherein the memory device is largely within the electrical or electronic device. A method of transporting data between a peripheral and a computer (or processor) includes storing data in a portable memory device directly using a computer or a peripheral; transporting the portable memory device to the other of such a computer or a peripheral; and delivering data from the portable memory device directly to such other computer or peripheral, said delivering being while the portable memory device is largely within the peripheral during use of the peripheral.

Abstract translation: 用于与通用串行总线（USB）系列互连的存储器装置电子设备的A型插座包括壳体，其中壳体大体上是矩形的，具有USB A系列插头标准外壳的宽度和高度; 壳体内的连接器，壳体中的电气端子; 用于与电子设备的USB系列A插座连接的形式的外壳和终端; 以及数据存储器和壳体内的控制器。 存储设备可以与便携式计算设备或外围设备或者与蜂窝电话，GPS或其他电气或电子设备组合使用，其包括用于容纳本文公开的类型的存储设备的插座，其中存储器设备在很大程度上在 电气或电子设备。 在外围设备和计算机（或处理器）之间传送数据的方法包括使用计算机或外围设备直接将数据存储在便携式存储设备中; 将便携式存储设备传送到这种计算机或外围设备的另一个; 并且将数据从便携式存储设备直接传送到这样的其他计算机或外围设备，所述传送是在便携式存储设备在外围设备的使用期间大部分在外围设备内。