Patent search cpc:"H05K2201/10189" Page 9

81.

发明授权
Electronic device 有权

公开(公告)号：US09918385B2

公开(公告)日：2018-03-13

申请号：US15450131

申请日：2017-03-06

Applicant: TOSHIBA MEMORY CORPORATION

Inventor： Shiro Harashima

IPC: H01R24/00 , H05K1/18 , H01R24/64

CPC classification number: H05K1/18 , H01R12/725 , H01R24/62 , H01R24/64 , H01R2107/00 , H05K1/0295 , H05K1/117 , H05K2201/09063 , H05K2201/10159 , H05K2201/10189

Abstract: According to an embodiment, an electronic device includes a substrate, first conductors, second conductors, a connector, third conductors, an electronic component, and a first wiring. The first conductor is complied with a first USB standard. The second conductor is complied with a second USB standard. The connector is mounted on the first conductors or the second conductors. The first wiring connects one of the first conductors, one of the second conductors, and one of the third conductors.

82.

发明授权
Techniques to convert signals routed through a fabric cable assembly 有权

公开(公告)号：US09917795B2

公开(公告)日：2018-03-13

申请号：US15150668

申请日：2016-05-10

Applicant: Intel Corporation

Inventor： Timothy Glen Hanna

IPC: H01R12/79 , H04L12/947 , H01R12/71 , H01R13/627 , H01R24/60 , H05K1/02 , H01R13/645 , H01R27/02

CPC classification number: H04L49/25 , H01R12/716 , H01R12/79 , H01R13/6272 , H01R13/6456 , H01R24/60 , H01R27/02 , H05K1/0243 , H05K2201/10189 , Y10T29/49117

Abstract: Examples are disclosed for converting signals routed through a fabric assembly. In some examples, a connector housing may house a paddle card having a first edge portion coupled to a twin-axial cable having first signal pathways capable of routing first signals to/from a fabric controller integrated with a processor/processor package. The paddle card may have a second edge portion that may couple with an external fabric connector including a second plurality of signal pathways. In some examples, first signals received at the first edge portion may be converted to second signals following a coupling of the second edge portion with the external fabric connector. The second signals may then be routed via the second signal pathways included in and/or coupled with the external fabric connector. Other examples are described and claimed.

83.

发明申请
Communication Module 审中-公开

公开(公告)号：US20180069333A1

公开(公告)日：2018-03-08

申请号：US15692360

申请日：2017-08-31

Applicant: Hitachi Metals, Ltd.

Inventor： Yoshinori SUNAGA

IPC: H01R12/72 , H01R13/6587 , H01R13/6583

CPC classification number: H01R12/721 , G02B6/3885 , G02B6/4284 , H01R9/2458 , H01R12/7082 , H01R13/6583 , H01R13/6587 , H01R13/6597 , H01R43/205 , H05K1/117 , H05K3/368 , H05K2201/10189

Abstract: A communication module includes a plug connector provided with upper connection pins and lower connection pins. The upper connection pins and the lower connection pins include signal pins each connected to a signal line arranged in a module board, and ground pins each connected to a ground line arranged in the module board. An opposing interval between a terminal end of a rear end portion of each of the ground pins included in the upper connection pins, and a terminal end of a rear end portion of each of the ground pins included in the lower connection pins is longer than an opposing interval between a terminal end of a rear end portion of each of the signal pins included in the upper connection pins and a terminal end of a rear end portion of each of the signal pins included in the lower connection pins.

84.

发明申请
LIGHT CURTAIN 审中-公开

公开(公告)号：US20180067227A1

公开(公告)日：2018-03-08

申请号：US15697488

申请日：2017-09-07

Applicant: SICK AG

Inventor： Johannes EBLE , Sebastian MATT

IPC: G01V8/20 , F21V15/01 , G01V8/16 , H05K1/14

CPC classification number: G01V8/20 , F21V15/01 , G01V8/16 , H05K1/142 , H05K1/148 , H05K2201/10106 , H05K2201/10121 , H05K2201/10189

Abstract: A light curtain having at least two electronic cards which are arranged behind one another and on which a plurality of light transmitters and/or light receivers are arranged in series, wherein the electronic cards are each connected to one another by a mechanical connection element and the electronic cards are held in a housing, wherein the housing is formed as a profile housing, wherein the first electronic card and the last electronic card are fixed to the respective housing end in the longitudinal direction so that the last light transmitter and/or light receiver of the first electronic card and of the last electronic card, said last light transmitter and/or light receiver contacting the housing end, has a fixed defined spacing from the housing end, and wherein the connection element has a minimal spacing and a maximum spacing between the electronic cards.

85.

发明申请
Printed Circuit Board via Design 审中-公开

公开(公告)号：US20180063944A1

公开(公告)日：2018-03-01

申请号：US15251699

申请日：2016-08-30

Applicant: DELL PRODUCTS, LP

Inventor： V. Mallikarjun Goud , Bhyrav M. Mutnury

IPC: H05K1/02 , H05K1/11 , H05K3/40

CPC classification number: H05K1/115 , H01R12/732 , H01R13/6461 , H01R13/6467 , H05K1/0245 , H05K1/114 , H05K1/142 , H05K3/0005 , H05K2201/09227 , H05K2201/0949 , H05K2201/10189

Abstract: A printed circuit board includes vias of first and second differential pairs, and vias of third and fourth differential pairs. The vias of the first and second differential pairs are arranged in a first via pattern based on a first crosstalk signature of a first connector to be coupled to the vias of the first and second differential pairs. The vias of the third and fourth differential pairs are arranged in a second via pattern based on a second crosstalk signature of a second connector to be coupled to the vias of the third and fourth differential pairs.

86.

发明申请
ADDITIVE COMMUNICATION CABLE AND AD HOC HARNESSES 审中-公开

公开(公告)号：US20180061531A1

公开(公告)日：2018-03-01

申请号：US15794656

申请日：2017-10-26

Applicant: Raytheon Company

Inventor： Rigel Q. Woida-O'Brien

IPC: H01B13/00 , H05K1/14 , B29L31/00 , B29L31/34

CPC classification number: H01B13/00 , B29C64/112 , B29C64/386 , B29K2995/0006 , B29K2995/0007 , B29L2031/3462 , B29L2031/707 , B33Y10/00 , B33Y80/00 , H05K1/147 , H05K2201/10189

Abstract: Embodiments are directed to a method for manufacturing a product comprising: establishing, by a computing device comprising a processor, at least one parameter of a particular instance of a component to be used in the product, adapting, by the computing device, a baseline model of the component based on the at least one parameter to accommodate use of the particular instance of the component, growing a structure based on the adapted model to accommodate the particular instance of the component using an additive manufacturing technique, coupling the structure to the particular instance of the component, growing an electrical harness by using additive printing to establish an electrical cable, and assembling the product by coupling the electrical harness to the particular instance of the component.

87.

发明授权
Circuit board architecture for an electronic device 有权

公开(公告)号：US09900999B1

公开(公告)日：2018-02-20

申请号：US15424466

申请日：2017-02-03

Applicant: Google Inc.

Inventor： David Kyungtag Lim , Jason Edward Jordan

IPC: H05K1/00 , H05K5/00 , H05K1/14 , H05K1/02 , H05K7/14 , H04R1/02 , H04R3/00 , H04N5/225

CPC classification number: H05K5/0086 , G06F1/1635 , G06F1/184 , H04M1/0262 , H04M1/0274 , H04M1/0277 , H04N5/2256 , H04N5/2257 , H04R1/025 , H04R3/00 , H04R2499/11 , H05K1/028 , H05K1/14 , H05K1/148 , H05K7/1427 , H05K2201/04 , H05K2201/10037 , H05K2201/10189

Abstract: An electronic device is provided. In some embodiments, the electronic device includes an electronic device housing having a major planar face, first and second circuit boards oriented parallel to the major planar face, a third circuit board electrically connected with the first and second circuit boards, and a battery partially surrounded by the first, second, and third circuit boards. At least a portion of the third circuit board is oriented perpendicular to the major planar face between the first and second circuit boards.

88.

发明申请
ELECTRICAL DEVICE 审中-公开

公开(公告)号：US20180035557A1

公开(公告)日：2018-02-01

申请号：US15547429

申请日：2015-12-18

Applicant: SEW-EURODRIVE GMBH & CO. KG

Inventor： Dirk MOMANN , Alexander KOLBERT

IPC: H05K5/00 , H05K5/02 , H05K5/04 , H05K1/11

CPC classification number: H05K5/0069 , H05K1/0286 , H05K1/115 , H05K5/0213 , H05K5/04 , H05K7/1432 , H05K2201/049 , H05K2201/10166 , H05K2201/10189 , H05K2201/10287

Abstract: An electrical device, for example, a converter, includes: a first circuit board, which includes first circuit traces and at least one plated-through hole, a second circuit board, which includes second circuit traces and at least one connection device, a power module, and a plug-connector part. The power module is placed on the first circuit board and is connected in an electrically conductive manner to the plated-through hole with the aid of the first circuit traces, the plug-connector part is placed on the second circuit board and is connected in an electrically conductive manner to the connection device with the aid of the second circuit traces, and the plated-through hole is connected in an electrically conductive manner with the aid of a cable to the connection device.