公开(公告)号：US20070002599A1

公开(公告)日：2007-01-04

申请号：US10546924

申请日：2003-02-28

Applicant: Robin Caven

Inventor： Robin Caven

IPC: H02M1/00

CPC classification number: H05K7/20518 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/181 ,  H05K2201/09972 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2203/1572 ,  Y02P70/611

Abstract: The present invention relates to a circuit board of DSLAM and an arrangement to minimize thermal flow or electro-magnetic radiation from digital side to analog side, or vice versa. The circuit board comprises analog components and passive digital components on first side of the circuit board and active digital components on the second side of the circuit board. The arrangement comprises an enclosure having the circuit board with analog components, passive digital components, and active digital components and a first component connected between the first portion and the second portion of the circuit board to restrict thermal flow or electromagnetic radiation from one portion to another portion.

Abstract translation: 本发明涉及一种DSLAM的电路板以及用于使从数字侧到模拟侧的热流或电磁辐射最小化的布置，反之亦然。 电路板包括电路板第一面上的模拟部件和无源数字部件以及电路板第二面上的有源数字部件。 该装置包括具有模拟部件的电路板，无源数字部件和有源数字部件的壳体以及连接在电路板的第一部分和第二部分之间的第一部件，以限制从一个部分到另一个部分的热流或电磁辐射 一部分。

公开(公告)号：US20060179652A1

公开(公告)日：2006-08-17

申请号：US11337802

申请日：2006-01-24

Applicant: Michael Petersen ,  Allan Wilson ,  Mykola Sherstyuk

Inventor： Michael Petersen ,  Allan Wilson ,  Mykola Sherstyuk

IPC: G02F1/1345

CPC classification number: H05K3/365 ,  H05K3/361 ,  H05K3/4046 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49155

Abstract: A means is described of connecting multiple flexible printed circuit (FPC) tags. The means is suitable where electrical circuitry has been printed or otherwise applied to one side of flexible substrates, and where the circuitry of two such substrates is required to be brought into electrical continuity. In this method, a sewing, stitching or embroidery machine is used to hold juxtaposed conductive surfaces in electrical continuity by tension. In a variation of the means, conductive thread, wire or other material is used to create an electrically-conducting via between the relevant conductive surfaces of two or more such FPC tags.

Abstract translation: 描述了连接多个柔性印刷电路（FPC）标签的手段。 该装置适用于已将电路印刷或以其它方式施加到柔性基板的一侧，并且需要使两个这样的基板的电路进行电连续性的情况。 在这种方法中，缝纫，缝合或刺绣机用于通过张力将并置的导电表面保持电连续性。 在该装置的变型中，使用导电线，线或其它材料来在两个或更多个这样的FPC标签的相关导电表面之间产生导电通孔。

公开(公告)号：US20060143907A1

公开(公告)日：2006-07-06

申请号：US11026745

申请日：2004-12-31

Applicant: Tuyetnhung Pham ,  Eric Brown

Inventor： Tuyetnhung Pham ,  Eric Brown

IPC: H05K3/30 ,  G01R31/28

CPC classification number: H05K3/103 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2203/162 ,  Y10T29/49004 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: Discloses a method of incorporating electronic circuitry into flexible materials (including fabrics, textiles, leathers, vinyl, canvas, etc.) that allows for hand sewing, machine sewing, or embroidering, and incorporates both surface-mount and through-hole electrical components.

Abstract translation: 公开了一种将电子电路并入柔性材料（包括织物，纺织品，皮革，乙烯基，帆布等）的方法，其允许手工缝纫，机器缝合或刺绣，并且包括表面安装和通孔电气部件。

公开(公告)号：US20060040529A1

公开(公告)日：2006-02-23

申请号：US11036010

申请日：2005-01-18

Applicant: Kevin Kuo ,  James Hsyu ,  Langhans Chang

Inventor： Kevin Kuo ,  James Hsyu ,  Langhans Chang

IPC: H01R12/00

CPC classification number: H01R4/64 ,  H01R12/707 ,  H05K3/341 ,  H05K7/142 ,  H05K2201/0373 ,  H05K2201/10409 ,  H05K2201/10598 ,  Y02P70/613

Abstract: A fixing component of a main board comprises a connecting part, a thread-assembling part and a fixing part. The connecting part has a first surface and a second surface, wherein the first surface is disposed opposite to the second surface. The thread-assembling part is disposed on the first surface of the connecting part. The fixing part is disposed on the second surface. The connecting part and the fixing part are disposed on a main board by utilizing DIP technology and SMT.

Abstract translation: 主板的固定部件包括连接部件，螺纹组装部件和固定部件。 连接部分具有第一表面和第二表面，其中第一表面设置成与第二表面相对。 螺纹组装部设置在连接部的第一面上。 固定部分设置在第二表面上。 连接部分和固定部分通过DIP技术和SMT设置在主板上。

公开(公告)号：US06978539B2

公开(公告)日：2005-12-27

申请号：US10064462

申请日：2002-07-17

Applicant: Shao-Tsu Kung ,  Chen-Hua Liu

Inventor： Shao-Tsu Kung ,  Chen-Hua Liu

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/303 ,  H05K1/0218 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169 ,  Y10T29/49179

Abstract: A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.

Abstract translation: 一种用于将IC封装安装到电路板的方法，所述IC封装具有具有周边的布置的多个电触点，首先将IC封装定位成与电路板相邻。 然后，通过多个电触点将IC封装与电路板电连接。 该方法最终将至少一个锚定装置将IC封装机械地附接到电路板，该锚固件设置在多个电接触件的外围的位置。 锚的类型，数量和精确几何取决于IC封装和电路板的具体设计参数。

公开(公告)号：US20050245118A1

公开(公告)日：2005-11-03

申请号：US11094990

申请日：2005-03-31

Applicant: Yue Liu ,  Klein Johnson

Inventor： Yue Liu ,  Klein Johnson

IPC: H01R12/00 ,  H01R12/24 ,  H01R13/58 ,  H05K3/36

CPC classification number: H05K3/361 ,  H01R12/62 ,  H01R12/772 ,  H01R13/5812 ,  H05K3/363 ,  H05K2201/10393 ,  H05K2201/10598

Abstract: An assembly for coupling an electrical device with a rigid structure using a flex circuit is provided. The assembly includes a staple having posts which extend into the rigid structure and secure the staple to the rigid structure. The flex circuit couples with both the rigid structure and the electrical device. The flex circuit extends between the staple and the rigid structure such that the flex circuit couples with the rigid structure thereby providing an interconnection between the electrical device and the rigid structure.

Abstract translation: 提供了一种用于使用柔性电路将电气设备与刚性结构耦合的组件。 该组件包括具有延伸到刚性结构中并且将钉固定到刚性结构的柱的钉。 柔性电路与刚性结构和电气装置耦合。 柔性电路在钉和刚性结构之间延伸，使得柔性电路与刚性结构耦合，从而提供电气装置与刚性结构之间的互连。

公开(公告)号：US20050235490A1

公开(公告)日：2005-10-27

申请号：US10832321

申请日：2004-04-27

Applicant: Chih-Chung Chen

Inventor： Chih-Chung Chen

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/22

CPC classification number: H05K3/0052 ,  H05K1/0269 ,  H05K3/225 ,  H05K2201/09145 ,  H05K2201/09845 ,  H05K2201/10204 ,  H05K2201/10598 ,  H05K2203/0143 ,  H05K2203/0191 ,  H05K2203/0228 ,  H05K2203/0278 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49135 ,  Y10T29/49718 ,  Y10T29/49721 ,  Y10T29/49723 ,  Y10T29/49725 ,  Y10T29/49726 ,  Y10T29/4973 ,  Y10T29/49732 ,  Y10T29/49734 ,  Y10T29/4975

Abstract: A printed circuit board defective area transplant repair method in which printed circuit boards that are determined to be defective undergo a series of reworking procedures comprised of plotting the printed circuit board area block plan, selecting the printed circuit boards, cutting out the area blocks, cutting the selected area blocks, applying the adhesive and fitting area blocks, adjusting the area block alignment, roller tamping the plastic band, curing the adhesive, and tearing off the plastic band. Following the reworking operations, defective printed circuit boards are restored into a good products capable of continuous use such that printed circuit board fabrication and production is even more economical and environmentally protective and, furthermore, printed circuit board manufacturing reaches maximum utilization rates, thereby effectively increasing practical production value.

Abstract translation: 一种印刷电路板缺陷区域移植修复方法，其中确定为有缺陷的印刷电路板经历一系列返工程序，其包括绘制印刷电路板区域块图，选择印刷电路板，切割区域块，切割 所选区域块，涂抹粘合剂和装配区域块，调整区域块对齐，辊夯塑料带，固化粘合剂，撕下塑料带。 在返工操作之后，有缺陷的印刷电路板被恢复成能够连续使用的良好产品，使得印刷电路板的制造和生产更加经济和环境保护，此外，印刷电路板制造达到最大利用率，从而有效地增加 实用生产价值。

公开(公告)号：US06947293B2

公开(公告)日：2005-09-20

申请号：US10147138

申请日：2002-05-16

Applicant: Joseph Ted DiBene, II ,  David H. Hartke

Inventor： Joseph Ted DiBene, II ,  David H. Hartke

IPC: G06F1/18 ,  H01L23/427 ,  H01L23/433 ,  H01R4/64 ,  H01R12/16 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20 ,  H05K1/11

CPC classification number: H05K7/1092 ,  G06F1/18 ,  G06F1/182 ,  G06F1/189 ,  H01L23/427 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/3011 ,  H01R4/64 ,  H01R12/52 ,  H01R12/7082 ,  H01R12/7088 ,  H01R12/721 ,  H05K1/0206 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/301 ,  H05K3/368 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/1053 ,  H05K2201/10598 ,  H05K2201/10704 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.

Abstract translation: 公开了一种使用向微处理器供电并同时提供集成热和电磁干扰（EMI）的模块化电路板组件的微处理器封装结构。 所述模块化电路板组件包括具有安装在其上的部件的基板，包括用于向所述部件供电的电路的电路板以及设置在所述基板和所述电路板之间的至少一个导电互连装置，所述导电互连装置配置 以将电路电耦合到组件。

公开(公告)号：US06938815B2

公开(公告)日：2005-09-06

申请号：US09892528

申请日：2001-06-25

Applicant: Chou H. Li

Inventor： Chou H. Li

IPC: C22C1/10 ,  H01L23/367 ,  H01L23/373 ,  H05K3/00 ,  H05K3/34 ,  B22F7/02 ,  B23K35/14

CPC classification number: H01L23/3733 ,  C22C1/1036 ,  H01L23/3677 ,  H01L23/3731 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01066 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K3/0058 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/0209 ,  H05K2201/10598 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/12028 ,  Y10T428/12049 ,  H01L2924/00

Abstract: Methods of making improved electronic systems and circuits boards, and more specifically to methods of making improved electronic systems and circuits boards using heat-resistant composite materials having superior mechanical, thermal, and electrical properties.

Abstract translation: 制造改进的电子系统和电路板的方法，更具体地涉及使用具有优异的机械，热和电特性的耐热复合材料制造改进的电子系统和电路板的方法。

公开(公告)号：US06923678B2

公开(公告)日：2005-08-02

申请号：US10606871

申请日：2003-06-26

Applicant: Yoshiaki Kato ,  Tetsuya Hattori ,  Keiichi Ito ,  Masato Minakata ,  Atsushi Nishida

Inventor： Yoshiaki Kato ,  Tetsuya Hattori ,  Keiichi Ito ,  Masato Minakata ,  Atsushi Nishida

IPC: H05K7/12 ,  H01R9/16 ,  H01R13/74 ,  H05K3/30 ,  H01R13/60

CPC classification number: H01R12/707 ,  H01R12/7029 ,  H01R12/7047 ,  H01R13/743 ,  H05K3/301 ,  H05K2201/10598

Abstract: A fastening device for facilitating temporary fastening of an electronic component to a circuit board. The fastening device includes a base embedded in an electronic device and two elastic plates extending from the base. Each elastic plate includes a diagonal portion, which extend diagonally relative to the plane of the circuit board, and a leg, which extends continuously from the diagonal portion. When the legs are inserted through a connecting hole of the circuit board, the resilient force of the elastic plates presses the diagonal portions against the wall of the connecting hole.

Abstract translation: 一种用于便于将电子部件临时固定到电路板的紧固装置。 紧固装置包括嵌入电子装置中的基座和从底座延伸的两个弹性板。 每个弹性板包括相对于电路板的平面对角延伸的对角部分和从对角部分连续延伸的腿部。 当腿部通过电路板的连接孔插入时，弹性板的弹性力将对角部分压靠在连接孔的壁上。