Abstract:
An apparatus for spraying a photo-resist comprises a resist supply reservoir, a pump and a supply line from the pump to a nozzle. Further provided is a standby receptacle into which an end portion of the nozzle is inserted when not being utilized in a spraying operation. The standby receptacle is supplied with N.sub.2 gas, bubbled through a solvent which is held at a bottom portion of the container, surrounded by an air space. The nozzle rests in a nozzle holder so as to be exposed to the internal atmosphere of the container for preventing clogging of the nozzle due to drying of the solvent when the nozzle is not in use.
Abstract:
An apparatus for forming phosphor layers in cathode-ray tubes includes a table having a plurality of operating positions for processing panels for cathode-ray tubes to coat phosphor layers thereon. A plurality of angularly spaced clamp heads for holding the panels, respectively, are supported on the table for rotation about a first axis and angular movement about a second axis in each of the operating positions. A cam, which is operatively connected to the clamp heads, has a first cam groove for angularly moving the clamp heads through different angles about the second axis in the operating positions and a second cam groove for keeping the clamp heads in a fixed angular position with respect to the second axis in the operating positions. Joint cam groove mechanisms are combined with the cam for selectively switching between the first and second cam grooves.
Abstract:
An apparatus and method is provided for liquid treating, particularly with coating materials such as paint, of an article, especially an article having a plurality of internal passages. The article is simultaneously rotated on an axis of rotation of the article and about a circular travel path into, back and forth in, and out of the liquid bath. The coated article is moved out of the bath, naturally drained under gravity, and then subjected first to low speed, then high speed rotation to clear the article of excess coating liquid and partially to dry the coating.
Abstract:
While the work-mounting sections of the work mounting member is intermittently rotated around the circle by a driving mechanism, works are fed to the work mounting sections at the first position by a work supplying device, predetermined liquid mixture is injected to and applied on works, at the third position, by a injecting mechanism, and those works which have been applied with the liquid mixture are discharged from the work mounting sections, at the second position, by a work discharging mechanism. Upon completion of injection of the liquid mixture in the works, the work mounting sections is moved and is stopped when the next work comes to the third position, and the liquid mixture is likewise injected to and applied on the work. The above operation is repeated, so that injection of the liquid mixture to works, supplying works onto the work mounting section and discharging them therefrom are sequentially executed while the work mounting sections are intermittently rotated around the circle.
Abstract:
A liquid coating device for coating a solution on a substrate to form a film includes a chuck for rotatably supporting the substrate, a nozzle for supplying the solution on the substrate, a heater provided in the nozzle for changing a temperature of the solution, a sensor for measuring a temperature of an ambient atmosphere of the substrate, and a controller for controlling the heater according the measured temperature. Thus, a solution having a temperature corresponding to the temperature of the ambient atmosphere is supplied from the nozzle to the substrate.
Abstract:
A work holding apparatus for holding a work to be coated such as a bumper for an automobile while rotating the same is disclosed. The work holding apparatus includes a frame mounted for rotation on a support member, a work holding member mounted on the frame by means of a support bar extending perpendicularly to the longitudinal direction of a work, and a drive mechanism for rotating the frame. An axis of rotation of the frame is disposed substantially at a central position of a work held on the work holding member along a width of the work in a direction perpendicular to the longitudinal direction of the work.
Abstract:
A workpiece support for supporting a disc-shaped workpiece in a vacuum chamber, comprises a support member with a support surface for carrying the workpiece. A plurality of bores extend from the support surface and through the support member. The bores communicate with a distribution chamber defined on a side of the support member which is opposite from the support surface. The distribution chamber is substantially co-extensive with the support surface and is connected to a gas feed line for supplying gas to the distribution chamber. The bores each have respective diameters which are substantially shorter than their respective lengths through the support member. In this way, gas supplied through the bores from the distribution chamber is distributed between the support surface and the workpiece as a heat transfer medium which is substantially independent from the gas flow at an inlet of each bore in the distribution chamber.
Abstract:
An apparatus for in-line lacquering of compact disks, having a processing apparatus for the metered application of a lacquer bead to one surface of the compact disk and for uniformly distributing the lacquer bead over the surface of the compact disc by means of centrifugal force, and having a manipulator for delivering and removing the compact disks to and from the processing apparatus. To enable such an apparatus to operate faster, with unchanged quality of the lacquering, it is provided that the processing apparatus has a lacquer metering station and spaced apart from it a lacquer bead centrifuging station; that a loading station is disposed spaced apart from the lacquer metering station and an unloading station is disposed spaced apart by the same distance from the lacquer bead centrifuging station; and that the manipulator has three parallel grippers which are driven in common, movable in harmonic fashion, between two adjacent stations.
Abstract:
A rotatable substrate supporting mechanism for use in a chemical vapor deposition reaction chamber of the type used in producing semi-conductor devices is provided with a susceptor for supporting a single substrate, or wafer, for rotation about an axis normal to the center of the wafer. The mechanism is provided with a temperature sensing system for producing signals indicative of sensed temperatures taken at the center of the susceptor and at various points about the periphery thereof. A gas purging system is provided for inhibiting the flow of reactant gas in unwanted areas of the reaction chamber and in the supporting system itself. Rotational driving of the mechanism is accomplished by a variable speed motor under control of a circuit which stops and starts the rotation at controlled speeds and stops the rotation at a home position for enhancing the handling of the wafers.
Abstract:
During the pre-soldering or tinning of printed circuit boards, as a rule, also the drill holes or bores and, in particular, the through-metallized drill holes are filled in an undesirable manner with solder. This solder must be removed before mounting the electrical components or elements upon the printed circuit boards. A simple apparatus is disclosed for this purpose, affording a faultless de-soldering of the drill holes, without deleteriously affecting the properties of the solder material. The printed circuit boards, in a condition where the solder applied during the pre-soldering operation is still molten, are accelerated at least once and thereafter suddenly brought to standstill in such a fashion that the excess solder is knocked or propelled out of the drill holes. The apparatus serves to guide the printed circuit board essentially horizontally in a frame and to accelerate such printed circuit board in a guided vertical drop or fall in the direction of an impact location, so that upon concussion of the frame at the impact location the excess solder is downwardly knocked or propelled out.