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公开(公告)号：US20190245286A1
公开(公告)日：2019-08-08
申请号：US16387833
申请日：2019-04-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CHIH-HENG CHUO , KUO-FU SU
CPC classification number: H01R12/65 , G01R31/2818 , H01R12/613 , H01R12/69 , H01R12/79 , H05K1/0281 , H05K1/118 , H05K2201/09409 , H05K2201/09445
Abstract: A pressure adaptive contact structure for a flexible circuit board is disclosed, in which the flexible circuit board is provided with a weakening portion or a partly surrounding weakening portion between a plurality of first contact pads so that contact surfaces of the plurality of first contact pads are respectively contactable with corresponding ones of contact points to generate contact pressing forces applied to the contact points in a manner that the contact pressing forces are adaptively adjustable by the weakening portion to accommodate height differences between adjacent ones of the first contact pads to prevent the first contact pads from being stretched and pulled with respect to each other.
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公开(公告)号：US20190045633A1
公开(公告)日：2019-02-07
申请号：US15670232
申请日：2017-08-07
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CHIH-HENG CHUO , KUO-FU SU
Abstract: A stacked flexible printed circuit board assembly with a side connection section is provided, including a first flexible printed circuit board, a second flexible printed circuit board, and a curved connection section. The curved connection section is integrally connected to and between side edges of the first flexible printed circuit board and the second flexible printed circuit board. The first flexible printed circuit board is folded in a direction toward and thus stacked on the second flexible printed circuit board such that a plurality of first contact pads of the first flexible printed circuit board correspond respectively to a plurality of second contact pads of the second flexible printed circuit board. A height adjustment layer or an adhesive layer is provided between the first flexible printed circuit board and the second flexible printed circuit board to suit the need of thickness in plugging or soldering.
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3.发明授权公开(公告)号：US09577304B2
公开(公告)日：2017-02-21
申请号：US14637898
申请日：2015-03-04
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Chih-Heng Chuo , Gwun-Jin Lin , Kuo-Fu Su
CPC classification number: H01P1/227 , H03H7/38 , H05K1/0225 , H05K1/0251 , H05K1/116 , H05K1/189 , H05K3/3447 , H05K2201/0715 , H05K2201/093 , H05K2201/09381 , H05K2201/0939 , H05K2201/09718 , H05K2201/10931
Abstract: Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.
Abstract translation: 公开了一种具有插入部件的电路板的高频连接焊盘的衰减减小结构。 电路板包括形成在其上的至少一对差模信号线。 衬底具有分别设置有至少一对上连接焊盘和下连接焊盘的上表面和下表面。 第一金属层形成在基板的下表面上。 第一金属层包括衰减减小接地图案结构。 衰减降低接地图案结构包括中空区域和至少一个突出部分。 突出部分沿着朝向下连接焊盘的方向从第一金属层延伸。
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4.发明授权公开(公告)号：US09313890B2
公开(公告)日：2016-04-12
申请号：US14478322
申请日：2014-09-05
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Chih-Heng Chuo , Kuo-Fu Su , Gwun-Jin Lin
CPC classification number: H05K1/118 , H05K1/024 , H05K1/025 , H05K1/117 , H05K2201/0191
Abstract: An attenuation reduction structure of a circuit board includes an expanded thickness formed between high frequency signal contact pads and a grounding layer of the circuit board. The expanded thickness is greater than a reference thickness between the grounding layer and high frequency signal lines. The circuit board is made of polyethylene terephthalate (PET) or polyimide (PI). Alternatively, a rigid board including resin and fibrous material or a rigid-flex board is used. The circuit board can be a single-layer circuit board or a multi-layer board formed by combining at least two single-layer circuit boards. A thickness-expanding pad is mounted between the high frequency signal contact pads and the grounding layer or the thickness of a portion of a bonding layer of the circuit board is increased to provide an expanded thickness.
Abstract translation: 电路板的衰减减小结构包括在高频信号接触焊盘和电路板的接地层之间形成的膨胀厚度。 膨胀的厚度大于接地层和高频信号线之间的参考厚度。 电路板由聚对苯二甲酸乙二醇酯（PET）或聚酰亚胺（PI）制成。 或者，使用包括树脂和纤维材料的刚性板或刚挠板。 电路板可以是通过组合至少两个单层电路板而形成的单层电路板或多层板。 在高频信号接触焊盘和接地层之间安装厚度扩大的焊盘，或者增加电路板的接合层的一部分的厚度以提供膨胀的厚度。
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5.发明申请公开(公告)号：US20160088724A1
公开(公告)日：2016-03-24
申请号：US14958006
申请日：2015-12-03
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： CHIH-HENG CHUO , GWUN-JIN LIN , KUO-FU SU
CPC classification number: H05K1/0224 , H01P3/02 , H01P3/026 , H05K1/0219 , H05K1/0245 , H05K1/0253 , H05K1/117 , H05K2201/058
Abstract: Disclosed is a grounding pattern structure for high-frequency connection pads of a circuit board. A substrate of the circuit board includes a component surface on which at least a pair of high-frequency connection pads. At least a pair of differential mode signal lines are formed on the substrate and connected to the high-frequency connection pads. The grounding surface of the substrate includes a grounding layer formed at a location corresponding to the differential mode signal lines. The grounding surface of the substrate includes a grounding pattern structure formed thereon to correspond to a location adjacent to the high-frequency connection pads. The grounding pattern structure is electrically connected to the grounding layer. The component surface of the substrate can be provided with a connector mounted thereto with signal terminals of the connector soldered to the high-frequency connection pads.
Abstract translation: 公开了一种用于电路板的高频连接焊盘的接地图案结构。 电路板的基板包括一个部件表面，在该部件表面上至少有一对高频连接焊盘。 至少一对差模信号线形成在基板上并连接到高频连接焊盘。 衬底的接地表面包括形成在对应于差动模式信号线的位置处的接地层。 衬底的接地表面包括形成在其上的接地图案结构，以对应于与高频连接焊盘相邻的位置。 接地图结构与接地层电连接。 基板的部件表面可以设置有安装在其上的连接器，其中连接器的信号端子焊接到高频连接焊盘。
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Patent Agency Ranking
6.发明授权公开(公告)号：US09040835B2
公开(公告)日：2015-05-26
申请号：US14108790
申请日：2013-12-17
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
CPC classification number: H05K1/0245 , H05K1/0225 , H05K1/118 , H05K3/4069 , H05K2201/09845
Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.
Abstract translation: 柔性电路板的差分信号传输线的衰减降低接地结构包括柔性基板，在该柔性基板上至少有一对差模信号线，至少一个接地线，覆盖绝缘层和薄金属箔 形成层。 至少一个通孔延伸穿过薄金属箔层和覆盖绝缘层，并且对应于接地线的导电接触区。 通孔填充有导电膏层，以将薄金属箔层电连接到接地线的导电接触区域，以提供良好的接地布置。 薄金属箔层包括形成在对应于差模信号线的顶角的位置处的多个开口。
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7.发明申请PENETRATION AND ASSEMBLY STRUCTURE FOR FLEXIBLE CIRCUIT BOARD WITH HINGE ASSEMBLY 有权柔性电路板的铰接和组装结构与铰链组件公开(公告)号：US20150029685A1
公开(公告)日：2015-01-29
申请号：US14138364
申请日：2013-12-23
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： GWUN-JIN LIN , CHIH-HENG CHUO , KUO-FU SU
CPC classification number: H01R35/02 , H05K1/028 , H05K1/118 , H05K5/0226 , H05K2201/055 , H05K2201/2009 , Y10T29/49002
Abstract: Disclosed is a penetration and assembly structure for a flexible circuit board with a hinge assembly. With a pre-folding line formed on a pre-prepared flexible circuit board serving as a center line, a connection section of the flexible circuit board is folded to a terminal distribution section, and then, the connection section and an extended sheet are wound up in a direction towards the terminal distribution section to form the connection section into a rolled body with the extended sheet wrapped around the rolled body to provide an effect of protection. The rolled body is then inserted through a bore of a hinge assembly so that after the rolled body completely passes through the bore of the hinge assembly, the extension section of the flexible circuit board is located in the bore of the hinge assembly and the first end and the second end are respectively set at opposite ends of the bore of the hinge assembly. In other applications, a reinforcement plate is included to reinforce the terminal distribution section of the flexible circuit board.
Abstract translation: 公开了一种具有铰链组件的柔性电路板的穿透和组装结构。 利用形成在作为中心线的预先准备好的柔性电路板上的预折线，将柔性电路板的连接部折叠到端子分配部，然后将连接部和延伸片卷起 在朝向终端分配部分的方向上，将连接部分形成为卷绕体，其中延伸的片材缠绕在卷绕体上以提供保护效果。 然后将卷绕的主体插入通过铰链组件的孔，使得在卷绕体完全通过铰链组件的孔之后，柔性电路板的延伸部分位于铰链组件的孔中，并且第一端 并且第二端分别设置在铰链组件的孔的相对端。 在其他应用中，包括加强板以加强柔性电路板的端子分配部分。
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8.发明申请公开(公告)号：US20140374147A1
公开(公告)日：2014-12-25
申请号：US14108790
申请日：2013-12-17
Applicant: Advanced Flexible Circuits Co., Ltd.
Inventor： GWUN-JIN LIN , KUO-FU SU , CHIH-HENG CHUO
IPC: H05K1/02
CPC classification number: H05K1/0245 , H05K1/0225 , H05K1/118 , H05K3/4069 , H05K2201/09845
Abstract: An attenuation reduction grounding structure of differential-mode signal transmission lines of a flexible circuit board includes a flexible substrate on which at least one pair of differential-mode signal lines, at least one grounding line, a covering insulation layer, and a thin metal foil layer are formed. At least one via hole extends through the thin metal foil layer and the covering insulation layer and corresponds to a conductive contact zone of the grounding line. The via hole is filled with a conductive paste layer to electrically connect the thin metal foil layer to the conductive contact zone of the grounding line to provide an excellent grounding arrangement. The thin metal foil layer includes a plurality of openings formed at locations corresponding to top angles of the differential-mode signal lines.
Abstract translation: 柔性电路板的差分信号传输线的衰减降低接地结构包括柔性基板，在该柔性基板上至少有一对差模信号线，至少一个接地线，覆盖绝缘层和薄金属箔 形成层。 至少一个通孔延伸穿过薄金属箔层和覆盖绝缘层，并且对应于接地线的导电接触区。 通孔填充有导电膏层，以将薄金属箔层电连接到接地线的导电接触区域，以提供良好的接地布置。 薄金属箔层包括形成在对应于差模信号线的顶角的位置处的多个开口。
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公开(公告)号：US20140290989A1
公开(公告)日：2014-10-02
申请号：US14307652
申请日：2014-06-18
Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
Inventor： KUO-FU SU , GWUN-JIN LIN
CPC classification number: H05K1/115 , H05K1/028 , H05K1/0298 , H05K3/002 , H05K3/426 , Y10T29/49165
Abstract: A structure of via hole of electrical circuit board includes an adhesive layer and a conductor layer that are formed after wiring is formed on a carrier board. At least one through hole extends in a vertical direction through the carrier board, the wiring, the adhesive layer, and the conductor layer and forms a hole wall surface. The conductor layer shows a height difference with respect to an exposed zone of the circuit trace in the vertical direction. A conductive cover section covers the conductor layer and the hole wall surface of the through hole. The carrier board is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.
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公开(公告)号：US08753143B2
公开(公告)日：2014-06-17
申请号：US13649184
申请日：2012-10-11
Applicant: Advanced Flexible Circuits Co., Ltd.
Inventor： Kuo-Fu Su , Gwun-Jin Lin , Chih-Heng Chuo
IPC: H01R12/00
CPC classification number: H01R4/024 , H01R12/594 , H01R12/65 , H01R12/79
Abstract: A connection structure for a flexible circuit cable includes a flexible circuit cable that has a flexible circuit substrate having a first end bonded to a soldering stage of the connector housing with first finger pad conductive contacts of conductive lines of the flexible circuit cable respectively corresponding to cable soldering sections of metal conductive terminals of the connector. A soldering layer is formed between a metal coating layer of the first finger pad conductive contact of each of the conductive lines and the cable soldering section of the corresponding metal conductive terminals to set the conductive lines of the flexible circuit cable in electrical connection with the metal conductive terminals of the connector.
Abstract translation: 用于柔性电路电缆的连接结构包括柔性电路电缆，该柔性电路电缆具有柔性电路基板，该电路基板的第一端与连接器外壳的焊台相连接，该第一端分别对应于电缆的柔性电路电缆的导线的第一指垫导电触点 连接器的金属导电端子的焊接部分。 在每个导电线的第一指垫导电接触件的金属涂层和相应的金属导电端子的电缆焊接部分之间形成焊接层，以将柔性电路电缆的导线设置成与金属电连接 连接器的导电端子。
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