公开(公告)号：US20090064928A1

公开(公告)日：2009-03-12

申请号：US12254750

申请日：2008-10-20

Applicant: Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

Inventor： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC: B05C13/02

CPC classification number: H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20070251456A1

公开(公告)日：2007-11-01

申请号：US11414730

申请日：2006-04-27

Applicant: Harald Herchen ,  Sharathchandra Somayaji ,  Tetsuya Ishikawa ,  Brian Lue

Inventor： Harald Herchen ,  Sharathchandra Somayaji ,  Tetsuya Ishikawa ,  Brian Lue

IPC: C23C16/00

CPC classification number: H01L21/67109

Abstract: An integrated system for baking and chilling wafers includes a heater for heating a wafer to an elevated temperature, a chiller for cooling the wafer, and a shuttle operatively connected to the heater and the chiller for transferring the wafer between the heater and the chiller. The chiller further includes a low thermal mass wafer support for providing support to a bottom surface of a wafer and a chill plate coupled to the low thermal mass wafer support for cooling the wafer. The low thermal mass wafer support has a higher thermal conductivity in the plane parallel to the bottom surface of the wafer than in the direction perpendicular to the bottom surface of the wafer. The low thermal mass wafer support can further include a plurality of proximity pins for supporting the wafer.

Abstract translation: 用于烘烤和冷却晶片的集成系统包括用于将晶片加热到高温的加热器，用于冷却晶片的冷却器和可操作地连接到加热器的梭子和用于在加热器和冷却器之间传送晶片的冷却器。 冷却器还包括用于向晶片的底表面提供支撑的低热质量晶片支撑件和耦合到低热质量晶片支撑件以冷却晶片的冷却板。 低热质量晶片支架在垂直于晶片底表面的方向上平行于晶片底表面的平面具有较高的热导率。 低热质量晶片支撑件还可以包括用于支撑晶片的多个接近销。

公开(公告)号：US20060238954A1

公开(公告)日：2006-10-26

申请号：US11153974

申请日：2005-06-15

Applicant: Tetsuya Ishikawa ,  Brian Lue

Inventor： Tetsuya Ishikawa ,  Brian Lue

IPC: H01H1/00

CPC classification number: H02N13/00 ,  H01L21/67103 ,  H01L21/6831

Abstract: A chuck for a semiconductor workpiece features integrated resistive heating and electrostatic bipolar chucking elements on a thermal pedestal. These integrated heating and chucking elements maintain wafer flatness, as well as uniformity of an underlying gap accommodating a thermal gas between the workpiece and the chuck. In accordance with one embodiment of the present invention, a laminated Kapton wafer heater is attached to the top of the thermal surface, under the wafer: At least two electrical voltage zones are isolated within the heater, in order to create a chucking force between the chuck and the wafer without having to contact the wafer with an electrical conductor. These voltage zones can be created by using separate conducting elements as well as by imposing a DC bias on zones including the resistive heating elements.

Abstract translation: 用于半导体工件的卡盘在热基座上具有集成的电阻加热和静电双极夹紧元件。 这些集成的加热和夹紧元件保持晶圆平坦度，以及在工件和卡盘之间容纳热气体的底部间隙的均匀性。 根据本发明的一个实施例，层压的Kapton晶片加热器附着在晶片下面的热表面的顶部：至少两个电压区在加热器内隔离，以便在加热器之间产生夹紧力 卡盘和晶片，而不必与电导体接触晶片。 这些电压区可以通过使用分离的导电元件以及通过在包括电阻加热元件的区域上施加DC偏压来产生。

公开(公告)号：US07743728B2

公开(公告)日：2010-06-29

申请号：US12106824

申请日：2008-04-21

Applicant: Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

Inventor： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC: B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC classification number: H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

Abstract translation: 实施例通常提供使用多室处理系统（例如，集群工具）来处理衬底的装置和方法。 在一个实施例中，簇工具适于执行轨道光刻工艺，其中感光材料被施加到基板上，在步进/扫描器中图案化，然后在以集群工具完成的显影过程中去除。 在集群工具的一个实施例中，将基板分成两组或更多组以进行传送或处理，以提高系统吞吐量，减少机器人必须在处理室之间传送一批衬底的移动次数，从而减少 提高系统可靠性。 实施例还提供了用于增加衬底转移过程以减少系统停机时间的可靠性的方法和装置。

公开(公告)号：US20090067956A1

公开(公告)日：2009-03-12

申请号：US12254778

申请日：2008-10-20

Applicant: Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

Inventor： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC: H01L21/67

CPC classification number: H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20080223293A1

公开(公告)日：2008-09-18

申请号：US12033837

申请日：2008-02-19

Applicant: Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

Inventor： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC: B05B7/06

CPC classification number: H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

Abstract: A cluster tool for processing a substrate includes a cassette and a processing module including a first process chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing modules also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.

Abstract translation: 用于处理衬底的集群工具包括盒和处理模块，该处理模块包括被配置为在衬底上执行冷却处理的第一处理室，被配置为在衬底上执行烘烤处理的第二处理室，以及输入 房间。 第一处理室，第二处理室和输入室基本上彼此相邻。 处理模块还包括机器人，该机器人被配置为在输入室中接纳基板，并将基板传送和定位在第一处理室和第二处理室中。 机器人包括机器人叶片，致动器和热交换装置。 热交换装置包括冷冻转运组件。 该群集工具还包括一个6轴关节式机器人，该机器人被配置为将基板传送到盒和输入室之间。

公开(公告)号：US07357842B2

公开(公告)日：2008-04-15

申请号：US11112281

申请日：2005-04-22

Applicant: Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

Inventor： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC: B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC classification number: H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

Abstract: A cluster tool for processing a substrate includes a cassette and a processing module including a first processing chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing module also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer arm assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.

Abstract translation: 用于处理基板的集群工具包括盒和处理模块，该处理模块包括被配置为在衬底上执行冷却处理的第一处理室，被配置为在衬底上执行烘烤处理的第二处理室，以及输入 房间。 第一处理室，第二处理室和输入室基本上彼此相邻。 处理模块还包括被配置为在输入室中接收基板并将基板传送和定位在第一处理室和第二处理室中的机器人。 机器人包括机器人叶片，致动器和热交换装置。 热交换装置包括冷却的传送臂组件。 该群集工具还包括一个6轴关节式机器人，该机器人被配置为将基板传送到盒和输入室之间。

公开(公告)号：US20070246839A1

公开(公告)日：2007-10-25

申请号：US11408465

申请日：2006-04-21

Applicant: Harald Herchen ,  Sharathchandra Somayaji ,  Brian Lue

Inventor： Harald Herchen ,  Sharathchandra Somayaji ,  Brian Lue

IPC: H01L23/52

CPC classification number: H01L21/6875 ,  H01L21/67011

Abstract: A method and apparatus related to a substrate support structure are provided. In accordance with one embodiment of the present invention, a method for manufacturing a substrate support structure including proximity pins and apparatus for supporting a substrate inside a semiconductor processing equipment are provided. The method includes providing a plate assembly comprising a plate and a plate surface and forming a plurality of recessed regions in the plate surface. Additionally, the method includes filling the recessed regions with a bonding material including epoxy material and placing a plurality of support members into the epoxy-coated recessed regions. The method further includes pushing the support members with a flat plate held up from the surface by shims to provide a uniform local height of the support members, followed by a curing step to fix the supporting members to the recessed regions.

Abstract translation: 提供了与基板支撑结构相关的方法和装置。 根据本发明的一个实施例，提供了一种用于制造衬底支撑结构的方法，其包括用于在半导体加工设备内部支撑衬底的邻近销和装置。 该方法包括提供包括板和板表面的板组件，并在板表面中形成多个凹陷区域。 此外，该方法包括用包括环氧材料的接合材料填充凹陷区域，并将多个支撑构件放置到环氧树脂涂覆的凹陷区域中。 该方法还包括通过垫片将平板从表面推压以提供支撑构件，以提供支撑构件的均匀的局部高度，随后是将支撑构件固定到凹陷区域的固化步骤。

公开(公告)号：US20060278165A1

公开(公告)日：2006-12-14

申请号：US11458664

申请日：2006-07-19

Applicant: Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  John Backer ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

Inventor： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Michael Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  John Backer ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC: C23C16/00

CPC classification number: H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20060130750A1

公开(公告)日：2006-06-22

申请号：US11112281

申请日：2005-04-22

Applicant: Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Mike Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  John Backer ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

Inventor： Tetsuya Ishikawa ,  Rick Roberts ,  Helen Armer ,  Leon Volfovski ,  Jay Pinson ,  Mike Rice ,  David Quach ,  Mohsen Salek ,  Robert Lowrance ,  John Backer ,  William Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC: C23C14/00 ,  B05C5/00 ,  B05C11/00

CPC classification number: H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

Abstract: Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.