公开(公告)号：US20100051331A1

公开(公告)日：2010-03-04

申请号：US12468841

申请日：2009-05-19

Applicant: CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  CHENG-HSIEN LIN

IPC: H05K1/03

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/4985 ,  H01L2224/48091 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/026 ,  H05K2201/0323 ,  H01L2924/00014

Abstract: A circuit substrate for mounting electronic components includes a metal base layer, an electrically conductive layer having electrically conductive traces, and a composite layer disposed between the metal base layer and the electrically conductive layer. The composite layer includes a polymer matrix and a number of carbon nanotubes embedded in the polymer matrix. The composite layer has a first surface in contact with the metal substrate and an opposite second surface. Each of the carbon nanotubes extends from the first surface to the second surface inclined at an angle of from 80° to 100° relative to the first surface.

Abstract translation: 用于安装电子部件的电路基板包括金属基底层，具有导电迹线的导电层和设置在金属基底层和导电层之间的复合层。 复合层包括聚合物基质和嵌入聚合物基质中的多个碳纳米管。 复合层具有与金属基底接触的第一表面和相对的第二表面。 每个碳纳米管从第一表面延伸到第二表面，相对于第一表面以80°至100°的角度倾斜。

公开(公告)号：US20100038116A1

公开(公告)日：2010-02-18

申请号：US12389521

申请日：2009-02-20

Applicant: CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

IPC: H05K1/00 ,  H05K1/09 ,  H05K3/46 ,  C25D5/16

CPC classification number: H05K1/0271 ,  H05K3/243 ,  H05K2201/09136 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/2009

Abstract: A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.

Abstract translation: 印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。 铜层在其给定部分包括多个电迹线。 加强层的厚度在远离给定部分的方向上增加。 在本公开中还提供了制造印刷电路板的方法。

公开(公告)号：US20100003784A1

公开(公告)日：2010-01-07

申请号：US12466361

申请日：2009-05-14

Applicant: CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  CHIA-CHENG CHEN ,  HUNG-YI CHANG ,  TUNG-YAO KUO ,  CHENG-HSIEN LIN

IPC: H01L21/52

CPC classification number: H05K1/0271 ,  H05K3/0052 ,  H05K3/303 ,  H05K3/341 ,  H05K2201/09127 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.

Abstract translation: 一种用于在印刷电路板上组装电子部件的方法包括以下步骤。 首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。 其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。 第三，电子部件安装在主体部分上并与导电图形电连接。 第五，去除不想要的部分。

公开(公告)号：US07799603B2

公开(公告)日：2010-09-21

申请号：US12466361

申请日：2009-05-14

Applicant: Chung-Jen Tsai ,  Chia-Cheng Chen ,  Hung-Yi Chang ,  Tung-Yao Kuo ,  Cheng-Hsien Lin

Inventor： Chung-Jen Tsai ,  Chia-Cheng Chen ,  Hung-Yi Chang ,  Tung-Yao Kuo ,  Cheng-Hsien Lin

IPC: H01L21/52

CPC classification number: H05K1/0271 ,  H05K3/0052 ,  H05K3/303 ,  H05K3/341 ,  H05K2201/09127 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009

Abstract: A method for assembling an electronic component on a printed circuit board includes following steps. Firstly, a printed circuit board substrate including a central main portion and a peripheral unwanted portion is provided. Secondly, electrically conductive patterns and reinforcing patterns are formed on the main portion and the unwanted portion respectively. Thirdly, an electronic component is mounted on the main portion and electrically connected with the electrically conductive patterns. Fifthly, the unwanted portion is removed.

Abstract translation: 一种用于在印刷电路板上组装电子部件的方法包括以下步骤。 首先，提供包括中央主要部分和外围不想要的部分的印刷电路板基板。 其次，分别在主要部分和不想要的部分上形成导电图案和加强图案。 第三，电子部件安装在主体部分上并与导电图形电连接。 第五，去除不想要的部分。

公开(公告)号：US20100051332A1

公开(公告)日：2010-03-04

申请号：US12471396

申请日：2009-05-24

Applicant: CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  MENG-CHIEH HSU ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN ,  MENG-CHIEH HSU ,  CHENG-HSIEN LIN

IPC: H05K1/02

CPC classification number: H05K1/186 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19042 ,  H05K3/4038 ,  H05K2201/026

Abstract: A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.

Abstract translation: 电路基板包括其中形成有导电图案的导电层，具有通孔的绝缘层和位于导电层和绝缘层之间的复合层。 通孔被配置为具有安装在其上的电子部件。 复合层包括聚合物基质和嵌入聚合物基质中的至少一个碳纳米管束。 至少一个碳纳米管束的一端与导电图案接触，另一端暴露在绝缘层的通孔中。

公开(公告)号：US20100035187A1

公开(公告)日：2010-02-11

申请号：US12467291

申请日：2009-05-17

Applicant: Chung-Jen Tsai ,  Yu-Cheng Huang ,  Hung-Yi Chang ,  Cheng-Hsien Lin

Inventor： Chung-Jen Tsai ,  Yu-Cheng Huang ,  Hung-Yi Chang ,  Cheng-Hsien Lin

IPC: G03F7/20

CPC classification number: H05K3/4644 ,  H05K3/0094 ,  H05K3/421 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49124

Abstract: A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.

Abstract translation: 一种用于平滑印刷电路板（PCB）的方法，包括：提供具有第一光滑外表面和相对的第二外表面的PCB，所述第二外表面包括平滑区域和多个凹坑; 将液体光致抗蚀剂层施加到PCB的第二外表面上以填充凹坑; 在凹坑中固化液体光致抗蚀剂以获得固化的光致抗蚀剂层; 抛光固化的光致抗蚀剂层，直到其表面与光滑区域共面; 并且抛光整个第二外表面直到去除固化的光致抗蚀剂层，从而获得平行于第一光滑外表面的平原外表面。

公开(公告)号：US08300420B2

公开(公告)日：2012-10-30

申请号：US12471396

申请日：2009-05-24

Applicant: Chung-Jen Tsai ,  Hung-Yi Chang ,  Chia-Cheng Chen ,  Meng-Chieh Hsu ,  Cheng-Hsien Lin

Inventor： Chung-Jen Tsai ,  Hung-Yi Chang ,  Chia-Cheng Chen ,  Meng-Chieh Hsu ,  Cheng-Hsien Lin

IPC: H05K7/00 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K7/10

CPC classification number: H05K1/186 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19042 ,  H05K3/4038 ,  H05K2201/026

Abstract: A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.

Abstract translation: 电路基板包括其中形成有导电图案的导电层，具有通孔的绝缘层和位于导电层和绝缘层之间的复合层。 通孔被配置为具有安装在其上的电子部件。 复合层包括聚合物基质和嵌入聚合物基质中的至少一个碳纳米管束。 至少一个碳纳米管束的一端与导电图案接触，另一端暴露在绝缘层的通孔中。

公开(公告)号：US08227175B2

公开(公告)日：2012-07-24

申请号：US12467291

申请日：2009-05-17

Applicant: Chung-Jen Tsai ,  Yu-Cheng Huang ,  Hung-Yi Chang ,  Cheng-Hsien Lin

Inventor： Chung-Jen Tsai ,  Yu-Cheng Huang ,  Hung-Yi Chang ,  Cheng-Hsien Lin

IPC: H05K3/00

CPC classification number: H05K3/4644 ,  H05K3/0094 ,  H05K3/421 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2203/025 ,  Y10T29/49117 ,  Y10T29/49124

Abstract: A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.

Abstract translation: 一种用于平滑印刷电路板（PCB）的方法，包括：提供具有第一光滑外表面和相对的第二外表面的PCB，所述第二外表面包括平滑区域和多个凹坑; 将液体光致抗蚀剂层施加到PCB的第二外表面上以填充凹坑; 在凹坑中固化液体光致抗蚀剂以获得固化的光致抗蚀剂层; 抛光固化的光致抗蚀剂层，直到其表面与光滑区域共面; 并且抛光整个第二外表面直到去除固化的光致抗蚀剂层，从而获得平行于第一光滑外表面的平原外表面。

公开(公告)号：US08067696B2

公开(公告)日：2011-11-29

申请号：US12389521

申请日：2009-02-20

Applicant: Chung-Jen Tsai ,  Chia-Cheng Chen ,  Hung-Yi Chang ,  Tung-Yao Kuo ,  Cheng-Hsien Lin

Inventor： Chung-Jen Tsai ,  Chia-Cheng Chen ,  Hung-Yi Chang ,  Tung-Yao Kuo ,  Cheng-Hsien Lin

IPC: H05K1/00

CPC classification number: H05K1/0271 ,  H05K3/243 ,  H05K2201/09136 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/2009

Abstract: A printed circuit board includes an insulating layer, a copper layer formed on the insulating layer and a reinforcing layer formed on the copper layer at opposite sides of the given portion. The copper layer includes a plurality of electrical traces at a given portion thereof. A thickness of the reinforcing layer increases in a direction away from the given portion. A method for manufacturing the printed circuit board is also provided in this disclosure.

Abstract translation: 印刷电路板包括绝缘层，形成在绝缘层上的铜层和在给定部分的相对侧的铜层上形成的增强层。 铜层在其给定部分包括多个电迹线。 加强层的厚度在远离给定部分的方向上增加。 在本公开中还提供了制造印刷电路板的方法。

公开(公告)号：US20100044237A1

公开(公告)日：2010-02-25

申请号：US12426276

申请日：2009-04-19

Applicant: CHUNG-JEN TSAI ,  YU-CHENG HUANG ,  HUNG-YI CHANG ,  CHENG-HSIEN LIN

Inventor： CHUNG-JEN TSAI ,  YU-CHENG HUANG ,  HUNG-YI CHANG ,  CHENG-HSIEN LIN

IPC: C25D5/02 ,  C25D7/00

CPC classification number: H05K3/427 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/025 ,  H05K2203/0346

Abstract: A method for manufacturing a PCB is related. The method includes providing a substrate with two opposite conductive layers and defining a through hole passing through the two conductive layers; forming a first electrically conductive metal layer on an inner surface of the substrate in the through hole using an electro-less plating process; forming a second electrically conductive metal layer on the first electrically conductive metal layer using an electro-plating process till the through hole being filled.

Abstract translation: 涉及PCB的制造方法。 该方法包括向基板提供两个相对的导电层并限定穿过两个导电层的通孔; 使用无电镀工艺在所述通孔中的所述基板的内表面上形成第一导电金属层; 在所述第一导电金属层上使用电镀工艺形成第二导电金属层，直到所述通孔被填充。