公开(公告)号：US5731547A

公开(公告)日：1998-03-24

申请号：US603629

申请日：1996-02-20

Applicant: Mark Daniel Derwin ,  Daniel Peter Labzentis ,  Jonathan David Reid ,  Timothy Lee Sharp

Inventor： Mark Daniel Derwin ,  Daniel Peter Labzentis ,  Jonathan David Reid ,  Timothy Lee Sharp

IPC: H01L21/56 ,  H01L23/12 ,  H01L23/24 ,  H05K1/00 ,  H05K3/24 ,  H05K3/28 ,  H05K3/40 ,  H05K1/09

CPC classification number: H01L23/24 ,  H05K3/28 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/09781 ,  H05K3/244 ,  H05K3/4007

Abstract: A circuitized substrate having conductive circuitry thereon and a barrier located adjacent at least portions of the circuitry to serve as an effective constraint for liquid material (e.g., encapsulant) applied to cover and protect the circuitry. The barrier can be formed concurrently with circuitry formation and formed of materials (e.g., copper, nickel, gold) similar to those used for the circuitry. The barrier is of two-part construction and of a particular shape wherein one part affords a greater surface tension than the other such that the material may actually lie on one part while being prevented from engagement with the other. Providing such dual (or "progressive") surface tensions successfully constrains the liquid material at least until solidification thereof occurs.

Abstract translation: 电路基板，其上具有导电电路，以及位于电路的至少部分附近的阻挡层，用作用于覆盖和保护电路的液体材料（例如，密封剂）的有效约束。 阻挡层可以与电路形成同时形成，并且由类似于用于电路的材料（例如铜，镍，金）形成。 屏障是两部分构造和特定形状，其中一个部分提供比另一个部分更大的表面张力，使得材料实际上可以位于一个部分上，同时防止与另一个接合。 提供这种双重（或“渐进的”）表面张力成功地限制液体材料至少直到发生其固化。

公开(公告)号：US5766499A

公开(公告)日：1998-06-16

申请号：US638251

申请日：1996-04-26

Applicant: Kim Joseph Blackwell ,  Daniel Peter Labzentis ,  Jonathan David Reid

Inventor： Kim Joseph Blackwell ,  Daniel Peter Labzentis ,  Jonathan David Reid

IPC: H01L21/48 ,  H05K1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/24 ,  H05K3/30 ,  H05K3/40 ,  H05K3/42 ,  H01L21/02

CPC classification number: H05K3/002 ,  H01L21/4857 ,  H05K1/0266 ,  H05K3/4007 ,  H05K2201/0166 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2203/0554 ,  H05K2203/1476 ,  H05K2203/167 ,  H05K3/0008 ,  H05K3/062 ,  H05K3/243 ,  H05K3/303 ,  H05K3/427

Abstract: A method of making a circuitized substrate wherein a dielectric layer is provided having a first layer of metallic material thereon. A first metallic member is formed on the dielectric's metallic layer, following which a pair of openings are precisely provided within a second dielectric material located on the dielectric. These openings in turn define a selected area on the first metallic member and, significantly, a precisely oriented pattern of the first metallic layer at a spaced distance from the metallic member. This metallic pattern serves as a mask to permit formation of an opening through the dielectric, which opening in turn may be engaged by tooling or the like such as may be used to position an electronic component, e.g., semiconductor device, on the underlying substrate. The invention thus assures precise orientation and placement of components such as semiconductor devices on highly dense circuit patterns such as those required in the present art in the manufacture of devices such as those of the information handling system (computer) variety.

Abstract translation: 一种制造电路化基板的方法，其中提供介电层，其上具有第一层金属材料。 第一金属构件形成在电介质的金属层上，随后在位于电介质上的第二电介质材料内精确地设置一对开口。 这些开口依次限定第一金属构件上的选定区域，并且显着地限定第一金属层与金属构件隔开距离的精确定向图案。 该金属图案用作掩模以允许通过电介质形成开口，该开口又可以通过工具等接合，例如可用于将电子部件（例如半导体器件）定位在下面的基板上。 因此，本发明确保了诸如半导体器件之类的部件在诸如本领域所需要的诸如信息处理系统（计算机）品种的设备的制造中的高密度电路图案上的精确取向和放置。