公开(公告)号：US20080190656A1

公开(公告)日：2008-08-14

申请号：US11579727

申请日：2005-05-06

Applicant: David Cheeke ,  Leslie M. Landsberger

Inventor： David Cheeke ,  Leslie M. Landsberger

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/167 ,  H05K1/0212 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/062 ,  H05K2203/171 ,  Y10T29/49155

Abstract: There is described a printed circuit board with a thermally trimmable component embedded therein. A layer of refractory insulating material is provided to provide mechanical support and chemical passivation for the thermally trimmable component. The component is trimmed by applying a sequence of heat pulses the a heating element, which could be the component itself or a separate element. A cavity may be burned in the substrate to provide thermal isolation for the thermally trimmable component.

Abstract translation: 描述了嵌入其中的可热调制组件的印刷电路板。 提供一层难熔绝缘材料，为热可调节部件提供机械支撑和化学钝化。 通过施加加热元件的加热元件序列来修剪部件，加热元件可以是部件本身或单独的元件。 空腔可以在基板中燃烧以提供热可分离组件的热隔离。