公开(公告)号：US20180010768A1

公开(公告)日：2018-01-11

申请号：US15203430

申请日：2016-07-06

Applicant: Fameson Technology Co., Ltd.

Inventor： Rong-Seng CHANG

IPC: F21V9/16

CPC classification number: F21V9/30 ,  C09K11/02 ,  H01L33/507

Abstract: A method for fabricating a solid-state lighting body, which differs from a conventional solid-state lighting body doping lighting powder in a filling material during a high-temperature calcining process, and mixes lighting powder with either organic powder or inorganic powder to form liquid mixture, thereby fabricating the solid-state lighting body in pour molding. The method is performed at a lower temperature without the high energy consumption and high equipment cost. The solid-state lighting body is easily molded at a low temperature without damaging the structure properties of the lighting powder and decreasing the lighting efficiency. As a result, the solid-state lighting body of the present invention has very good heat-resistant abilities and efficiently prevents lighting elements from high-temperature cracking resulted from long-term illumination, so as to increase use life and reliability.

公开(公告)号：US20160323998A1

公开(公告)日：2016-11-03

申请号：US14698635

申请日：2015-04-28

Applicant: Fameson Technology Co., Ltd.

Inventor： Rong-Seng CHANG

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K3/424 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0792 ,  H05K2201/093

Abstract: The present invention proposes substrate material favoring via hole electroplating to overcome the conventional problem that the polymer-based printed circuit board is hard to conduct electricity and likely to have poor electroplating quality. The present invention adds a conductive material to a polymeric material and controls the proportions and structure thereof to form a substrate material so as to improve the affinity of the substrate material to the metal electroplated inside the via hole with the resistance of the substrate material remaining in an allowable range. Thereby is increased yield and efficiency and saved time and cost in fabricating printed circuit boards. Further, the present invention reduces the proportion of the polymeric material with the mechanical strength remaining in an allowable range so as to decrease the overall expansion rate and obtain a fire-proof effect. Therefore, the substrate material can be used to fabricate precision products.

Abstract translation: 本发明提出了有利于通孔电镀的基板材料，以克服聚合物基印刷电路板难以导电并且可能具有差的电镀质量的常规问题。 本发明将导电材料添加到聚合物材料中并控制其比例和结构以形成基底材料，以便提高衬底材料对通孔内部电镀的金属的亲和性，其中衬底材料的电阻保持在 允许范围。 从而提高了产量和效率，并节省了制造印刷电路板的时间和成本。 此外，本发明将机械强度保持在容许范围内的聚合物材料的比例降低，从而降低整体膨胀率并获得防火效果。 因此，基板材料可用于制造精密产品。