公开(公告)号：US07396476B2

公开(公告)日：2008-07-08

申请号：US11275575

申请日：2006-01-17

Applicant: Jeffrey A. Ridley ,  James A. Neus

Inventor： Jeffrey A. Ridley ,  James A. Neus

IPC: C23F1/00

CPC classification number: B81C1/00698 ,  B81B2201/0271 ,  B81B2201/033 ,  B81C2201/0132

Abstract: Methods of fabricating comb drive devices utilizing one or more sacrificial etch-buffers are disclosed. An illustrative fabrication method may include the steps of etching a pattern onto a wafer substrate defining one or more comb drive elements and sacrificial etch-buffers, liberating and removing one or more sacrificial etch-buffers prior to wafer bonding, bonding the etched wafer substrate to an underlying support substrate, and etching away the wafer substrate. In some embodiments, the sacrificial etch-buffers are removed after bonding the wafer to the support substrate. The sacrificial etch-buffers can be provided at one or more selective regions to provide greater uniformity in etch rate during etching. A comb drive device in accordance with an illustrative embodiment can include a number of interdigitated comb fingers each having a more uniform profile along their length and/or at their ends, producing less harmonic distortion during operation.

Abstract translation: 公开了使用一个或多个牺牲蚀刻缓冲器制造梳状驱动装置的方法。 示例性的制造方法可以包括以下步骤：将图案蚀刻到限定一个或多个梳状驱动元件和牺牲蚀刻缓冲器的晶片衬底上，在晶片接合之前释放和去除一个或多个牺牲蚀刻缓冲器，将蚀刻的晶片衬底接合到 底层支撑衬底，并蚀刻掉晶片衬底。 在一些实施例中，在将晶片接合到支撑衬底之后去除牺牲蚀刻缓冲器。 可以在一个或多个选择性区域处提供牺牲蚀刻缓冲器，以在蚀刻期间提供更大的蚀刻速率均匀性。 根据说明性实施例的梳状驱动装置可以包括多个交叉指状梳，每个梳指在其长度和/或其端部具有更均匀的轮廓，在操作期间产生较少的谐波失真。

公开(公告)号：US07012322B2

公开(公告)日：2006-03-14

申请号：US10746219

申请日：2003-12-22

Applicant: Jeffrey A. Ridley ,  James A. Neus

Inventor： Jeffrey A. Ridley ,  James A. Neus

IPC: H01L23/495

CPC classification number: B81C1/00698 ,  B81B2201/0271 ,  B81B2201/033 ,  B81C2201/0132

Abstract: Methods of fabricating comb drive devices utilizing one or more sacrificial etch-buffers are disclosed. An illustrative fabrication method may include the steps of etching a pattern onto a wafer substrate defining one or more comb drive elements and sacrificial etch-buffers, liberating and removing one or more sacrificial etch-buffers prior to wafer bonding, bonding the etched wafer substrate to an underlying support substrate, and etching away the wafer substrate. In some embodiments, the sacrificial etch-buffers are removed after bonding the wafer to the support substrate. The sacrificial etch-buffers can be provided at one or more selective regions to provide greater uniformity in etch rate during etching. A comb drive device in accordance with an illustrative embodiment can include a number of interdigitated comb fingers each having a more uniform profile along their length and/or at their ends, producing less harmonic distortion during operation.

Abstract translation: 公开了使用一个或多个牺牲蚀刻缓冲器制造梳状驱动装置的方法。 示例性的制造方法可以包括以下步骤：将图案蚀刻到限定一个或多个梳状驱动元件和牺牲蚀刻缓冲器的晶片衬底上，在晶片接合之前释放和去除一个或多个牺牲蚀刻缓冲器，将蚀刻的晶片衬底接合到 底层支撑衬底，并蚀刻掉晶片衬底。 在一些实施例中，在将晶片接合到支撑衬底之后去除牺牲蚀刻缓冲器。 可以在一个或多个选择性区域处提供牺牲蚀刻缓冲器，以在蚀刻期间提供更大的蚀刻速率均匀性。 根据说明性实施例的梳状驱动装置可以包括多个交叉指状梳，每个梳指在其长度和/或其端部具有更均匀的轮廓，在操作期间产生较少的谐波失真。