WATERPROOF METHOD FOR ELECTRONIC DEVICE AND WATERPROOF ELECTRONIC DEVICE
    1.
    发明申请
    WATERPROOF METHOD FOR ELECTRONIC DEVICE AND WATERPROOF ELECTRONIC DEVICE 审中-公开
    用于电子设备和防水电子设备的防水方法

    公开(公告)号:US20090279269A1

    公开(公告)日:2009-11-12

    申请号:US12419514

    申请日:2009-04-07

    Applicant: Jason SHIUE

    Inventor: Jason SHIUE

    Abstract: A waterproof method for an electronic device and a waterproof electronic device are provided. The electronic device comprises a printed circuit board, which comprises a board, a plurality of electrical elements and a button device. The waterproof method comprises the following steps: applying a first non-solid adhesive to cover the button device directly, curing the first non-solid adhesive to form a first waterproof layer, applying a second non-solid adhesive to at least cover the electrical elements directly and curing the second non-solid adhesive to form a second waterproof layer. In the end, assembling the printed circuit board, sealed with the waterproof layers, into a case to form the waterproof electronic device.

    Abstract translation: 提供了一种电子设备和防水电子设备的防水方法。 电子设备包括印刷电路板,其包括板,多个电气元件和按钮装置。 防水方法包括以下步骤:施加第一非固体粘合剂以直接覆盖按钮装置,固化第一非固体粘合剂以形成第一防水层,施加第二非固体粘合剂以至少覆盖电气元件 直接固化第二非固体粘合剂以形成第二防水层。 最后,将用防水层密封的印刷电路板组装成壳体以形成防水电子装置。

    ELECTRICAL DEVICE, BAND STRUCTURE AND METHODS FOR SEALING AT LEAST ONE PORTION OF AN ELECTRICAL DEVICE OR A CIRCUIT BOARD HERMETICALLY
    2.
    发明申请
    ELECTRICAL DEVICE, BAND STRUCTURE AND METHODS FOR SEALING AT LEAST ONE PORTION OF AN ELECTRICAL DEVICE OR A CIRCUIT BOARD HERMETICALLY 审中-公开
    用于密封电气设备或电路板的至少一个部分的电气设备,带结构和方法

    公开(公告)号:US20090277662A1

    公开(公告)日:2009-11-12

    申请号:US12168609

    申请日:2008-07-07

    Applicant: Jason Shiue

    Inventor: Jason Shiue

    Abstract: An electrical device is provided. The electrical device comprises a circuit board and a waterproof layer. The waterproof layer substantially seals at least one portion of the circuit board to prevent the short circuit after water infiltrating. Thereby, this particular structure provides superior waterproof protection for the electrical device. This electrical device may be installed in a band structure which facilitates portability. Moreover, the present invention further provides methods for sealing at least one portion of the electrical device or the circuit board hermetically, while the electrical device or the circuit board would be sealed with the waterproof layer hermetically.

    Abstract translation: 提供电气设备。 电气装置包括电路板和防水层。 防水层基本上密封电路板的至少一部分,以防止水渗入后的短路。 因此,该特定结构为电气设备提供优异的防水保护。 该电气设备可以安装在便于携带的带状结构中。 此外,本发明还提供了用于密封电气装置或电路板的至少一部分的方法,同时电气装置或电路板将密封有防水层。

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