公开(公告)号：US5222649A

公开(公告)日：1993-06-29

申请号：US973800

申请日：1992-11-09

Applicant: Joseph Funari ,  Ronald J. Moore

Inventor： Joseph Funari ,  Ronald J. Moore

IPC: B23K1/012 ,  H05K13/04

CPC classification number: B23K1/012 ,  H05K13/0465

Abstract: An apparatus for bonding a semiconductor device onto a substrate (e.g., a printed circuit board) such that solder elements on the device are connected, respectively, to circuit elements on the substrate. The solder elements are heated by passing hot gas onto an opposing surface of the device such that, by heat transference, the solder elements become partially molten to form the desired connections. Pressure is also applied onto the device during this formation to assure planarity at the connection sites. Following formation, cooling of the connections is accomplished. By directing heated gas onto only the semiconductor device and not onto the solder element-circuit member locations (and thus onto the substrate), direct semiconductor device bonding to lower melting point temperature substrates (e.g., those circuit boards containing fiberglass reinforced epoxy resin as a dielectric) may be achieved.

Abstract translation: 一种用于将半导体器件接合到衬底（例如印刷电路板）上的装置，使得器件上的焊料元件分别连接到衬底上的电路元件。 通过将热气体传递到装置的相对表面来加热焊料元件，使得通过热转移，焊料元件变得部分熔融以形成所需的连接。 在此形成过程中，也会在设备上施加压力，以确保连接部位的平坦度。 在形成之后，实现连接的冷却。 通过将加热的气体引导到仅半导体器件上而不是引导到焊料元件电路部件位置（并且因此引导到衬底上），将半导体器件直接接合到较低熔点温度的衬底（例如，包含玻璃纤维增​​强环氧树脂的那些电路板作为 电介质）。

公开(公告)号：US5211328A

公开(公告)日：1993-05-18

申请号：US886895

申请日：1992-05-22

Applicant: Joseph G. Ameen ,  Joseph Funari ,  Ronald J. Moore

Inventor： Joseph G. Ameen ,  Joseph Funari ,  Ronald J. Moore

IPC: H01L21/60 ,  B23K1/20 ,  B23K3/06 ,  H01L21/48 ,  H05K3/24 ,  H05K3/34

CPC classification number: B23K1/20 ,  B23K3/06 ,  H01L21/4853 ,  H05K3/3484 ,  B23K2201/40 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043

Abstract: A method of precisely depositing accurately defined quantities of solder onto high density circuit patterns on a substrate without use of a solder mask or the like wherein solder paste is originally deposited within a precisely defined transfer member (e.g., graphite block having holes drilled therein), the transfer member then being aligned relative to the respective circuitry such that when both block and substrate are heated, solder flow and deposition will occur without the use of a solder mask or the like. Following deposition, a second circuit member (e.g., flexible circuit) may be electrically coupled to the substrate's conductors, the deposited solder providing the coupling medium. Hydrogen gas may be used during the heating of the paste and also during the soldering of the flexible circuit to the substrate.

公开(公告)号：US5115964A

公开(公告)日：1992-05-26

申请号：US724276

申请日：1991-07-01

Applicant: Joseph G. Ameen ,  Joseph Funari ,  John A. Goldfuss, Jr.

Inventor： Joseph G. Ameen ,  Joseph Funari ,  John A. Goldfuss, Jr.

IPC: H01L23/538 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: H05K1/112 ,  H01L23/5387 ,  H05K3/3436 ,  H01L2224/16 ,  H01L2224/73253 ,  H05K1/189 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10681 ,  H05K2203/087 ,  H05K3/326 ,  H05K3/3494 ,  Y02P70/613

Abstract: A method of forming electrical connections between a flexible film carrier and an electronic device (e.g., semiconductor chip). The method comprises the steps of aligning the film carrier relative to the device having a plurality of solder mounds located on an upper surface thereof. The film carrier is engaged such that bridging portions of conductive leads thereof physically contact these solder mounds. Hot gas is passed through a screen member to heat the bridging portions of the leads to cause these leads to in turn heat the solder mounds to cause the mounds to become molten, whereafter these leads and mounds are cooled to form the desired solder bonds. The resulting structure may form part of an electronic package, this package also described herein.

Abstract translation: 在柔性膜载体和电子器件（例如，半导体芯片）之间形成电连接的方法。 该方法包括以下步骤：使膜载体相对于具有位于其上表面上的多个焊料堆的装置对准。 电影载体被接合，使得导电引线的桥接部分物理地接触这些焊接凹槽。 热气体通过筛构件以加热引线的桥接部分，从而使这些引导依次加热焊料块，使得土堆变得熔融，然后将这些引线和土堆冷却以形成所需的焊料接合。 所得到的结构可以形成电子封装的一部分，该封装也在本文中描述。

公开(公告)号：US5028984A

公开(公告)日：1991-07-02

申请号：US267406

申请日：1988-11-04

Applicant: Joseph G. Ameen ,  Joseph Funari ,  Bahgat G. Sammakia ,  David W. Sissenstein, Jr. ,  Samuel L. Smey

Inventor： Joseph G. Ameen ,  Joseph Funari ,  Bahgat G. Sammakia ,  David W. Sissenstein, Jr. ,  Samuel L. Smey

IPC: C08G59/00 ,  C08K3/22 ,  C08L63/00 ,  H01B3/40 ,  H01L21/58 ,  H01L23/10 ,  H01L23/373

CPC classification number: C08L63/00 ,  C08K3/22 ,  H01B3/40 ,  H01L23/10 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315

Abstract: A curable composition containing an epoxide component and zinc oxide and use thereof.

公开(公告)号：US4171477A

公开(公告)日：1979-10-16

申请号：US751919

申请日：1976-12-17

Applicant: Joseph Funari

Inventor： Joseph Funari

IPC: B23K11/00 ,  B23K20/00 ,  H01L21/60

CPC classification number: H01L24/85 ,  B23K20/005 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85099 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85238 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043

Abstract: This invention relates to a method and apparatus for wire bonding a variety of metals in the interconnection of semiconductor chips to electronic package substrate circuitries. A pair of electrically conducting bonding tip members are provided which are electrically isolated from one another and which are constructed of a material having a high resistivity. The wire is positioned beneath the tip members and a load is applied to the members to force the wire against a land on the substrate. A voltage source is provided to apply a voltage between the tip members. Activitation of the voltage source results in current flow through the tips and through the wire, in series, causing heating of the tip members and of the section of wire beneath them. Diffusion bonding will initiate before a significant amount of oxidation has had time to occur.

Abstract translation: 本发明涉及用于将半导体芯片的互连中的各种金属引线接合到电子封装衬底电路的方法和装置。 提供了一对导电的接合尖端构件，它们彼此电隔离并且由具有高电阻率的材料构成。 电线定位在尖端部件的下方，并且负载施加到部件上以迫使电线抵靠衬底上的焊盘。 提供电压源以在尖端构件之间施加电压。 电压源的激活导致电流流过尖端并通过导线串联，导致尖端构件和其下面的导线部分的加热。 在显着量的氧化发生之前，扩散键将开始。

公开(公告)号：US5203075A

公开(公告)日：1993-04-20

申请号：US743970

申请日：1991-08-12

Applicant: Christopher G. Angulas ,  Patrick T. Flynn ,  Joseph Funari ,  Thomas E. Kindl ,  Randy L. Orr

Inventor： Christopher G. Angulas ,  Patrick T. Flynn ,  Joseph Funari ,  Thomas E. Kindl ,  Randy L. Orr

IPC: H01L23/498 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L23/4985 ,  H01L23/49816 ,  H01R12/52 ,  H05K3/363 ,  H01L2224/13021 ,  H01L2224/16 ,  H01L2924/01012 ,  H01L2924/01077 ,  H01L2924/01078 ,  H05K1/141 ,  H05K2201/0394 ,  H05K2201/10477 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K3/3452 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144

Abstract: A method of bonding a flexible circuitized substrate to a circuitized substrate (e.g., printed circuit board) to interconnect selected circuitry of both substrates using solder. Solder paste is applied over conductive pads on the circuitized substrate and organic dewetting material (e.g., epoxy coating) adjacent thereto. The flexible substrate, having conductors located within and/or traversing an aperture in the flexible substrate's dielectric, is positioned above the solder paste and heat is applied (e.g., in an oven). The paste, dewetting from the organic material, "balls up" and substantially surrounds a solder member (ball) attached to a bridging portion of the flexible substrate's conductor, thereby connecting both substrates. A frame member may be used to align the flexible substrate, both during solder member attachment thereto, as well as for aligning the flexible substrate having solder members attached, to the respective solder paste locations on the lower substrate.

Abstract translation: 一种将柔性电路化基板接合到电路化基板（例如印刷电路板）上以使用焊料互连两个基板的选定电路的方法。 将焊膏施加在电路化基板上的导电焊盘和与其相邻的有机润湿材料（例如环氧涂层）上。 柔性基板具有位于柔性基板的电介质内和/或穿过柔性基板的电介质中的孔的导体，位于焊膏上方，并且加热（例如，在烘箱中）。 该糊状物从有机材料中去湿，“起球”并且基本上包围附着在柔性基底导体的桥接部分上的焊料部件（球），从而连接两个基片。 可以使用框架构件，以在焊料构件附接到其之间以及将具有焊接构件的柔性基板与所述下基板上的相应焊膏位置对准时对准柔性基板。

公开(公告)号：US4434134A

公开(公告)日：1984-02-28

申请号：US252748

申请日：1981-04-10

Applicant: Russell E. Darrow ,  Joseph Funari ,  George S. Kotrch ,  George C. Phillips

Inventor： Russell E. Darrow ,  Joseph Funari ,  George S. Kotrch ,  George C. Phillips

IPC: H05K3/40 ,  H01L23/12 ,  H01L23/15 ,  H01L23/50 ,  H01R43/20 ,  H05K3/24 ,  H05K13/04 ,  B22F3/00

CPC classification number: H05K13/04 ,  H05K3/245 ,  H05K1/092 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K3/4007 ,  H05K3/4061 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49153 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T29/49206 ,  Y10T29/49222

Abstract: Ceramic substrates are pinned using powdered metallurgy pins formed in situ on the substrate.

Abstract translation: 使用在基材上原位形成的粉末状冶金销将陶瓷基板钉扎。

公开(公告)号：US5744759A

公开(公告)日：1998-04-28

申请号：US655363

申请日：1996-05-29

Applicant: Joseph George Ameen ,  Joseph Funari ,  Michael John Funari

Inventor： Joseph George Ameen ,  Joseph Funari ,  Michael John Funari

IPC: H01R4/02 ,  H01R12/79 ,  H01R13/24 ,  H05K3/32 ,  H05K3/36 ,  H05K3/40 ,  H05K1/16

CPC classification number: H05K3/4015 ,  H01R12/79 ,  H01R4/02 ,  H05K3/326 ,  H05K3/365 ,  H01L2224/81191 ,  H01L2224/81899 ,  H01L2924/01327 ,  H01R13/24

Abstract: The present invention relates to a circuitized board having removable flexible modules disposed thereon. The flexible modules are mechanically and electrically connected to the board to provide an apertured connect, yet may be easily removed without using heat. The invention also relates to a circuit package including a substrate and a flexible module. The substrate includes a circuit board, a plurality of pads affixed to the circuit board, and a plurality of gold plated metal balls affixed atop the pads. The flexible module includes a flexible dielectric member and gold plated vias disposed in the flexible dielectric member wherein at least some of the vias are positioned over the metal balls so that a line contact is made between the vias and the metal balls.

Abstract translation: 本发明涉及一种具有可拆卸的柔性模块的电路板。 柔性模块机械地和电连接到板上以提供有孔连接，但是可以容易地在不使用热的情况下去除。 本发明还涉及一种包括衬底和柔性模块的电路封装。 基板包括电路板，固定到电路板的多个焊盘以及固定在焊盘上方的多个镀金属球。 柔性模块包括设置在柔性电介质构件中的柔性介电构件和镀金通孔，其中至少一些通孔位于金属球上方，使得在通孔和金属球之间形成线接触。

公开(公告)号：US4849856A

公开(公告)日：1989-07-18

申请号：US218726

申请日：1988-07-13

Applicant: Joseph Funari ,  Mary C. Green ,  Scott D. Reynolds ,  Bahgat G. Sammakia

Inventor： Joseph Funari ,  Mary C. Green ,  Scott D. Reynolds ,  Bahgat G. Sammakia

IPC: H01L23/34 ,  H01L23/367 ,  H01R12/57

CPC classification number: H01L23/3675 ,  H01L2924/0002

Abstract: An electronic package including a first substrate (e.g., printed circuit board), a semiconductor device (e.g., silicon chip), a second circuitized substrate (e.g. polyimide having chrome-copper chrome circuitry thereon) and a heat sink (e.g., extruded aluminum or copper). The heat sink includes pliant members (e.g., pliable leg members) secured thereto or forming part thereof such that the heat sink can be downwardly depressed a predetermined distance to effect contact with the semiconductor device without causing damage thereto. Such downward depression facilitates assembly of the package.

公开(公告)号：US4294729A

公开(公告)日：1981-10-13

申请号：US104623

申请日：1979-12-17

Applicant: Peter Bakos ,  Russell E. Darrow ,  Joseph Funari ,  Richard M. Poliak

Inventor： Peter Bakos ,  Russell E. Darrow ,  Joseph Funari ,  Richard M. Poliak

IPC: C11D7/50 ,  C09D9/00 ,  H05K3/28 ,  C09D9/04 ,  C11D3/43 ,  C11D3/44

CPC classification number: C09D9/005 ,  H05K3/288

Abstract: Cured epoxy compositions are removed from substrates by employing compositions containing an organic cyclic alcohol and a surface-active agent.

Abstract translation: 通过使用含有机环状醇和表面活性剂的组合物从底物中除去固化的环氧组合物。