公开(公告)号：US4788767A

公开(公告)日：1988-12-06

申请号：US24491

申请日：1987-03-11

Applicant: Kishor V. Desai ,  Kohn Harold

Inventor： Kishor V. Desai ,  Kohn Harold

IPC: H01L23/50 ,  H01L21/98 ,  H01L23/32 ,  H01L23/498 ,  H01L23/538 ,  H01R43/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01L25/50 ,  H01L23/4985 ,  H01L23/5385 ,  H05K3/3436 ,  H05K3/363 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/207 ,  H01L2924/30107 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10704 ,  H05K2203/0415 ,  H05K2203/0769 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package, such that the flexible film of the carrier is supported substantially in a plane above the surface of the second level electronic package. The method comprises positioning preformed spacers embedded in a dissolvable polysulfone foam holder between the outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding (matching) bonding pads on the second level electronic package. Each of the preformed spacers may comprise, for example, a solder cylinder with a copper core. The preformed spacers may be bonded to the outer lead bonding pads on the chip carrier, and to the matching bonding pads on the second level electronic package, by reflowing the solder of the spacers using, for example, a conventional solder reflow oven. Then, the holder is dissolved, and washed away, in a conventional vapor degreaser using, for example, methylene chloride, to leave the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired.

公开(公告)号：US2470495A

公开(公告)日：1949-05-17

申请号：US69686246

申请日：1946-09-13

Applicant: KOHN HAROLD B ,  MORRIS SCHNEIDERMAN

Inventor： KOHN HAROLD B ,  MORRIS SCHNEIDERMAN

IPC: G06G1/14

CPC classification number: G06G1/14