公开(公告)号：US08319116B2

公开(公告)日：2012-11-27

申请号：US12557630

申请日：2009-09-11

Applicant: Jorge Eduardo Martinez-Vargas ,  Lien-Fen (Livia) Hu ,  Samuel Ming Sien Lee ,  James David Britton ,  Martin John Henson

Inventor： Jorge Eduardo Martinez-Vargas ,  Lien-Fen (Livia) Hu ,  Samuel Ming Sien Lee ,  James David Britton ,  Martin John Henson

IPC: H05K1/11

CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09627 ,  H05K2201/09781 ,  Y10T29/49124 ,  Y10T29/49142

Abstract: Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB.

Abstract translation: 本文描述了用于在PCB中提供机械加强电镀通孔（PTH）的系统和方法，其有利地允许改进的焊接能力和可靠性。 通过提供围绕PTH的一个或多个通孔来提供PTH与PCB的内部和底部导电层之间的电连接来减少PTH的散热效应来实现这种系统和方法。 在这方面，PTH与至少一个内部导电层（例如，接地层或功率层）间隔开，因此降低了散热效果。 该特征使得熔融焊料在冷冻之前基本上填充整个PTH，从而改善电气部件和PCB之间的机械和电连接。 在内部导电层中提供一个或多个电 - 非功能性焊盘（或肋加强件）以机械地支撑PCB的壁。 这些肋加强件可以改善PTH的机械强度，而不影响电气性能，并且不影响将部件焊接到PCB的能力。

公开(公告)号：US20110061233A1

公开(公告)日：2011-03-17

申请号：US12557630

申请日：2009-09-11

Applicant: Jorge Eduardo Martinez-Vargas ,  Lien-Fen(Livia) Hu ,  Samuel Ming Sien Lee ,  James David Britton ,  Martin John Henson

Inventor： Jorge Eduardo Martinez-Vargas ,  Lien-Fen(Livia) Hu ,  Samuel Ming Sien Lee ,  James David Britton ,  Martin John Henson

IPC: H05K3/34 ,  H05K1/11

CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/09627 ,  H05K2201/09781 ,  Y10T29/49124 ,  Y10T29/49142

Abstract: Systems and methods for providing mechanically reinforced plated through-holes (PTH) in PCBs, which advantageously allow improved soldering capabilities and reliability, are described herein. Such systems and methods are achieved by reducing the heat sinking effects of PTHs by providing one or more vias surrounding the PTHs to provide an electrical connection between the PTH and the internal and bottom conductive layers of a PCB. In this regard, the PTHs are spaced apart from at least one of the internal conductive layers (e.g., ground or power layers), so the heat sinking effects are reduced. This feature enables molten solder to substantially fill the entire PTH before freezing, thereby improving the mechanical and electrical connection between an electrical component and the PCB. One or more electrically-nonfunctional lands (or “rib reinforcements”) are provided in internal conductive layers to mechanically support the walls of the PCB. These rib reinforcements improve the mechanical strength of the PTHs without affecting the electrical performance and without impacting the ability to solder components to the PCB.

Abstract translation: 本文描述了用于在PCB中提供机械加强电镀通孔（PTH）的系统和方法，其有利地允许改进的焊接能力和可靠性。 通过提供围绕PTH的一个或多个通孔来提供PTH与PCB的内部和底部导电层之间的电连接来减少PTH的散热效应来实现这种系统和方法。 在这方面，PTH与至少一个内部导电层（例如，接地层或功率层）间隔开，因此降低了散热效果。 该特征使得熔融焊料在冷冻之前基本上填充整个PTH，从而改善电气部件和PCB之间的机械和电连接。 在内部导电层中提供一个或多个电 - 非功能焊盘（或“肋加强件”）以机械地支撑PCB的壁。 这些肋加强件可以改善PTH的机械强度，而不影响电气性能，并且不影响将部件焊接到PCB的能力。