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公开(公告)号：US08629416B2
公开(公告)日：2014-01-14
申请号：US13449773
申请日：2012-04-18
Applicant: Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
Inventor： Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
IPC: G21G5/00
CPC classification number: G21G5/00 , B23K26/0624 , B23K26/0661 , B23K26/18 , B23K2101/40 , B23K2101/42 , G03F7/70383 , H01J37/228 , H01J2237/31749
Abstract: An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Abstract translation: 一种改进的衬底微加工方法。 本发明的优选实施例提供了利用带电粒子束掩蔽和激光烧蚀的改进方法。 使用带电粒子束掩模制造和超短脉冲激光烧蚀的优点的组合来显着地减少基板处理时间，并且提高通过激光烧蚀加工的特征的横向分辨率和纵横比，优选小于加工激光器的衍射极限。
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公开(公告)号：US20120199738A1
公开(公告)日：2012-08-09
申请号：US13449537
申请日：2012-04-18
Applicant: ROBERT GERLACH , Mostafa Maazouz , Trevor Dingle , Mark Utlaut , James McGinn
Inventor： ROBERT GERLACH , Mostafa Maazouz , Trevor Dingle , Mark Utlaut , James McGinn
IPC: H01J37/26
CPC classification number: H01J37/244 , H01J37/28 , H01J2237/2443 , H01J2237/24435 , H01J2237/2445 , H01J2237/2448 , H01J2237/26
Abstract: A secondary particle detector 302 for a charged particle beam system 300 includes a scintillator 304 and a transducer 312, such as a photomultiplier tube, positioned within a vacuum chamber 107. Unlike prior art Everhart-Thornley detectors, the photomultiplier is positioned within the vacuum chamber, which improves detection by eliminating optical couplings and provides flexibility in positioning the detector.
Abstract translation: 用于带电粒子束系统300的二次粒子检测器302包括闪烁体304和位于真空室107内的诸如光电倍增管的换能器312.与现有技术的Everhart-Thornley检测器不同，光电倍增器位于真空室内 ，其通过消除光耦合来改进检测并提供灵敏度来定位检测器。
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公开(公告)号：US20110115129A1
公开(公告)日：2011-05-19
申请号：US13003450
申请日：2009-07-09
Applicant: Marcus Straw , Amin Samsavar , Milos Toth , Mark Utlaut
Inventor： Marcus Straw , Amin Samsavar , Milos Toth , Mark Utlaut
CPC classification number: B23K26/03 , B23K26/0622 , B23K26/0853 , B23K26/14 , B23K26/1423 , B23K26/348 , H01J2237/2813
Abstract: A charged particle beam and a laser beam are used together to micromachine a substrate. A first beam alters the state of a region of the work piece, and the second beam removes material whose state was altered. In one embodiment, an ion beam can create photon absorbing defects to lower the local ablation threshold, allowing the laser beam to remove material in a region defined by the ion beam. The combination of laser beam and charged particle beam allows the creation of features similar in size to the charged particle beam spot size, at milling rates greater than charged particle processing because of the increased energy provided by the laser beam.
Abstract translation: 带电粒子束和激光束一起用于微机械衬底。 第一光束改变工件的区域的状态，第二光束去除状态被改变的材料。 在一个实施例中，离子束可以产生光子吸收缺陷以降低局部消融阈值，允许激光束去除由离子束限定的区域中的材料。 激光束和带电粒子束的组合允许在大小与带电粒子束点尺寸相似的特征的情况下产生大于带电粒子处理的铣削速率，因为激光束提供的能量增加。
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公开(公告)号：US20100127190A1
公开(公告)日：2010-05-27
申请号：US12324296
申请日：2008-11-26
Applicant: MARCUS STRAW , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
Inventor： MARCUS STRAW , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
CPC classification number: G21G5/00 , B23K26/0624 , B23K26/0661 , B23K26/18 , B23K2101/40 , B23K2101/42 , G03F7/70383 , H01J37/228 , H01J2237/31749
Abstract: An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Abstract translation: 一种改进的衬底微加工方法。 本发明的优选实施例提供了利用带电粒子束掩蔽和激光烧蚀的改进方法。 使用带电粒子束掩模制造和超短脉冲激光烧蚀的优点的组合来显着地减少基板处理时间，并且提高通过激光烧蚀加工的特征的横向分辨率和纵横比，优选小于加工激光器的衍射极限。
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公开(公告)号：US08168961B2
公开(公告)日：2012-05-01
申请号：US12324296
申请日：2008-11-26
Applicant: Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
Inventor： Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
IPC: G21G5/00
CPC classification number: G21G5/00 , B23K26/0624 , B23K26/0661 , B23K26/18 , B23K2101/40 , B23K2101/42 , G03F7/70383 , H01J37/228 , H01J2237/31749
Abstract: An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Abstract translation: 一种改进的衬底微加工方法。 本发明的优选实施例提供了利用带电粒子束掩蔽和激光烧蚀的改进方法。 使用带电粒子束掩模制造和超短脉冲激光烧蚀的优点的组合来显着地减少基板处理时间，并且提高通过激光烧蚀加工的特征的横向分辨率和纵横比，优选小于加工激光器的衍射极限。
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Patent Agency Ranking
公开(公告)号：US08853592B2
公开(公告)日：2014-10-07
申请号：US13003450
申请日：2009-07-09
Applicant: Marcus Straw , Amin Samsavar , Milos Toth , Mark Utlaut
Inventor： Marcus Straw , Amin Samsavar , Milos Toth , Mark Utlaut
CPC classification number: B23K26/03 , B23K26/0622 , B23K26/0853 , B23K26/14 , B23K26/1423 , B23K26/348 , H01J2237/2813
Abstract: A charged particle beam and a laser beam are used together to micromachine a substrate. A first beam alters the state of a region of the work piece, and the second beam removes material whose state was altered. In one embodiment, an ion beam can create photon absorbing defects to lower the local ablation threshold, allowing the laser beam to remove material in a region defined by the ion beam. The combination of laser beam and charged particle beam allows the creation of features similar in size to the charged particle beam spot size, at milling rates greater than charged particle processing because of the increased energy provided by the laser beam.
Abstract translation: 带电粒子束和激光束一起用于微机械衬底。 第一光束改变工件的区域的状态，第二光束去除状态被改变的材料。 在一个实施例中，离子束可以产生光子吸收缺陷以降低局部消融阈值，允许激光束去除由离子束限定的区域中的材料。 激光束和带电粒子束的组合允许在大小与带电粒子束点尺寸相似的特征的情况下产生大于带电粒子处理的铣削速率，因为激光束提供的能量增加。
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公开(公告)号：US06414307B1
公开(公告)日：2002-07-02
申请号：US09350718
申请日：1999-07-09
Applicant: Robert L. Gerlach , Locke Christman , Mark Utlaut
Inventor： Robert L. Gerlach , Locke Christman , Mark Utlaut
IPC: G01N23225
CPC classification number: G01N23/225 , H01J37/256 , H01J2237/2527 , H01J2237/31744 , Y10S977/843 , Y10S977/881 , Y10S977/891 , Y10S977/895 , Y10S977/949
Abstract: The sensitivity of a secondary ion mass spectrometer (SIMS) is increased by using water vapor to enhance the yield of positive secondary ions sputtered by a primary focused ion beam. Water vapor is injected through a needle that is positioned close to the sample and electrically biased to reduce interference with secondary ion collection field. The sensitivity is enhanced for metals in particular, which tend to be sputtered as positive ions.
Abstract translation: 通过使用水蒸气来提高二次离子质谱仪（SIMS）的灵敏度，以提高主要聚焦离子束溅射的正二次离子的产率。 水蒸汽通过位于样品附近的针进行注入，并被电偏置以减少与二次离子收集场的干扰。 特别是金属的灵敏度得到提高，其倾向于作为正离子溅射。
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公开(公告)号：US20120200007A1
公开(公告)日：2012-08-09
申请号：US13449773
申请日：2012-04-18
Applicant: Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
Inventor： Marcus Straw , Milos Toth , Steven Randolph , Michael Lysaght , Mark Utlaut
IPC: B29C59/16
CPC classification number: G21G5/00 , B23K26/0624 , B23K26/0661 , B23K26/18 , B23K2101/40 , B23K2101/42 , G03F7/70383 , H01J37/228 , H01J2237/31749
Abstract: An improved method for substrate micromachining. Preferred embodiments of the present invention provide improved methods for the utilization of charged particle beam masking and laser ablation. A combination of the advantages of charged particle beam mask fabrication and ultra short pulse laser ablation are used to significantly reduce substrate processing time and improve lateral resolution and aspect ratio of features machined by laser ablation to preferably smaller than the diffraction limit of the machining laser.
Abstract translation: 一种改进的衬底微加工方法。 本发明的优选实施例提供了利用带电粒子束掩蔽和激光烧蚀的改进方法。 使用带电粒子束掩模制造和超短脉冲激光烧蚀的优点的组合来显着地减少基板处理时间，并且提高通过激光烧蚀加工的特征的横向分辨率和纵横比，优选小于加工激光器的衍射极限。
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公开(公告)号：US20120103945A1
公开(公告)日：2012-05-03
申请号：US13003513
申请日：2009-07-08
Applicant: Marcus Straw , David H. Narum , Milos Toth , Mark Utlaut , Guido Knippels , Gerardus Nicolaas Van Veen
Inventor： Marcus Straw , David H. Narum , Milos Toth , Mark Utlaut , Guido Knippels , Gerardus Nicolaas Van Veen
CPC classification number: B23K26/03 , B23K26/0622 , B23K26/0853 , B23K26/14 , B23K26/1423 , B23K26/348 , H01J2237/2813
Abstract: Laser processing is enhanced by using endpointing or by using a charged particle beam together with a laser. End-pointing uses emissions, such as photons, electrons, ions, or neutral particles, from the substrate to determine when the material under the laser has changed or is about to change. Material removed from the sample can be deflected to avoid deposition onto the laser optics.
Abstract translation: 激光加工通过使用终点或通过与激光一起使用带电粒子束来增强。 端点使用来自衬底的发射，例如光子，电子，离子或中性粒子，以确定激光下的材料何时已经改变或将要改变。 从样品中除去的材料可以偏转，以避免沉积到激光光学器件上。
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公开(公告)号：US08164059B2
公开(公告)日：2012-04-24
申请号：US12141723
申请日：2008-06-18
Applicant: Robert Gerlach , Mostafa Maazouz , Trevor Dingle , Mark Utlaut , James McGinn
Inventor： Robert Gerlach , Mostafa Maazouz , Trevor Dingle , Mark Utlaut , James McGinn
IPC: H01J37/244 , H01J37/256 , H01J37/28
CPC classification number: H01J37/244 , H01J37/28 , H01J2237/2443 , H01J2237/24435 , H01J2237/2445 , H01J2237/2448 , H01J2237/26
Abstract: A secondary particle detector 302 for a charged particle beam system 300 includes a scintillator 304 and a transducer 312, such as a photomultiplier tube, positioned within a vacuum chamber 107. Unlike prior art Everhart-Thornley detectors, the photomultiplier is positioned within the vacuum chamber, which improves detection by eliminating optical couplings and provides flexibility in positioning the detector.
Abstract translation: 用于带电粒子束系统300的二次粒子检测器302包括闪烁体304和位于真空室107内的诸如光电倍增管的换能器312.与现有技术的Everhart-Thornley检测器不同，光电倍增器位于真空室内 ，其通过消除光耦合来改进检测并提供灵敏度来定位检测器。
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